JP2011086870A - Substrate processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus avoiding a contact between a substrate and a plate and heating the substrate with a high uniformity. <P>SOLUTION: The substrate processing apparatus 1 includes a plurality of side rollers 20 arranged on both sides of the heating plate 10 and a plurality of center rollers 30 arranged at sections other than both ends on the heating plate 10. Because the substrate is conveyed while being supported on the side rollers 20 and the center rollers 30, the contact between the heating plate 10 and the substrate can be avoided. Furthermore, the center roller 30 is indirectly rotated via a drive shaft 53 arranged below the heating plate 10. Thus, the center roller 30 can be arranged at a position higher than the drive shaft 53, and a radius of the center roller 30 and a length of a through-hole for providing the center roller 30 can be set smaller. Therefore, the heating plate 10 can heat the substrate with the high uniformity. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus for performing a heat treatment on a substrate.

  In the manufacturing process of a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a PDP, or a substrate for a recording disk, a heat treatment is appropriately performed on the substrate. For example, in a photolithography process of a substrate, after a resist solution is applied to the surface of the substrate, heat treatment is performed on the substrate in order to improve adhesion between the surface of the substrate and the resist. A conventional substrate processing apparatus used for such heat treatment is disclosed in, for example, Patent Document 1.

JP 2008-16543 A

  The substrate processing apparatus of Patent Document 1 holds a substrate in a non-contact manner on a plate by discharging gas from a plurality of discharge holes. And the board | substrate is heated, conveying a board | substrate along the upper surface of a plate. However, in such a substrate processing apparatus, it is difficult to increase the distance between the upper surface of the plate and the lower surface of the substrate (the flying height of the substrate). For this reason, when the size of the substrate is large, the plate and the substrate may come into contact with each other due to warpage of the substrate due to heating.

  On the other hand, as shown in FIG. 15, if the through hole 111 is formed in the plate 110 and the roller 120 is disposed in the through hole 111 and the substrate 109 is transported on the roller 120, the plate 110 and the substrate 109 are arranged. The gap G can be made large. However, when the drive shaft 121 is disposed below the plate 110 and the roller 120 is attached to the drive shaft 121, the radius R of the roller 120 increases. Along with this, the dimension D in the transport direction of the through hole 111 also increases. In such a structure, the unevenness of heating due to the through hole 111 may increase.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a substrate processing apparatus that can prevent contact between a substrate and a plate and can heat the substrate with high uniformity.

  In order to solve the above-described problems, a first invention of the present application is a substrate processing apparatus for performing a heat treatment on a substrate, and includes a flat plate-like heating plate and a conveying unit that conveys the substrate along the upper surface of the heating plate. The conveying means includes a roller that rotates while supporting the lower surface of the substrate, and a driving means that indirectly rotates the roller via a driving shaft provided separately from the rotating shaft of the roller. And having.

  A second invention of the present application is the substrate processing apparatus of the first invention, wherein the drive shaft is disposed below the heating plate.

  A third invention of the present application is the substrate processing apparatus of the first invention or the second invention, wherein the roller is attached to a shaft or a bearing fixed to the heating plate.

  4th invention of this application is a substrate processing apparatus of 3rd invention, Comprising: The said roller is attached to the axis | shaft or bearing fixed to the lower surface of the member which comprises the said heating plate.

  A fifth invention of the present application is the substrate processing apparatus according to any one of the first to fourth inventions, wherein at least a part of the rotating shaft of the roller is disposed at a position higher than a lower surface of the heating plate.

  A sixth invention of the present application is the substrate processing apparatus according to any one of the first to fifth inventions, wherein the drive means uses a gear that utilizes mechanical tooth meshing to rotate the drive shaft. To the roller.

  A seventh invention of the present application is the substrate processing apparatus according to any one of the first to sixth inventions, wherein the drive means applies rotation of the drive shaft to the roller via a gear using magnetic force. introduce.

  An eighth invention of the present application is the substrate processing apparatus according to any one of the first to seventh inventions, wherein the rotation shaft of the roller and the drive shaft are orthogonal to each other in a top view, and the drive The means transmits the rotation of the drive shaft to the roller via a helical gear.

  A ninth invention of the present application is the substrate processing apparatus according to any one of the first to eighth inventions, wherein the heating plate includes first heating means for heating the substrate by radiant heat from the upper surface of the heating plate. And second heating means for heating the substrate by ejecting a high-temperature gas from the upper surface of the heating plate.

  A tenth aspect of the present invention is the substrate processing apparatus according to any one of the first to ninth aspects, wherein the roller is made of resin.

