JP3108651U - LED lamp structure - Google Patents

LED lamp structure Download PDF

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JP3108651U
JP3108651U JP2004006576U JP2004006576U JP3108651U JP 3108651 U JP3108651 U JP 3108651U JP 2004006576 U JP2004006576 U JP 2004006576U JP 2004006576 U JP2004006576 U JP 2004006576U JP 3108651 U JP3108651 U JP 3108651U
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heat
led
heat conduction
conduction base
led lamp
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家茂 李
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家茂 李
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Abstract

【課題】例えば、監視カメラの夜間撮影の赤外線光源及び一般照明の構造に応用することができるLEDランプの構造を提供する。
【解決手段】発光ダイオード(LED)を光源とし、LEDチップの片面は熱伝導に優れているブロック状の金属上に配設され、該ブロック状の金属は平面(散光用)又は凹面(集光用)とし、LEDチップは熱エネルギーを発し、放熱体の構造はLEDチップの温度を下げるものであり、放熱構造と接触する面を大幅に拡大し、LEDチップが発する熱を迅速に発散する。複数のLEDチップを含む放熱体は絶縁フレーム内に設置されて金属基台上に配設されている。
【選択図】 図2
The present invention provides an LED lamp structure that can be applied to, for example, an infrared light source for night photography of a surveillance camera and a general illumination structure.
A light-emitting diode (LED) is used as a light source, and one surface of an LED chip is disposed on a block-shaped metal having excellent heat conduction, and the block-shaped metal is flat (for light scattering) or concave (condensed). The LED chip emits heat energy, and the structure of the heat dissipation body lowers the temperature of the LED chip. The surface in contact with the heat dissipation structure is greatly enlarged, and the heat generated by the LED chip is rapidly dissipated. A heat radiating body including a plurality of LED chips is installed in an insulating frame and disposed on a metal base.
[Selection] Figure 2

Description

本考案は、発光ダイオードを光源に用いたLEDランプの構造の改良に関する。   The present invention relates to an improvement in the structure of an LED lamp using a light emitting diode as a light source.

発光ダイオードを光源に用いたランプは、熱伝導に優れるブロック状の金属製の放熱体を用い、該放熱体上方にLED(赤外線)チップを埋め込み、該チップは平面状(放熱用)を呈し、或いは凹型状(集光用)を呈している。前記LEDチップは、熱エネルギーを発生し、放熱体により迅速に吸収し、それによってLEDチップの温度を下げ、更に、前記放熱体の吸収する熱は銅又はアルミ材質の金属製の熱伝導基台上へ伝導され、前記放熱体及びLEDチップの温度を下げ、該熱伝導基台は熱エネルギーを放熱器へ伝導し、更に放熱器の熱エネルギーは大気中へ拡散される。    A lamp using a light-emitting diode as a light source uses a block-shaped metal radiator that is excellent in heat conduction, an LED (infrared) chip is embedded above the radiator, and the chip has a planar shape (for heat radiation), Alternatively, it has a concave shape (for condensing). The LED chip generates heat energy and quickly absorbs it by the radiator, thereby lowering the temperature of the LED chip, and further, the heat absorbed by the radiator is a metal heat conduction base made of copper or aluminum. Conducted upward, the temperature of the radiator and the LED chip is lowered, and the heat conduction base conducts thermal energy to the radiator, and further, the thermal energy of the radiator is diffused into the atmosphere.

一方、ランプカバーは、アルミ合金材質からなり、該ランプカバー内縁は滑らかな放物線のアーチ状を呈し、異なる拡散角度により、発光ダイオードの光束を集中反射し、該ランプカバーと熱伝導基台は結合し、固定と保護を図る役割の外殻となり、並びに直接熱伝導基台の熱エネルギーを吸収し、全体的な構造は、耐熱性及び衝撃性に強いLEDランプの構造となる。    On the other hand, the lamp cover is made of an aluminum alloy material, the inner edge of the lamp cover has a smooth parabolic arch shape, and the light flux of the light emitting diode is concentratedly reflected by different diffusion angles, and the lamp cover and the heat conduction base are combined. As a result, the outer shell serves as a fixing and protection role, and directly absorbs the heat energy of the heat conduction base, so that the overall structure is a structure of an LED lamp that is strong in heat resistance and impact resistance.

