JP2011096658A - Light emitting diode lamp - Google Patents

Light emitting diode lamp Download PDF

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Publication number
JP2011096658A
JP2011096658A JP2010235499A JP2010235499A JP2011096658A JP 2011096658 A JP2011096658 A JP 2011096658A JP 2010235499 A JP2010235499 A JP 2010235499A JP 2010235499 A JP2010235499 A JP 2010235499A JP 2011096658 A JP2011096658 A JP 2011096658A
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JP
Japan
Prior art keywords
hole
emitting diode
heat
device
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010235499A
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Japanese (ja)
Inventor
Chih-Ming Lai
Yu-Pin Liu
育彬 劉
志銘 頼
Original Assignee
Foxsemicon Integrated Technology Inc
沛▲きん▼能源科技股▲ふん▼有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN2009103092150A priority Critical patent/CN102052590A/en
Application filed by Foxsemicon Integrated Technology Inc, 沛▲きん▼能源科技股▲ふん▼有限公司 filed Critical Foxsemicon Integrated Technology Inc
Publication of JP2011096658A publication Critical patent/JP2011096658A/en
Application status is Pending legal-status Critical

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting diode lamp that is superior in efficiency of heat dissipation and facilitates assembling and replacing. <P>SOLUTION: The light emitting diode lamp includes a light emitting diode light source which includes a substrate, a light emitting diode installed on a surface of the substrate, and a first heat sink thermally connected to the other surface opposed to the surface on which the light emitting diode is installed in the substrate to release the heat generated by the light emitting diode and transferred to the substrate; and a lamp holder which includes the second heat sink and a fixing device detachably fixed to the second heat sink so as to thermally connect the first radiation device. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a light emitting diode lamp.

  Currently, light emitting diodes (LEDs) are widely applied in various areas, and particularly in the area of illumination lamps.

  Due to the longer working time of the light emitting diode lamp, the amount of heat generated increases, and when the temperature of the light emitting diode reaches a certain level, the quantum effect inside the light emitting diode is reduced and the life of the light emitting diode is greatly increased. Shortened. Moreover, it is difficult to replace the light emitting diode when it is damaged.

  In order to solve the above-described problems, an object of the present invention is to provide a light-emitting diode lamp that has excellent heat dissipation efficiency and is easy to assemble and replace.

  The light-emitting diode lamp according to the present invention includes a substrate, a light-emitting diode installed on the surface of the substrate, and another surface of the substrate facing the surface where the light-emitting diode is installed and is thermally connected to the light-emitting diode lamp. A light emitting diode light source including a first heat radiating device that radiates heat transferred to the substrate by generating a diode, the second heat radiating device, and the second heat radiating device so as to thermally connect the first heat radiating device. And a lamp holder including a fixing device that is detachably fixed.

  Compared with the prior art, the light emitting diode lamp according to the present invention transmits the amount of heat generated by the light emitting diode to the second heat radiating device of the lamp holder by the first heat radiating device and then radiates heat by the lamp holder. Excellent effect. Since the first heat dissipation device is detachably attached to the second heat dissipation device, it is convenient to assemble and replace the light source of the light emitting diode.

It is a figure which shows the structure of the light emitting diode lamp which concerns on the 1st Example of this invention. FIG. 2 is an exploded view of the light emitting diode lamp shown in FIG. 1. It is a figure which shows the structure of the light emitting diode lamp which concerns on the 2nd Example of this invention. FIG. 4 is an exploded view of the light emitting diode lamp shown in FIG. 3. It is a figure which shows the structure of the light emitting diode lamp which concerns on the 3rd Example of this invention. FIG. 6 is an exploded view of the light emitting diode lamp shown in FIG. 5. It is a figure which shows the other structure of the fixing device of the light emitting diode lamp shown in FIG.

  Embodiments of the present invention will be described below with reference to the drawings.

  Referring to FIGS. 1 and 2, a light emitting diode lamp 10 according to a first embodiment of the present invention includes a light emitting diode light source 11 and a lamp holder 12.

  The light emitting diode light source 11 includes a substrate 110, a light emitting diode 112, and a first heat dissipation device 114.

  The board 110 supports the light emitting diode 112 as a printed electric circuit board and supplies power to the light emitting diode 112. In this embodiment, the substrate 110 has a flat plate shape.