  An eleventh invention of the present application is the substrate processing apparatus according to any one of the first to tenth inventions, wherein the positions of all the rollers arranged on the heating plate in a direction perpendicular to the conveying direction are different. .

  According to the first to eleventh aspects of the present invention, since the substrate is supported by the roller, the contact between the substrate and the heating plate can be prevented. Further, the height position of the rotation shaft of the roller can be set to a position different from the drive shaft. For this reason, the radius of a roller can be set small. Therefore, the heating plate can heat the substrate with high uniformity.

  In particular, according to the second invention of the present application, since the drive shaft is disposed below the heating plate, heating unevenness and particle generation by the drive shaft can be suppressed.

  In particular, according to the third invention of the present application, even if the heating plate expands, the relative position between the roller and the heating plate hardly changes. For this reason, the dimension of the clearance gap between a heating plate and a roller can be designed small. Therefore, the heating plate can heat the substrate more uniformly.

  In particular, according to the fourth invention of the present application, the rotating shaft and the bearing are not exposed on the upper surface of the heating plate. For this reason, the heating plate can heat the substrate more uniformly.

  In particular, according to the fifth invention of the present application, the radius of the roller can be set smaller.

  In particular, according to the sixth aspect of the present invention, the rotation of the drive shaft can be more reliably transmitted to the roller.

  In particular, according to the seventh aspect of the present invention, the rotation of the drive shaft can be transmitted to the roller in a non-contact manner. For this reason, generation | occurrence | production of a particle can be suppressed.

  In particular, according to the eighth invention of the present application, it is possible to rotate only the rollers arranged at a specific width direction position.

  In particular, according to the ninth invention of the present application, the substrate can be more uniformly and efficiently heated by the radiant heat from the upper surface of the heating plate and the gas ejected from the upper surface of the heating plate.

  In particular, according to the tenth aspect of the present invention, it is possible to prevent the roller and the substrate from slipping and the substrate from being damaged.

  In particular, according to the eleventh aspect of the present invention, the roller can be prevented from hitting the same position on the substrate a plurality of times. Therefore, uneven heating of the substrate by the roller can be further suppressed.

It is the perspective view which looked at the substrate processing apparatus from the upper surface side. It is the perspective view which looked at the substrate processing apparatus from the lower surface side. It is a top view of a substrate processing apparatus. It is the longitudinal cross-sectional view of the substrate processing apparatus seen from the IV-IV position in FIG. It is a top view of a heating plate. It is a longitudinal cross-sectional view of the heating plate seen from the VI-VI position in FIG. It is a longitudinal cross-sectional view of a center roller and the site | part of the vicinity. It is the perspective view which looked at the vicinity of a center roller from the lower surface side. It is a longitudinal cross-sectional view of the center roller which concerns on a modification, and the site | part of the vicinity. It is a perspective view of the center roller and gear which concern on a modification. It is a top view of the center roller and gear which concern on a modification. It is a perspective view of the substrate processing apparatus which concerns on a modification. It is the figure which showed the side roller which concerns on a modification. It is a longitudinal cross-sectional view of the side roller which concerns on a modification, and the site | part of the vicinity. It is the figure which showed the roller attached to the drive shaft arrange | positioned under the plate.

  Embodiments of the present invention will be described below with reference to the drawings.

<1. Substrate Processing Apparatus According to One Embodiment>
FIG. 1 is a perspective view of a substrate processing apparatus 1 according to an embodiment of the present invention as viewed from the upper surface side. FIG. 2 is a perspective view of the substrate processing apparatus 1 as viewed from the lower surface side. FIG. 3 is a top view of the substrate processing apparatus 1. FIG. 4 is a longitudinal sectional view of the substrate processing apparatus 1 viewed from the position IV-IV in FIG. In the following description, the direction in which the substrate 9 is transported is referred to as “transport direction”, and the horizontal direction orthogonal to the transport direction is referred to as “width direction”. In each drawing of the present application, the conveyance direction and the width direction are indicated by arrows.

  The substrate processing apparatus 1 heat-treats the substrate 9 after resist application in a photolithography process for selectively etching the surface of a rectangular glass substrate 9 (hereinafter simply referred to as “substrate 9”) for a liquid crystal display device. It is a device for performing. In the manufacturing process of the substrate 9, a plurality of substrate processing apparatuses 1 are arranged in the transport direction. The substrate 9 is subjected to heat treatment while being transported on the plurality of substrate processing apparatuses 1.