図1に示すように、従来のLEDランプ1の構造は、外殻11、レンズ12、LED13、外カバー14により構成され、前記LED13はレンズ12の周囲外縁に配設され、該LED13とレンズ12とは外殻11内部に配設し、且つ外殻11の外縁上方は外カバー14に覆われて構成されている。   As shown in FIG. 1, the structure of a conventional LED lamp 1 includes an outer shell 11, a lens 12, an LED 13, and an outer cover 14, and the LED 13 is disposed at the outer peripheral edge of the lens 12. Is arranged inside the outer shell 11, and the upper edge of the outer shell 11 is covered with an outer cover 14.

前記LEDランプ1の構造は、レンズ12が大部分の空間を占め、コストがかかり、且つLED13が発する光束のエネルギーに限りがあり、該光束が照らす範囲も小さく、距離も短い。   The structure of the LED lamp 1 is that the lens 12 occupies most of the space, is expensive, and the energy of the luminous flux emitted from the LED 13 is limited, the range illuminated by the luminous flux is small, and the distance is short.

上述した従来のLEDランプの構造は、発光ダイオードの数量を多く必要とし、体積も大きく幅も増加する。多くの発光ダイオードを長時間点灯すると熱エネルギーが非常に高くなり、且つ例えば密閉製の監視カメラの中に設置されている場合は、発光チップはすぐに焼けてしまい、及び発光ダイオードの透明度がミスト化してしい、発光ダイオードの使用寿命が短くなってしまう。   The structure of the conventional LED lamp described above requires a large number of light emitting diodes, and increases in volume and width. When many light-emitting diodes are lit for a long time, the thermal energy becomes very high, and for example when installed in a sealed surveillance camera, the light-emitting chip burns out quickly and the transparency of the light-emitting diodes is mist. The service life of light emitting diodes will be shortened.

次に、下記に従来構造の欠点を挙げる。   Next, the disadvantages of the conventional structure are listed below.

1. 従来の光源はレンズ外周縁にあり、且つレンズが必要とする光源を補うために発光ダイオードを数多く必要とし、大きな体積を必要とする。   1. A conventional light source is located on the outer periphery of the lens, and requires a large number of light emitting diodes to supplement the light source required by the lens, and requires a large volume.

2. 発光ダイオードの数が多く、長時間使用すると熱エネルギーが非常に高くなり、且つ密閉製の監視カメラ内に設置されている場合は、LEDチップはすぐに高熱のため焼けてしまい及び発光ダイオードの透明パッケージがミスト化されてしまい、発光ダイオードの寿命も短い。   2. If the number of light emitting diodes is large, the thermal energy becomes very high when used for a long time, and if installed in a sealed surveillance camera, the LED chip will burn out quickly due to high heat and the light emitting diodes will be transparent The package is misted and the lifetime of the light emitting diode is short.

3. 発光ダイオードのチップは、透明のパッケージ体によりパッケージされており、チップが発散する熱エネルギーは金属支柱により放熱されるだけであるため、チップの明るさと電流は正比例の関係にあるため、発光ダイオードが必要とする電流量は制限される。   3. Since the chip of the light emitting diode is packaged by a transparent package body, and the thermal energy emitted from the chip is only dissipated by the metal support, the brightness of the chip and the current are in a direct proportional relationship. The amount of current required is limited.

本考案は、上述した点に鑑みてなされたもので、発光ダイオードの使用寿命が長く、かつランプ体積が小さく、迅速に放熱ができるLEDランプの構造を提供することを目的とする。   The present invention has been made in view of the above points, and an object of the present invention is to provide an LED lamp structure that has a long service life of a light-emitting diode, a small lamp volume, and can quickly dissipate heat.

前記目的を達成するため本考案によるLEDランプの構造は、 一面に平面又は凹面を形成し、別の片面を絶縁フレーム内に配置するLEDチップを配設した金、銀、銅、アルミニウムなどにより形成した金属製の放熱体と、両端に異なるサイズのめねじを有し、一方のめねじをLED底部外殻に形成したおねじに螺合し、他方のめねじをランプカバーのおねじに螺合し、且つ該めねじの前端の平面に前記金属製の放熱体を配設し、この金属製の放熱体が吸収した熱エネルギーを吸収すると共に拡散する銅製の熱伝導基台と、枠を有し、前記放熱体を挟み込み決められた位置に固定すると共に、片端を前記熱伝導基台の前端平面に配設した絶縁フレームと、を備えたことを特徴とする。   In order to achieve the above object, the structure of the LED lamp according to the present invention is made of gold, silver, copper, aluminum, etc., in which an LED chip is formed, in which a flat surface or a concave surface is formed on one surface and another surface is disposed in an insulating frame. The metal heat sink and female screws of different sizes at both ends, one female screw is screwed into the male screw formed on the outer shell of the LED bottom, and the other female screw is screwed into the male screw of the lamp cover. And a metal heat dissipating body disposed on the plane of the front end of the female screw, a heat conducting base made of copper that absorbs and diffuses heat energy absorbed by the metal heat dissipating body, and a frame. And having an insulating frame having one end disposed on the front end plane of the heat conducting base, and sandwiching and fixing the heat dissipating member at a predetermined position.

