EP2325556A2

EP2325556A2 - Illumination device

Info

Publication number: EP2325556A2
Application number: EP10170176A
Authority: EP
Inventors: Chih-Ming Lai; Yu-Pin Liu
Original assignee: Foxsemicon Integrated Technology Inc
Current assignee: Foxsemicon Integrated Technology Inc
Priority date: 2009-11-02
Filing date: 2010-07-20
Publication date: 2011-05-25
Also published as: JP2011096658A; CN102052590A

Abstract

An illumination device includes a light source (11, 21) and a holder (12, 22). The light source includes a substrate (110, 210), at least one light emitting diode (112, 212) and a first heat-dissipation device (114, 214). The at least one light emitting diode is mounted on one surface of the substrate and electrically connected thereto. The first heat-dissipation device is mounted on the other surface of the substrate and thermally connected to the substrate, dissipating heat generated by the at least one light emitting diode through the substrate. The holder includes at least one fixing device (122, 224) and a second heat-dissipation device (120, 222). The second heat-dissipation device is thermally connected to the first heat-dissipation. The at least one fixing device is configured for securing the first heat-dissipation device and the second heat-dissipation device.

Description

1. Technical Field

The disclosure relates generally to illumination, and more particularly to an illumination device that is easily accessed.

2. Description of the Related Art

LED-based illumination devices often employ a heat-dissipation module to dissipate heat generated by the LED. However, the heat dissipation device is often difficult to access when the LED fails. Thus, what is called for is an illumination device utilizing a heat dissipation system that can alleviate the limitations described.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an isometric view of an illumination device in accordance with a first embodiment of the disclosure.
FIG. 2 is an exploded view of the illumination device in FIG. 1.
FIG. 3 is a cross-section of an illumination device in accordance with a second embodiment of the disclosure.
FIG. 4A is an exploded view of the illumination device in FIG. 3 in which fixing devices thereof being omitted, and FIG. 4B is an enlarged isometric view of one of the fixing devices of the illumination device in FIG. 3.
FIG. 5 is a cross-section of an illumination device in accordance with a third embodiment of the disclosure.
FIG. 6 is an exploded view of the illumination device in FIG. 5.
FIG. 7 is a schematic view showing removal of fixing devices from the illumination device in FIG. 5.