  As shown in FIGS. 1 to 4, the substrate processing apparatus 1 includes a heating plate 10. The heating plate 10 is a plate for heating the substrate 9 conveyed along the upper surface thereof. The heating plate 10 is formed in a substantially rectangular flat plate shape. As shown in an enlarged view in FIG. 4, the heating plate 10 has a structure in which an upper plate 11, a lower plate 12, a heater 13, and a pressing plate 14 are stacked in order from the top.

  The upper plate 11, the lower plate 12, and the pressing plate 14 are made of a metal such as aluminum, for example. The holding plate 14 plays a role of holding the heater 13 with the lower plate 12. The heater 13 is a thin plate-like heating element. The heater 13 is formed by, for example, stainless steel etching, but may be formed of other materials. The heater 13 is connected to a predetermined power supply device (not shown).

  When a current is supplied from the power supply device to the heater 13, the heater 13 generates heat according to its resistance. The heat generated from the heater 13 is conducted to the lower plate 12 and the upper plate 11 to raise the temperature of the lower plate 12 and the upper plate 11. The substrate 9 transported on the heating plate 10 receives the radiant heat from the upper surface of the upper plate 11 and is heated.

  In addition, a plurality of jet ports 10 a are formed on the upper surface of the heating plate 10 to jet nitrogen gas heated toward the lower surface of the substrate 9. The plurality of jet nozzles 10 a are arranged on the upper surface of the heating plate 10 in the form of equidistant lattice points.

  FIG. 5 is a top view of the heating plate 10. FIG. 6 is a longitudinal sectional view of the heating plate 10 as viewed from the VI-VI position in FIG. As shown in FIGS. 5 and 6, an internal flow path 10 b for sending nitrogen gas to the plurality of jet nozzles 10 a is formed inside the heating plate 10. In the present embodiment, the space surrounded by the groove formed on the lower surface of the upper plate 11 and the upper surface of the lower plate 12 is the internal flow path 10b. The internal flow path 10b extends from the inlet 10c formed on the lower surface side of the heating plate 10 to each of the jet outlets 10a so as not to overlap the center roller 30 while branching into a plurality of lines.

  An air supply pipe 15a for supplying nitrogen gas to the internal flow path 10b is connected to the introduction port 10c. The upstream end of the air supply pipe 15a is connected to a nitrogen gas supply source 15b. Further, an open / close valve 15c and a heater 15d are interposed in the air supply pipe 15a.

  When the on-off valve 15c is opened, compressed nitrogen gas is supplied from the nitrogen gas supply source 15b to the supply pipe 15a. The nitrogen gas is heated by the heater 15d and then introduced into the internal flow path 10b through the introduction port 10c. Then, the nitrogen gas sent to each outlet 10a through the internal channel 10b is jetted upward from the plurality of jets 10a and blown to the lower surface of the substrate 9. The substrate 9 transported on the heating plate 10 receives heat from the heated nitrogen gas and is heated.

  As described above, the substrate processing apparatus 1 according to this embodiment includes the first heating unit that heats the substrate 9 by the radiant heat from the upper surface of the heating plate 10 and the substrate by ejecting high-temperature nitrogen gas from the upper surface of the heating plate 10. And a second heating means for heating 9. For this reason, the board | substrate 9 can be heated uniformly and efficiently rather than the case where the board | substrate 9 is heated only with radiant heat.

  Returning to FIGS. Four rollers 20 are disposed on both sides of the heating plate 10 (left and right side portions in the conveyance direction of the substrate 9) so as to be equally spaced in the conveyance direction. Hereinafter, the rollers 20 disposed on both sides of the heating plate 10 are referred to as “side rollers 20”. Each side roller 20 is disposed inside a recess 10 d formed on the side surface of the heating plate 10.

  The side roller 20 is formed integrally with the rotating shaft 21 and rotates together with the rotating shaft 21. The rotation shaft 21 is rotatably supported by the frames 40 disposed on the left and right sides of the heating plate 10. A motor 50 serving as a drive source for the side rollers 20 and a center roller 30 described later is disposed outside the frame 40. An endless belt 52 is stretched around the rotation shaft 21 of each side roller 20 and the rotation shaft 51 of the motor 50. When the motor 50 is operated, the rotational drive of the motor 50 is transmitted to each side roller 20 via the rotation shaft 51 of the motor 50, the endless belt 52, and the rotation shaft 21 of the side roller 20. Thereby, each side roller 20 rotates in the same direction.

  On the other hand, a plurality of rollers 30 are arranged at portions other than both side portions of the heating plate 10. Hereinafter, these rollers 30 arranged at portions other than both side portions of the heating plate 10 are referred to as “center rollers 30”. In this embodiment, four center rollers 30 are arranged at equal intervals in the width direction, and four rows of the center rollers 30 are arranged at equal intervals in the transport direction. That is, in the present embodiment, a total of 16 center rollers 30 are arranged at equal intervals in the transport direction and the width direction.