本考案によれば、下記の効果を達成することができる。   According to the present invention, the following effects can be achieved.

1.数個の放熱体を一個の熱伝導基台上に集めることにより、光源が集まって光束を形成して、一個の発光構造体だけで例えば監視カメラが必要とする光源とすることができ、費用を節約することができる。 1. By collecting several heat radiators on one heat conduction base, the light sources gather together to form a light beam, and only one light emitting structure can be used as a light source required by a surveillance camera, for example. Can be saved.

2.LEDチップが発散する熱エネルギーを放熱体、熱伝導基台、放熱器、及びランプカバーを経由して迅速に大気中へ放出でき、迅速に放熱することができ、ランプ寿命が長く、しかもLEDランプの体積を小さくできる。 2. The heat energy emitted from the LED chip can be quickly released into the atmosphere via a radiator, heat conduction base, radiator, and lamp cover, and can be quickly dissipated, resulting in a long lamp life and LED lamp. The volume of can be reduced.

3.LEDチップの熱エネルギーを迅速に放熱し、且つLEDチップの外周はパッケージされておらず、LEDチップは更に大きな電流量を受けることができ、LEDチップの明るさ並びに光源の効率を高めることができる。 3. The heat energy of the LED chip is quickly dissipated, and the outer periphery of the LED chip is not packaged, and the LED chip can receive a larger amount of current, which can increase the brightness of the LED chip and the efficiency of the light source. .

以下、図面を参照して本考案の実施例を説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図2、3及び図4に示すように、本考案実施例のLEDランプの構造は、LEDランプ2、LED底部外殻21、電源線232、LED底部22、銅製の熱伝導基台23、放熱体24、フレーム242、ランプカバー25、レンズ252により構成されている。 前記放熱体24は、金、銀、銅、アルミなどによる金属材料により形成されている。前記LED底部外殻21内縁には、おねじ211を形成し、該おねじ211はLED底部22の外縁に形成するめねじ221に螺合している。前記LED底部外殻21内縁のおねじ211は、衝撃に強く、且つ該おねじ211は他の構造上に螺合することもできるようになっている。   As shown in FIGS. 2, 3 and 4, the LED lamp according to the embodiment of the present invention includes an LED lamp 2, an LED bottom outer shell 21, a power line 232, an LED bottom 22, a copper heat conduction base 23, heat dissipation. The body 24, the frame 242, the lamp cover 25, and the lens 252 are configured. The heat radiator 24 is made of a metal material such as gold, silver, copper, or aluminum. A male screw 211 is formed on the inner edge of the LED bottom outer shell 21, and the male screw 211 is screwed into a female screw 221 formed on the outer edge of the LED bottom 22. The external thread 211 on the inner edge of the LED bottom outer shell 21 is strong against impact, and the external thread 211 can be screwed onto another structure.

前記LED底部22内部には、電源線232が配設され、該電源線232から直流の電源を発光ダイオード(LED)へ供給するようになっている。前記赤外線底部22の前端には、銅製の熱伝導基台23を設け、該銅製の熱伝導基台23の体積は放熱体24よりも大きく、放熱体24の熱源を吸収し、並びに迅速に発散するようになっている。前記銅製の熱伝導基台23前端には、めねじ231を設け、該めねじ231の前端に積載台233を設けている。この積載台233は、LEDチップを有する複数の放熱体24を決められた位置へ設置させるようになっている。数個の放熱体24間には、絶縁フレーム242を設け、該絶縁フレーム242は蜂の巣状を呈す、或いは不規則な網状を呈している。   A power line 232 is disposed inside the LED bottom portion 22, and direct current power is supplied from the power line 232 to a light emitting diode (LED). A copper heat conduction base 23 is provided at the front end of the infrared bottom 22, and the volume of the copper heat conduction base 23 is larger than that of the radiator 24, absorbs the heat source of the radiator 24, and quickly diverges. It is supposed to do. A female screw 231 is provided at the front end of the copper heat conduction base 23, and a loading table 233 is provided at the front end of the female screw 231. The loading table 233 is configured to install a plurality of heat radiators 24 having LED chips at predetermined positions. An insulating frame 242 is provided between several heat radiators 24, and the insulating frame 242 has a honeycomb shape or an irregular net shape.