DETAILED DESCRIPTION

Referring to FIG. 1 and FIG. 2, an illumination device 10 in accordance with a first embodiment of the disclosure includes a light source 11 and a holder 12.
The light source 11 includes a substrate 110, a plurality of LEDs 112 and a first heat-dissipation device 114. The substrate 110 is a printed circuit board. The LEDs 112 are mounted on one surface of the substrate 110 and electrically connected thereto. The first heat-dissipation device 114 is mounted on the other surface of the substrate 110. The first heat-dissipation device 114 is thermally connected to the substrate 110 and configured for dissipating the heat generated by the LEDs 112 through the substrate 110. The substrate 110 is of a heat conductive material and thus its participation in the heat dissipation process is omitted from this description.
The holder 12 includes a second heat-dissipation device 120 and a fixing device 122. The second heat-dissipation device 120 is curved with a large surface for dissipating heat more efficiently. The second heat-dissipation device 120 is of a heat conductive material. The fixing device 122 is mounted on the second heat-dissipation device 120. The fixing device 122 is of a heat conductive material. Thus the first heat-dissipation device 114 is thermally connected to the second heat-dissipation device 120 through the fixing device 122. The heat generated by the LEDs 112 is, accordingly, dissipated efficiently. The shape of the first heat-dissipation device 114 and the fixing device 122 can be triangular or elliptic, there being no limitation to the cross-shape disclosed.
The first heat-dissipation device 114, the second heat-dissipation device 120 and the fixing device 122 are of a heat conductive material such as aluminum, copper, or other. Optimally, thermal emissivity coefficient of the first and second heat-dissipation devices and of the fixing device 122 exceeds or equals 0.8.
Referring to FIG. 3 and FIGS. 4A and 4B, an illumination device 20 in accordance with a second embodiment of the disclosure includes a light source 21 and a holder 22.
The light source 21 includes a substrate 210, a plurality of LEDs 212 and a first heat dissipation device 214. The LEDs 212 are mounted on one surface of the substrate 210 and electrically connected thereto. The substrate 210 is a printed circuit board. The first heat-dissipation device 214 is mounted on the other surface of the substrate 210. The first heat-dissipation device 214 is thermally connected to the substrate 210. The first heat-dissipation device 214 includes a plurality of cooling fins 2140.
The holder 22 includes a base 220, a second heat-dissipation device 222 and a plurality of fixing devices 224. The second heat-dissipation device 222 is mounted on the base 220. The second heat-dissipation device 222 includes a plurality of cooling fins 2220. The cooling fins 2220 and the cooling fins 2140 interleave. Each pair of fins is secured by one of the fixing devices 224. The fixing device 224 according to the preferred embodiment is a spring clip.
Referring to FIG. 5 and FIG. 6, an illumination device in accordance with a third embodiment of the disclosure includes a light source 31 and a holder 32.
The light source 31 includes a substrate 310, a plurality of LEDs 312 and a first heat-dissipation device 314. The substrate 310 is a printed circuit board. The LEDs 312 are mounted on one surface of the substrate 310. The LEDs 312 are electrically connected to the substrate 310. The first heat-dissipation device 314 is mounted on the other surface of the substrate 310. The first heat-dissipation device 314 is thermally connected to the substrate 310.
The first heat-dissipation device 314 includes a first surface 3140. At least one through-hole 3142 is defined in the first surface 3140. The at least one through-hole 3142 penetrates the first heat-dissipation device 314 and the substrate 310.
The holder 32 includes a base 320, a second heat-dissipation device 322 and two fixing devices 324. The second heat-dissipation device 322 is mounted on the base 320. The second heat-dissipation device includes a receiving portion 3220 and a plurality of cooling fins 3222. The receiving portion 3220 snugly seats the first heat-dissipation device 314, and is thermally connected thereto. The receiving portion includes a bottom surface 3224. A plurality of countersinks 3226 are defined in the bottom surface 3224. The countersinks 3226 penetrate the base 320 and the second heat-dissipation device 322. The light source 31, the second heat-dissipation device 322 and the base 320 are secured by the fixing devices 324 through the through-holes 3142 and the countersinks 3226. Each of the fixing devices 324 is a tie-down in the third embodiment, with two opposite expanded ends (not labeled) which are deformable when subjected to a clamping force. Each expanded end has a triangular profile tapering upwardly or downwardly. A recess (not labeled) is defined in each of the expanded ends to render the expanded end the required deformability. To assemble the illumination device 30, the fixing devices 324 are inserted downwardly through the through-holes 3142 and the countersinks 3226 until upper ones of the expanded ends engage with the substrate 310 and lower ones of the expanded ends engage with the base 320 thereby securing the light source 31 and the second heat-dissipation device 322 together. To separate the light source 31 and the second heat-dissipation device 322, the upper ones of the expanded ends of the fixing devices 324, as shown in FIG. 7, are clamped to deform inwardly, meanwhile an upward pulling force is exerted to the light source 31 in respect to the second heat-dissipation device 322. The upward pulling force is continued until the light source 31 totally leaves the fixing devices 324. Access to light source 31 is easily accomplished by removal of the fixing devices 3240.
Because the first heat-dissipation device and the second heat-dissipation device are secured by the fixing device, the illumination device is easily accessed by removing the fixing device or the first heat-dissipation device.

Claims

An illumination device comprising:
a light source comprising a substrate, at least one light emitting diode and a first heat-dissipation device, the at least one light emitting diode mounted on one surface of the substrate and electrically connected to the substrate, the first heat-dissipation device mounted on the other surface of the substrate and thermally connected to the substrate, dissipating heat generated by the at least one light emitting diode through the substrate; and

a holder comprising at least one fixing device and a second heat-dissipation device, the second heat-dissipation device thermally connected to the first heat-dissipation, and the at least one fixing device configured for securing the first heat-dissipation device and the second heat-dissipation device.
The illumination device as claimed in claim 1, wherein the substrate is a printed circuit board.
The illumination device as claimed in claim 1 or 2, wherein the fixing device is a mounting rabbet located on the second heat-dissipation device and thermally connected to the first heat-dissipation device and the second heat-dissipation device.
The illumination device as claimed in claim 3, wherein the at least one fixing device is of a heat conductive material.
The illumination device as claimed in any preceding claim, wherein the first heat-dissipation device and the second heat-dissipation device comprise a plurality of cooling fins, each pair thereof fins interleaved and clamped by the at least one fixing device.
The illumination device as claimed in claim 5, wherein the at least one fixing device is a spring clip.
The illumination device as claimed in any preceding claim, wherein the first heat-dissipation device comprises at least one through-hole and the second heat-dissipation device comprises at least one countersink, the first heat-dissipation device and the second heat-dissipation device secured by the at least one fixing device through the at least one through-hole and the at least one countersink.
The illumination device as claim in claim 7, the at least one fixing device is a tie-down, with two opposite expanded ends which are deformable when subjected to a clamping force.