  One or a plurality of the light emitting diodes 112 may be provided and installed on the surface of the substrate 110. In this embodiment, the substrate 110 is provided with a plurality of light emitting diodes 112.

  The first heat dissipation device 114 is installed on another flat surface opposite to the surface of the substrate 110 where the light emitting diode 112 is installed, and is thermally connected to the substrate 110 to generate the light emitting diode 112. The heat transferred to the substrate 110 is dissipated. The first heat dissipation device 114 is made of a high thermal conductivity material such as a metal such as aluminum, gold, silver, copper, steel, or an alloy thereof. In the present embodiment, the first heat radiating device 114 has a “ten” shape, and the heat radiation coefficient of the first heat radiating device 114 is set to 0.8 or more in order to ensure the heat radiation efficiency.

  The lamp holder 12 includes a second heat radiating device 120 and a fixing device 122.

  The second heat dissipation device 120 is made of a heat conductive material. The material selection range of the second heat dissipation device 120 is the same as the material selection range of the first heat dissipation device 114. In the present embodiment, the second heat radiating device 120 has an arch shape and has a large heat radiating area, so that heat can be radiated quickly.

  The fixing device 122 is fixed to the second heat radiating device 120 or molded integrally with the second heat radiating device 120. The fixing device 122 houses the first heat dissipation device 114 and fixes the first heat dissipation device 114 to the second heat dissipation device 120 of the lamp holder 12. The fixing device 122 is made of a heat conductive material, and the heat radiation coefficient of the fixing device 122 is set to 0.8 or more in order to ensure heat radiation efficiency. In this embodiment, the fixing device 122 is a frame having a support portion corresponding to the shape of the first “ten” -shaped first heat radiating device 114, and is made of an elastic material (for example, a bullet) having excellent thermal conductivity. Become.

  Further, the shapes of the first heat radiating device 114 and the fixing device 122 are not limited to the “ten” shape. For example, both can have other shapes corresponding to each other.

  In the assembly process of the light emitting diode lamp 10, the first heat dissipation device 114 is firmly stored in the fixing device 122, so that a fixing method such as screws, rivets, or welding is not necessary, so that the assembly process is simplified. Become. In addition, since the first heat dissipation device 114 transmits the amount of heat to the second heat dissipation device 120 by the fixing device 122, the amount of heat generated by the light emitting diode 112 is quickly dissipated to the outside world, and the light emitting diode 112 It can be ensured to operate in a low temperature environment.

  In the process of replacing the light source, when the first heat radiating device 114 of the damaged light emitting diode light source 11 is taken out from the fixing device 122, the fixing device 122 is restored to its original shape by its own elastic force. Next, when the first heat radiating device 114 of the new light emitting diode light source 11 is housed in the fixing device 122, the first heat radiating device 114 of the new light emitting diode light source 11 is moved to the fixing device 122 by the elastic force of the fixing device 122. It is firmly fixed and forms an excellent thermal connection with the second heat dissipation device 120.

  Referring to FIGS. 3 and 4, the light emitting diode lamp 20 according to the second embodiment of the present invention includes a light emitting diode light source 21 and a lamp holder 22.

  The light emitting diode light source 21 includes a substrate 210, a light emitting diode 212, and a first heat dissipation device 214.

  The board 210 supports the light emitting diode 212 as a printed electric circuit board and supplies power to the light emitting diode 212. In this embodiment, the substrate 210 has a flat plate shape.

  The light emitting diode 212 may be one or plural. In addition, it is installed on the surface of the substrate 210. In this embodiment, a plurality of light emitting diodes 212 are installed on the substrate 210.

  The first heat dissipation device 214 is installed on another flat surface of the substrate 210 opposite to the surface on which the light emitting diode 212 is installed, and is thermally connected to the substrate 210 to generate the light emitting diode 212. The heat transferred to the substrate 210 is dissipated. The first heat radiation device 214 is formed with a plurality of heat radiation fins 2140 extending in a direction away from the substrate 210. The first heat dissipation device 214 is made of a high thermal conductivity material such as a metal such as aluminum, gold, silver, copper, steel, or an alloy thereof. In this embodiment, in order to ensure heat radiation efficiency, the thermal radiation coefficient of the first heat radiation device 214 is set to 0.8 or more.

  The lamp holder 22 includes a main body 220, a second heat radiating device 222, and a fixing device 224.