前記絶縁フレーム242は、前記放熱体24をしっかりと挟み込み、該放熱体24の前端の平面にLEDチップ241を設けている。前記放熱体24の質量は、LEDチップ241より大きいため、熱伝導優れ、且つ放熱製に優れている。前記フレーム242前端には、ランプカバー25が設けられており、該ランプカバー25内は放物線のアーチを呈し、異なる拡散角度を利用して該アーチ面はLEDチップに光源を集中して反射させ、並びにLEDチップ241の明るさも増すようになっている。前記ランプカバー25内縁には、おねじ251が設けられ、該おねじ251と銅製の熱伝導基台23のめねじ231とが螺合している。   The insulating frame 242 sandwiches the heat radiator 24 firmly, and an LED chip 241 is provided on the plane of the front end of the heat radiator 24. Since the mass of the radiator 24 is larger than the LED chip 241, it is excellent in heat conduction and excellent in heat dissipation. A lamp cover 25 is provided at the front end of the frame 242. The lamp cover 25 has a parabolic arch, and the arch surface uses a different diffusion angle to concentrate and reflect the light source on the LED chip. In addition, the brightness of the LED chip 241 is also increased. A male screw 251 is provided on the inner edge of the lamp cover 25, and the male screw 251 and the female screw 231 of the copper heat conduction base 23 are screwed together.

前記ランプカバー25は、固定と保護の役割を果たす外殻を形成し、並びに銅製の熱伝導基台23の熱エネルギーを直接吸収し、全体的に耐熱製及び衝撃製に優れた構造となっている。なお、図中符号252はガラス、26はLEDランプ構造体、27はレンズである。   The lamp cover 25 forms an outer shell that plays a role of fixing and protecting, and directly absorbs the heat energy of the copper heat conduction base 23, and has an overall structure excellent in heat resistance and shock. Yes. In the figure, reference numeral 252 denotes glass, 26 denotes an LED lamp structure, and 27 denotes a lens.

図5及び図6は本実施例の変形例を示している。この変形例は、熱伝導基台23を螺合するランプカバー25の代わりに、四角形状の放熱器28を用いたものである。   5 and 6 show a modification of the present embodiment. In this modification, a rectangular radiator 28 is used in place of the lamp cover 25 to which the heat conduction base 23 is screwed.

また図7ないし図9はさらに別の変形例を示している。この変形例は、熱伝導基台23を螺合するランプカバー25の代わりに、円形状の放熱器29を用いたものである。   7 to 9 show still another modification. In this modified example, a circular radiator 29 is used instead of the lamp cover 25 screwing the heat conduction base 23.

従来におけるLEDランプ構造の立体図である。It is a three-dimensional view of a conventional LED lamp structure. 本考案実施例におけるLEDランプの構造の分解斜視図である。It is a disassembled perspective view of the structure of the LED lamp in the Example of this invention. 本考案実施例におけるLEDランプの構造の斜視図である。It is a perspective view of the structure of the LED lamp in the Example of this invention. 本考案実施例におけるLEDランプの構造の断面図である。It is sectional drawing of the structure of the LED lamp in an Example of this invention. 変形例である四角形放熱器の分解斜視図である。It is a disassembled perspective view of the square heat radiator which is a modification. 図5の斜視図である。FIG. 6 is a perspective view of FIG. 5. 他の変形例である円形の放熱器の分解斜視図である。It is a disassembled perspective view of the circular heat radiator which is another modification. 図7における円形の放熱器の説明図である。It is explanatory drawing of the circular heat radiator in FIG. 図7におけるLEDランプの構造の説明図である。It is explanatory drawing of the structure of the LED lamp in FIG.

