EP2325556A2 - Beleuchtungsvorrichtung - Google Patents
Beleuchtungsvorrichtung Download PDFInfo
- Publication number
- EP2325556A2 EP2325556A2 EP10170176A EP10170176A EP2325556A2 EP 2325556 A2 EP2325556 A2 EP 2325556A2 EP 10170176 A EP10170176 A EP 10170176A EP 10170176 A EP10170176 A EP 10170176A EP 2325556 A2 EP2325556 A2 EP 2325556A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- heat
- dissipation device
- dissipation
- substrate
- illumination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
Definitions
- the disclosure relates generally to illumination, and more particularly to an illumination device that is easily accessed.
- LED-based illumination devices often employ a heat-dissipation module to dissipate heat generated by the LED.
- the heat dissipation device is often difficult to access when the LED fails.
- an illumination device utilizing a heat dissipation system that can alleviate the limitations described.
- FIG. 1 is an isometric view of an illumination device in accordance with a first embodiment of the disclosure.
- FIG. 2 is an exploded view of the illumination device in FIG. 1 .
- FIG. 3 is a cross-section of an illumination device in accordance with a second embodiment of the disclosure.
- FIG. 4A is an exploded view of the illumination device in FIG. 3 in which fixing devices thereof being omitted
- FIG. 4B is an enlarged isometric view of one of the fixing devices of the illumination device in FIG. 3 .
- FIG. 5 is a cross-section of an illumination device in accordance with a third embodiment of the disclosure.
- FIG. 6 is an exploded view of the illumination device in FIG. 5 .
- FIG. 7 is a schematic view showing removal of fixing devices from the illumination device in FIG. 5 .
- an illumination device 10 in accordance with a first embodiment of the disclosure includes a light source 11 and a holder 12.
- the light source 11 includes a substrate 110, a plurality of LEDs 112 and a first heat-dissipation device 114.
- the substrate 110 is a printed circuit board.
- the LEDs 112 are mounted on one surface of the substrate 110 and electrically connected thereto.
- the first heat-dissipation device 114 is mounted on the other surface of the substrate 110.
- the first heat-dissipation device 114 is thermally connected to the substrate 110 and configured for dissipating the heat generated by the LEDs 112 through the substrate 110.
- the substrate 110 is of a heat conductive material and thus its participation in the heat dissipation process is omitted from this description.
- the holder 12 includes a second heat-dissipation device 120 and a fixing device 122.
- the second heat-dissipation device 120 is curved with a large surface for dissipating heat more efficiently.
- the second heat-dissipation device 120 is of a heat conductive material.
- the fixing device 122 is mounted on the second heat-dissipation device 120.
- the fixing device 122 is of a heat conductive material.
- the first heat-dissipation device 114 is thermally connected to the second heat-dissipation device 120 through the fixing device 122.
- the heat generated by the LEDs 112 is, accordingly, dissipated efficiently.
- the shape of the first heat-dissipation device 114 and the fixing device 122 can be triangular or elliptic, there being no limitation to the cross-shape disclosed.
- the first heat-dissipation device 114, the second heat-dissipation device 120 and the fixing device 122 are of a heat conductive material such as aluminum, copper, or other. Optimally, thermal emissivity coefficient of the first and second heat-dissipation devices and of the fixing device 122 exceeds or equals 0.8.
- an illumination device 20 in accordance with a second embodiment of the disclosure includes a light source 21 and a holder 22.
- the light source 21 includes a substrate 210, a plurality of LEDs 212 and a first heat dissipation device 214.
- the LEDs 212 are mounted on one surface of the substrate 210 and electrically connected thereto.
- the substrate 210 is a printed circuit board.
- the first heat-dissipation device 214 is mounted on the other surface of the substrate 210.
- the first heat-dissipation device 214 is thermally connected to the substrate 210.
- the first heat-dissipation device 214 includes a plurality of cooling fins 2140.
- the holder 22 includes a base 220, a second heat-dissipation device 222 and a plurality of fixing devices 224.
- the second heat-dissipation device 222 is mounted on the base 220.
- the second heat-dissipation device 222 includes a plurality of cooling fins 2220.
- the cooling fins 2220 and the cooling fins 2140 interleave. Each pair of fins is secured by one of the fixing devices 224.
- the fixing device 224 according to the preferred embodiment is a spring clip.
- an illumination device in accordance with a third embodiment of the disclosure includes a light source 31 and a holder 32.
- the light source 31 includes a substrate 310, a plurality of LEDs 312 and a first heat-dissipation device 314.