  The main body 220 supports the second heat dissipation device 222. The main body 220 may be a housing of the lamp holder 22. In the present embodiment, the main body 220 has a flat plate shape, but is not limited to the shape shown in FIGS. 3 and 4.

  The second heat dissipation device 222 is made of a heat conductive material. The material selection range of the second heat dissipation device 222 is the same as the material selection range of the first heat dissipation device 214. The second heat radiating device 222 is formed with a plurality of heat radiating fins 2220 extending in a direction away from the main body 220. The plurality of heat radiating fins 2140 and the plurality of heat radiating fins 2220 are extended in directions facing each other.

  The fixing device 224 is a clamping component, and after the heat radiation fin 2140 of the first heat radiation device 214 and the heat radiation fin 2220 of the second heat radiation device 222 are connected in a superimposed manner, the heat radiation fin 2140 and the heat radiation fin 2220 To fix.

  In the present embodiment, the fixing device 224 is a substantially “几” -shaped sandwiching part formed by bending an elastic material having excellent thermal conductivity. The fixing device 224 includes a connecting portion 2240 and two sandwiching arms 2242 and 2244 formed by bending and extending from both ends of the connecting portion 240. The ends of the two sandwiching arms 2242 and 2244 that are away from the connecting portion 240 are isolated from each other, and the portion between the ends of the two sandwiching arms 2242 and 2244 and the connecting portion 2240 is It is in contact with the elastic isolation.

  In the process of assembling the light emitting diode lamp 20, the plurality of heat radiation fins 2140 of the first heat radiation device 214 and the plurality of heat radiation fins 2220 of the second heat radiation device 222 are superposed and joined one by one, The radiating fins 2140 and the radiating fins 2220 that are superposed and joined using the “几” -shaped sandwiching component as the fixing device 224 are fixed one by one. Since the use of the “几” -shaped clamping part is convenient, the assembly process is simplified. The heat radiation fins 2140 of the first heat radiation device 214 and the heat radiation fins 2220 of the second heat radiation device 222 are joined to form a heat connection, so that the heat generated by the light emitting diode 212 can be quickly dissipated to the outside world. Thus, it is possible to ensure that the light emitting diode 212 operates in a low temperature environment.

  In the process of replacing the light source, if the “几” -shaped sandwiching part is removed, the first heat radiation device 214 of the damaged light-emitting diode light source 21 and the second heat radiation device 222 of the lamp holder 22 are separated. Next, as in the assembly process described above, a new light-emitting diode light source 21 is fixed to the second heat dissipation device 222 to form a thermal connection between the first heat dissipation device 214 and the second heat dissipation device 222.

  In another embodiment, the shape of the fixing device 224 is not limited to the “几” shape, but the two pieces of parts (that is, the heat dissipating fins 2140 and the second heat dissipating fins 2140 of the first heat dissipating device 214). Any other shape may be used as long as the heat dissipating fins 2220) of the heat dissipating device 222 can be sandwiched.

  Referring to FIGS. 5 and 6, the light emitting diode lamp 30 according to the third embodiment of the present invention includes a light emitting diode light source 31 and a lamp holder 32.

  The light emitting diode light source 31 includes a substrate 310, a light emitting diode 312, and a first heat dissipation device 314.

  The board 310 supports the light emitting diode 312 as a printed electric circuit board and supplies power to the light emitting diode 312. In this embodiment, the substrate 310 has a flat plate shape.

  One or a plurality of the light emitting diodes 312 may be provided and installed on the surface of the substrate 310. In this embodiment, a plurality of light emitting diodes 312 are installed on the substrate 310.

  The first heat dissipating device 314 is installed on the other flat surface of the substrate 310 facing the surface away from the light emitting diode 312 and is thermally connected to the substrate 310 to generate the light emitting diode 312. The heat transferred to the substrate 310 is dissipated. The first heat dissipation device 314 has a flat plate shape and is made of a metal having high thermal conductivity such as aluminum, gold, silver, copper, steel, or an alloy thereof. In this embodiment, in order to ensure heat radiation efficiency, the thermal radiation coefficient of the first heat radiation device 314 is set to 0.8 or more. The first heat dissipation device 314 includes a heat dissipation surface 3140 that is separated from the substrate 310. The heat radiating surface 3140 has at least one through hole 3142 that penetrates the first heat radiating device 314 and the substrate 310 and has a uniform size.