符号の説明Explanation of symbols

1 赤外線
2 LEDランプ
11 外殻
12 レンズ
13 LED
14 外カバー
21 LED底部外殻
211 おねじ
22 LED底部
221 めねじ
23 銅製の熱伝導基台
231 めねじ
232 電源線
233 積載台
24 放熱体
241 チップ
242 フレーム
25 ランプカバー
251 おねじ
252 ガラス
26 LEDランプ構造体
27 レンズ
28 四角形放熱器
29 円形放熱器
代理人 弁理士 伊藤 進
1 Infrared 2 LED lamp 11 Outer shell 12 Lens 13 LED
14 Outer cover 21 LED bottom shell 211 Male thread 22 LED bottom section 221 Female thread 23 Copper heat conduction base 231 Female thread 232 Power line 233 Loading base 24 Heat radiator 241 Chip 242 Frame 25 Lamp cover 251 Male thread 252 Glass 26 LED Lamp structure 27 Lens 28 Square radiator 29 Circular radiator agent Patent attorney Susumu Ito

Claims (4)

一面に平面又は凹面を形成し、別の片面を絶縁フレーム内に配置するLEDチップを配設した金、銀、銅、アルミニウムなどにより形成した金属製の放熱体と、
両端に異なるサイズのめねじを有し、一方のめねじをLED底部外殻に形成したおねじに螺合し、他方のめねじをランプカバーのおねじに螺合し、且つ該めねじの前端の平面に前記金属製の放熱体を配設し、この金属製の放熱体が吸収した熱エネルギーを吸収すると共に拡散する銅製の熱伝導基台と、
枠を有し、前記放熱体を挟み込み決められた位置に固定すると共に、片端を前記熱伝導基台の前端平面に配設した絶縁フレームと、
を備えたことを特徴とするLEDランプの構造。
A metal heat sink formed of gold, silver, copper, aluminum, etc., on which an LED chip is formed, in which a flat surface or a concave surface is formed on one surface and another surface is disposed in an insulating frame;
There are female screws of different sizes at both ends, one of the female screws is screwed to the male screw formed on the outer shell of the LED bottom, the other female screw is screwed to the male screw of the lamp cover, and A copper heat conduction base that disposes and diffuses the heat energy absorbed by the metal heat dissipating member by disposing the metal heat dissipating member on the front end plane;
An insulating frame having a frame, sandwiching and fixing the heat dissipating body at a predetermined position, and having one end disposed on a front end plane of the heat conduction base;
LED lamp structure characterized by comprising
前記放熱体の形状は、円柱形又は四角柱形を呈し、該金属製の放熱体は絶縁フレーム内に置かれ、前記熱伝導基台上に配設することを特徴とする請求項1に記載のLEDランプの構造。   The shape of the heat radiating body has a cylindrical shape or a quadrangular prism shape, and the heat radiating body made of metal is placed in an insulating frame and disposed on the heat conducting base. LED lamp structure. 前記熱伝導基台は、連結構造を有するため他の放熱装置と結合し、或いは該熱伝導基台自体が外形の構造となり、
且つ前記熱伝導基台の片端のめねじとLED底部外殻のおねじは螺合し、該めねじはLED底部外殻に螺合する以外に他の形体の放熱器に螺合することができ、
さらに該熱伝導基台内部に凹型溝を設け、該凹型溝はLEDランプの電源線のための導線孔とすることを特徴とする請求項1に記載のLEDランプの構造。
Since the heat conduction base has a connection structure, it is combined with another heat dissipation device, or the heat conduction base itself has an outer structure,
In addition, the internal thread of the one end of the heat conduction base and the external thread of the LED bottom shell are screwed together, and the female thread can be threaded to a radiator of another shape in addition to the LED bottom shell. Can
2. The LED lamp structure according to claim 1, further comprising a concave groove provided in the heat conduction base, wherein the concave groove is a conductive hole for a power line of the LED lamp.
前記ランプカバーは、前記熱伝導基台と螺合して放熱を助け、且つ該ランプカバー内縁は放物線状のアーチを呈し、該ランプカバー前端にレンズを設置することを特徴とする請求項1に記載のLEDランプの構造。


2. The lamp cover according to claim 1, wherein the lamp cover is screwed into the heat conduction base to assist heat dissipation, and an inner edge of the lamp cover has a parabolic arch, and a lens is installed at a front end of the lamp cover. The structure of the described LED lamp.


JP2004006576U 2004-11-09 2004-11-09 LED lamp structure Expired - Lifetime JP3108651U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011503786A (en) * 2007-11-05 2011-01-27 シカト・インコーポレイテッド Solid element lighting device
JP2011096658A (en) * 2009-11-02 2011-05-12 Foxsemicon Integrated Technology Inc Light emitting diode lamp

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011503786A (en) * 2007-11-05 2011-01-27 シカト・インコーポレイテッド Solid element lighting device
JP2011096658A (en) * 2009-11-02 2011-05-12 Foxsemicon Integrated Technology Inc Light emitting diode lamp

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