- the substrate 310 is a printed circuit board.
- the LEDs 312 are mounted on one surface of the substrate 310.
- the LEDs 312 are electrically connected to the substrate 310.
- the first heat-dissipation device 314 is mounted on the other surface of the substrate 310.
- the first heat-dissipation device 314 is thermally connected to the substrate 310.
- the first heat-dissipation device 314 includes a first surface 3140. At least one through-hole 3142 is defined in the first surface 3140. The at least one through-hole 3142 penetrates the first heat-dissipation device 314 and the substrate 310.
- the holder 32 includes a base 320, a second heat-dissipation device 322 and two fixing devices 324.
- the second heat-dissipation device 322 is mounted on the base 320.
- the second heat-dissipation device includes a receiving portion 3220 and a plurality of cooling fins 3222.
- the receiving portion 3220 snugly seats the first heat-dissipation device 314, and is thermally connected thereto.
- the receiving portion includes a bottom surface 3224.
- a plurality of countersinks 3226 are defined in the bottom surface 3224. The countersinks 3226 penetrate the base 320 and the second heat-dissipation device 322.
- the light source 31, the second heat-dissipation device 322 and the base 320 are secured by the fixing devices 324 through the through-holes 3142 and the countersinks 3226.
- Each of the fixing devices 324 is a tie-down in the third embodiment, with two opposite expanded ends (not labeled) which are deformable when subjected to a clamping force.
- Each expanded end has a triangular profile tapering upwardly or downwardly.
- a recess (not labeled) is defined in each of the expanded ends to render the expanded end the required deformability.
- the fixing devices 324 are inserted downwardly through the through-holes 3142 and the countersinks 3226 until upper ones of the expanded ends engage with the substrate 310 and lower ones of the expanded ends engage with the base 320 thereby securing the light source 31 and the second heat-dissipation device 322 together.
- the upper ones of the expanded ends of the fixing devices 324 as shown in FIG. 7 , are clamped to deform inwardly, meanwhile an upward pulling force is exerted to the light source 31 in respect to the second heat-dissipation device 322. The upward pulling force is continued until the light source 31 totally leaves the fixing devices 324. Access to light source 31 is easily accomplished by removal of the fixing devices 3240.
- the illumination device is easily accessed by removing the fixing device or the first heat-dissipation device.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009103092150A CN102052590A (zh) | 2009-11-02 | 2009-11-02 | 发光二极管灯具 |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2325556A2 true EP2325556A2 (de) | 2011-05-25 |
Family
ID=43618888
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP10170176A Withdrawn EP2325556A2 (de) | 2009-11-02 | 2010-07-20 | Beleuchtungsvorrichtung |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2325556A2 (de) |
JP (1) | JP2011096658A (de) |
CN (1) | CN102052590A (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106439645B (zh) | 2016-10-21 | 2022-03-22 | 厦门普为光电科技有限公司 | 吸顶发光二极体灯具 |
JP6314356B2 (ja) * | 2016-10-21 | 2018-04-25 | 廈門普為光電科技有限公司Xiamen PVTECH Co., Ltd. | 天井用発光ダイオード灯具 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3928387B2 (ja) * | 2001-08-28 | 2007-06-13 | 松下電工株式会社 | 照明器具 |
JP3851911B2 (ja) * | 2004-05-26 | 2006-11-29 | 株式会社アドバネクス | 発光ダイオードの固定装置及び固定構造 |
JP4656382B2 (ja) * | 2004-10-29 | 2011-03-23 | 日本精機株式会社 | 光源支持体及び光源装置 |
JP3108651U (ja) * | 2004-11-09 | 2005-04-28 | 家茂 李 | Ledランプの構造 |
US7866850B2 (en) * | 2008-02-26 | 2011-01-11 | Journée Lighting, Inc. | Light fixture assembly and LED assembly |
-
2009
- 2009-11-02 CN CN2009103092150A patent/CN102052590A/zh active Pending
-
2010
- 2010-07-20 EP EP10170176A patent/EP2325556A2/de not_active Withdrawn
- 2010-10-20 JP JP2010235499A patent/JP2011096658A/ja active Pending
Non-Patent Citations (1)
Title |
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None |
Also Published As
Publication number | Publication date |
---|---|
CN102052590A (zh) | 2011-05-11 |
JP2011096658A (ja) | 2011-05-12 |
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Legal Events
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Extension state: BA ME RS |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
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18D | Application deemed to be withdrawn |
Effective date: 20140201 |