  The lamp holder 32 includes a main body 320, a second heat radiating device 322, and a fixing device 324.

  The main body 320 supports the second heat dissipation device 322. The main body 320 may be a housing of the lamp holder 32. In the present embodiment, the main body 320 has a flat plate shape, but is not limited to the shape shown in FIGS. 5 and 6.

  The second heat dissipation device 322 is made of a heat conductive material. The material selection range of the second heat dissipation device 322 is the same as the material selection range of the first heat dissipation device 314. In the present embodiment, the second heat radiating device 322 is installed on a flat surface of the main body 320, and the second heat radiating device 322 is horizontally disposed on the housing portion 3220 that is recessed into the main body 320 and the side wall of the housing portion 3220. A plurality of heat radiating fins 3222 formed by being stretched are provided.

  The shape and size of the accommodating portion 3220 are the same as the shape and size of the first heat dissipation device 314 and are used to accommodate the first heat dissipation device 314. The bottom surface 3224 of the housing portion 3220 is closely connected to the heat radiating surface 3140 of the first heat radiating device 314 as a heat receiving surface, and receives the amount of heat radiated from the first heat radiating device 314. That is, the bottom surface 3224 of the housing part 3220 and the heat radiation surface 3140 of the first heat radiation device 314 form an excellent thermal connection. A step hole 3226 is formed through the main body 320 and the second heat dissipation device 322 toward the surface of the main body 320 away from the second heat dissipation device 322 from the bottom surface 3224 and corresponding to the through hole 3142. Yes. When the first heat radiating device 314 is accommodated in the accommodating portion 3220, the through hole 3142 and the step hole 3226 are communicated with each other. The step hole 3226 includes a first hole and a second hole. In the step hole 3226, the diameter of the first hole near the bottom surface 3224 of the housing part 3220 is the same as the diameter of the through hole 3142 of the first heat radiating device 314, and is separated from the bottom surface 3224 of the housing part 3220. The diameter of the second hole is larger than the diameter of the through hole 3142 of the first heat dissipation device 314.

  The fixing device 324 is made of colloid, and includes a conical end portion 3240 formed at both ends and a column body 3242 that connects the two conical end portions 3240. The diameter of the column 3242 is the same as the diameter of the through hole 3142, and the diameter of the bottom of the cone of the cone-shaped end 3240 is larger than the diameter of the column 3242. The cone-shaped end portion 3240 can be reduced in size by a certain elastic deformation caused by the pressing force along the arrow direction shown in FIG.

  In the process of assembling the light emitting diode lamp 30, first, the first heat radiating device 314 is accommodated in the accommodating portion 3220 of the second heat radiating device 322 so that the through hole 3142 and the step hole 3226 communicate with each other. After that, the fixing device 324 is press-fitted into the communicating through hole 3142 and the step hole 3226. In the press-fitting process, the conical end portion 3240 of the fixing device 324 is reduced in size by a certain elastic deformation caused by the pressure of the inner wall of the through hole 3142 and the step hole 3226. The through hole 3142 communicated with the first hole of the step hole 3226 can be smoothly press-fitted. Since the diameter of the second hole of the step hole 3226 is larger than the diameter of the first hole of the step hole 3226, the conical end 3240 escapes from the first hole of the step hole 3226 and the second hole Therefore, one conical end portion 3240 is brought into contact with the step portion between the second hole and the first hole of the step hole 3226, and the other conical end portion is recovered. 3240 is in contact with the surface of the substrate 310 where the light emitting diode 312 is installed. Accordingly, the first heat radiating device 314 is fixed to the accommodating portion 3220 of the second heat radiating device 322 by the fixing device 324. By using the fixing device 324, the assembly process is simplified. The heat generated by the light emitting diode 312 can be quickly dissipated to the outside by an excellent thermal connection between the heat radiating surface 3140 of the first heat radiating device 314 and the bottom surface 3224 (heat receiving surface) of the second heat radiating device 322. Ensuring that the light emitting diode operates in a low temperature environment.

  In the process of replacing the light source, the conical end portion 3240 of the fixing device 324 exposed to the outside (that is, the conical end portion 3240 exposed to the surface of the substrate 310 where the light emitting diode 312 is installed). Is cut off, the damaged first heat radiation device 314 of the light-emitting diode light source 31 is separated from the housing portion 3220 of the lamp holder 32. Next, a new light-emitting diode light source 31 is fixed to the second heat dissipation device 322 as described in the assembly process.

