EP2325556A2 - Dispositif d'illumination - Google Patents

Dispositif d'illumination Download PDF

Info

Publication number
EP2325556A2
EP2325556A2 EP10170176A EP10170176A EP2325556A2 EP 2325556 A2 EP2325556 A2 EP 2325556A2 EP 10170176 A EP10170176 A EP 10170176A EP 10170176 A EP10170176 A EP 10170176A EP 2325556 A2 EP2325556 A2 EP 2325556A2
Authority
EP
European Patent Office
Prior art keywords
heat
dissipation device
dissipation
substrate
illumination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10170176A
Other languages
German (de)
English (en)
Inventor
Chih-Ming Lai
Yu-Pin Liu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxsemicon Integrated Technology Inc
Original Assignee
Foxsemicon Integrated Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxsemicon Integrated Technology Inc filed Critical Foxsemicon Integrated Technology Inc
Publication of EP2325556A2 publication Critical patent/EP2325556A2/fr
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
EP10170176A 2009-11-02 2010-07-20 Dispositif d'illumination Withdrawn EP2325556A2 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009103092150A CN102052590A (zh) 2009-11-02 2009-11-02 发光二极管灯具

Publications (1)

Publication Number Publication Date
EP2325556A2 true EP2325556A2 (fr) 2011-05-25

Family

ID=43618888

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10170176A Withdrawn EP2325556A2 (fr) 2009-11-02 2010-07-20 Dispositif d'illumination

Country Status (3)

Country Link
EP (1) EP2325556A2 (fr)
JP (1) JP2011096658A (fr)
CN (1) CN102052590A (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106439645B (zh) 2016-10-21 2022-03-22 厦门普为光电科技有限公司 吸顶发光二极体灯具
JP6314356B2 (ja) * 2016-10-21 2018-04-25 廈門普為光電科技有限公司Ｘｉａｍｅｎ ＰＶＴＥＣＨ Ｃｏ．， Ｌｔｄ． 天井用発光ダイオード灯具

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3928387B2 (ja) * 2001-08-28 2007-06-13 松下電工株式会社 照明器具
JP3851911B2 (ja) * 2004-05-26 2006-11-29 株式会社アドバネクス 発光ダイオードの固定装置及び固定構造
JP4656382B2 (ja) * 2004-10-29 2011-03-23 日本精機株式会社 光源支持体及び光源装置
JP3108651U (ja) * 2004-11-09 2005-04-28 家茂 李 Ｌｅｄランプの構造
US7866850B2 (en) * 2008-02-26 2011-01-11 Journée Lighting, Inc. Light fixture assembly and LED assembly

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None

Also Published As

Publication number Publication date
CN102052590A (zh) 2011-05-11
JP2011096658A (ja) 2011-05-12

Similar Documents

Publication Publication Date Title
US7794116B2 (en) LED lamp with a heat dissipation device
US7198386B2 (en) Versatile thermally advanced LED fixture
JP5283750B2 (ja) プリント回路基板をヒートシンクに取り付けるための熱伝導取り付け素子
US7684197B2 (en) Memory module assembly having heat sinks with improved structure
EP2333405B1 (fr) Ensemble de douille avec structure de gestion thermique
US8459841B2 (en) Lamp assembly
US7695161B2 (en) Heat dissipation device for light emitting diode module
US20070223198A1 (en) Memory module assembly including a clamp for mounting heat sinks thereon
US20090303717A1 (en) Led lamp assembly
US7891845B2 (en) LED lamp
US7564687B2 (en) Heat dissipation device having a fixing base
US20110180819A1 (en) Light-emitting arrangement
US7626822B2 (en) Heat sink assembly for multiple electronic components
US20100014287A1 (en) Illuminating device with heat dissipating element
RU2612563C2 (ru) Светодиодный модуль и светильник, содержащий упомянутый модуль
US6950310B2 (en) System and method for self-leveling heat sink for multiple height devices
US9494730B1 (en) Multiple waveguide edge lit structure
US7997766B2 (en) Light-emitting display panel
US20130134448A1 (en) Light module and light component thereof
JP2000323877A (ja) 熱転移装置とその製造方法、電子回路装置、および基板に実装された電子部品の冷却方法
US20100200984A1 (en) Adjustable threaded cores for led thermal management
EP2325556A2 (fr) Dispositif d'illumination
US7866846B2 (en) LED lamp assembly
US9383067B2 (en) Light-emitting means, in particular LED module
US20030230752A1 (en) LED matrix substrate with convection holes

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME RS

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20140201