  Further, the conical end portion 3240 of the fixing device 324 is formed in a polygonal pyramid shape or a conical shape so that the fixing device 324 can be easily inserted. As shown in FIG. 7, two or one of the two conical ends 3240 of the fixing device 324 may generate large deformation even when the conical ends 3240 receive a small force. It is also possible to open a gap. When the light source is replaced, a large deformation of the conical end portion 3240 easily occurs in the direction of the arrow shown in FIG. 7, and the conical end portion 3240 can be press-fitted into the through hole 3142. The fixing device 324 can be removed from the main body 320 without cutting the shape end portion 3240, and the fixing device 324 can be reused. The step hole 3226 may have the same structure as the through hole 3142. At this time, the two conical end portions 3240 may be in contact with the surface of the substrate 310 where the light emitting diode 312 is installed and the surface of the main body 320 away from the second heat dissipation device 322, respectively. Based on the fixing action of the fixing device 324 with respect to the first heat radiating device 314, the size of the housing portion 3220 can be made larger than the size of the first heat radiating device 314. In order to ensure heat dissipation efficiency, the thermal radiation coefficients of the surfaces of the first heat dissipation devices 114, 214, 314 and the second heat dissipation devices 120, 222, 322 are set to 0.8 or more.

  The amount of heat generated by the light emitting diodes 112, 212, 312 of the light emitting diode lamps 10, 20, 30 is generated by the first heat radiating devices 114, 214, 314 and the second heat radiating devices 120, 22 of the lamp holders 12, 22, 32. , 322, and then radiated by the lamp holders 12, 22, 32. Since the first heat dissipation devices 114, 214, and 314 are detachably installed on the second heat dissipation devices 120, 222, and 322, it is convenient to assemble and replace the light source of the light emitting diode.

10, 20, 30 Light emitting diode lamp 11, 21, 31 Light emitting diode light source 110, 210, 310 Substrate light emitting diode 112, 212 Light emitting diode 114, 214, 314 First heat dissipation device 12, 22, 32 Lamp holder 120, 222, 322 Second heat radiation device 122, 224, 324 Fixing device 220, 320 Main body 2140, 2220, 3222 Radiation fin 2240 Connecting portion 2242, 2244 Holding arm 3140 Heat radiation surface 3142 Through hole 3224 Bottom surface 3226 Stepped hole 3240 Conical end 3242 Column body

Claims (8)

  1. A substrate, a light emitting diode disposed on the surface of the substrate, and another surface of the substrate opposite to the surface where the light emitting diode is disposed, and the light emitting diode is generated and transmitted to the substrate A light-emitting diode light source including a first heat dissipation device that dissipates the amount of heat generated;
    A lamp holder comprising: the second heat dissipation device; and a fixing device that is detachably fixed to the second heat dissipation device so as to thermally connect the first heat dissipation device;
    A light-emitting diode lamp comprising:
  2.   The light emitting diode lamp according to claim 1, wherein the fixing device is an elastic frame made of a heat conductive material.
  3.   The first heat radiating device and the second heat radiating device each include a plurality of heat radiating fins, and the heat radiating fins of the first heat radiating device and the heat radiating fins of the second heat radiating device are joined by overlapping to form a thermal connection. The light emitting diode lamp according to claim 1, wherein the fixed state is held by the fixing device.
  4.   The fixing device is a holding part formed by bending a bullet having excellent thermal conductivity, and includes a connecting part and two holding arms formed by extending and bending from both ends of the connecting part. The ends of the two holding arms that are separated from the connecting portion are isolated from each other, and the portions between the ends of the two holding arms and the connecting portion are in contact with each other so as to be elastically separable. The light-emitting diode lamp according to claim 3.
  5.   The first heat dissipating device includes a heat dissipating surface, the second heat dissipating device includes a heat receiving surface closely joined to the heat dissipating surface, and the lamp holder attaches the first heat dissipating device to the second heat dissipating device by the fixing device. 2. The light emitting diode lamp according to claim 1, wherein the light emitting diode lamp is fixed to a heat radiating device, and the heat radiating surface of the first heat radiating device and the heat receiving surface of the second heat radiating device are joined to each other to form a thermal connection.
  6. At least one through hole penetrating the first heat dissipation device and the substrate is formed in the heat dissipation surface of the first heat dissipation device, and the heat receiving surface of the second heat dissipation device corresponds to the through hole and At least one step hole communicating with the through hole is formed, and the step hole includes a first hole and a second hole, and the diameter of the first hole is the same as the diameter of the through hole. The diameter of the two holes is larger than the diameter of the first hole,
    The fixing device includes a column body and conical end portions formed at both ends of the column body, and the diameter of the column body is the same as the diameter of the through hole and the first hole, The diameter of the bottom surface of the cone of the portion is larger than the diameter of the first hole and smaller than the diameter of the second hole, and the column of the fixing device is located in the through hole and the first hole, The conical end portions at both ends of the column body are respectively in contact with the stepped portion between the first hole and the second hole and the surface of the substrate on which the light emitting diode is installed. The light-emitting diode lamp according to claim 5.
  7.   At least one first through hole penetrating the first heat radiating device and the substrate is formed on the heat radiating surface of the first heat radiating device, and the first through hole is formed on the heat receiving surface of the second heat radiating device. And at least one second through hole communicating with the first through hole is formed, and the diameter of the second through hole is the same as the diameter of the first through hole. A conical end formed at both ends of the body and the pillar, and the diameter of the pillar is the same as the diameter of the first through hole and the second through hole; The diameter of the bottom surface of the cone is larger than the diameter of the first through hole and the diameter of the second through hole, and the column of the fixing device is located in the first through hole and the second through hole, Both ends of the column Conical end portion, the light emitting diode lamp according to claim 5, characterized in that contacts the outer side of the first through hole and the second through hole.
  8.   The light emitting diode lamp according to claim 6 or 7, wherein a notch is formed at the conical end.
JP2010235499A 2009-11-02 2010-10-20 Light emitting diode lamp Pending JP2011096658A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009103092150A CN102052590A (en) 2009-11-02 2009-11-02 LED lamp

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JP2011096658A true JP2011096658A (en) 2011-05-12

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JP2010235499A Pending JP2011096658A (en) 2009-11-02 2010-10-20 Light emitting diode lamp

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EP (1) EP2325556A2 (en)
JP (1) JP2011096658A (en)
CN (1) CN102052590A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018067528A (en) * 2016-10-21 2018-04-26 廈門普為光電科技有限公司Xiamen PVTECH Co., Ltd. Light emitting diode lighting fixture for ceiling
US10156330B2 (en) 2016-10-21 2018-12-18 Xiamen Pvtech Co., Ltd. LED ceiling lamp

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003068130A (en) * 2001-08-28 2003-03-07 Matsushita Electric Works Ltd Luminaire
JP3108651U (en) * 2004-11-09 2005-04-28 家茂 李 LED lamp structure
JP2005340454A (en) * 2004-05-26 2005-12-08 Advanex Inc Fixing apparatus and fixing structure of light-emitting diode
JP2006128415A (en) * 2004-10-29 2006-05-18 Nippon Seiki Co Ltd Light source support and light source device
WO2009108799A1 (en) * 2008-02-26 2009-09-03 Journee Lighting, Inc. Light fixture assembly and led assembly

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003068130A (en) * 2001-08-28 2003-03-07 Matsushita Electric Works Ltd Luminaire
JP2005340454A (en) * 2004-05-26 2005-12-08 Advanex Inc Fixing apparatus and fixing structure of light-emitting diode
JP2006128415A (en) * 2004-10-29 2006-05-18 Nippon Seiki Co Ltd Light source support and light source device
JP3108651U (en) * 2004-11-09 2005-04-28 家茂 李 LED lamp structure
WO2009108799A1 (en) * 2008-02-26 2009-09-03 Journee Lighting, Inc. Light fixture assembly and led assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018067528A (en) * 2016-10-21 2018-04-26 廈門普為光電科技有限公司Xiamen PVTECH Co., Ltd. Light emitting diode lighting fixture for ceiling
US10156330B2 (en) 2016-10-21 2018-12-18 Xiamen Pvtech Co., Ltd. LED ceiling lamp

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Publication number Publication date
CN102052590A (en) 2011-05-11
EP2325556A2 (en) 2011-05-25

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