  A drive shaft 53 for transmitting the rotational drive of the motor 50 to the center roller 30 is disposed below the heating plate 10. The drive shaft 53 is rotatably supported by the frame 40 and a bearing block 60 described later. A gear 54 is attached to the end of the drive shaft 53 on the motor 50 side. The gear 54 is meshed with the gear 22 attached to the rotating shaft 21 of the side roller 20. When the motor 50 is operated, the rotation drive of the motor 50 is transmitted to the drive shaft 53 via the rotation shaft 51 of the motor 50, the endless belt 52, the rotation shaft 21 of the side roller 20, the gear 22, and the gear 54. . Thereby, the drive shaft 53 rotates.

  FIG. 7 is a longitudinal sectional view of the center roller 30 and the vicinity thereof. FIG. 8 is a perspective view of the vicinity of the center roller 30 as viewed from the lower surface side. The upper plate 11 of the heating plate 10 is formed with a through hole 10 e for securing a space for arranging the center roller 30. The upper part of the center roller 30 is located above the upper surface of the upper plate 11. Further, a concave portion 10 f communicating with the through hole 10 e is formed on the lower surface side of the heating plate 10.

  The center roller 30 is formed integrally with the rotation shaft 31 and rotates together with the rotation shaft 31. The rotating shaft 31 is rotatably supported by a bearing block 60 fixed to the lower surface of the upper plate 11. The drive shaft 53 is also rotatably supported by the same bearing block 60. Gears 32 and 55 that mesh with each other are attached to the rotary shaft 31 and the drive shaft 53. When the drive shaft 53 rotates, the rotation is transmitted to the center roller 30 via the gear 55, the gear 32, and the rotation shaft 31. Thereby, the center roller 30 rotates.

  In the present embodiment, one drive shaft 53 is provided for the two center rollers 30. One motor 50 is provided for the four drive shafts 53. With such a structure, the number of drive shafts 53 and motors 50 is suppressed. Also, with such a structure, variations in the rotational speed of each center roller 30 are suppressed.

  The plurality of side rollers 20 and the plurality of center rollers 30 rotate while supporting the lower surface of the substrate 9. Thereby, the board | substrate 9 is conveyed in a conveyance direction. Since the substrate processing apparatus 1 heats the substrate 9 while transporting the substrate 9 on the heating plate 10, the substrate 9 can be heated with high uniformity.

  The distance between the upper surface of the heating plate 10 and the lower surface of the substrate 9 is determined according to the dimensions of the upper plate 11, the bearing block 60, the rotating shaft 31, and the center roller 30. For this reason, the space | interval of the heating plate 10 and the board | substrate 9 can be taken larger than the case where the board | substrate 9 is levitated from the heating plate 10 only by blowing of gas. Even if the substrate 9 is warped by heating, at least the position of the center roller 30 maintains the distance between the heating plate 10 and the substrate 9. Thereby, contact with the heating plate 10 and the board | substrate 9 is suppressed.

  Further, the substrate processing apparatus 1 rotates the center roller 30 indirectly by rotating a drive shaft 53 provided separately from the rotation shaft 31 of the center roller 30. For this reason, the rotation shaft 31 of the center roller 30 can be arranged at a position different from the drive shaft 53. In the present embodiment, the rotation shaft 31 of the center roller 30 is disposed at a position higher than the drive shaft 53, thereby setting the radius of the center roller 30 to be small. If the radius of the center roller 30 is set small, the dimension in the transport direction of the through hole 10e formed in the upper plate 11 can also be set small. As a result, heating unevenness of the substrate 9 due to the through hole 10e can be suppressed, and the substrate 9 can be heated with high uniformity.

  In particular, as shown in FIG. 7, the thickness of the heating plate 10 is d1, the distance between the upper surface of the heating plate 10 and the lower surface of the substrate 9 is d2, the radius of the center roller 30 is d3, and the radius of the rotating shaft 31 is d4. Sometimes, it is preferable that the relationship d1 + d2> d3-d4 is established. If such a dimensional relationship is established, at least a part of the rotation shaft 31 of the center roller 30 is disposed at a position higher than the lower surface of the heating plate 10. Thereby, the radius of the center roller 30 can be set smaller.

  In the present embodiment, the drive shaft 53 is disposed below the heating plate 10. For this reason, it is not necessary to form a hole or groove for arranging the drive shaft 53 in the heating plate 10. Further, particles that may be generated by the rotation of the drive shaft 53 are also prevented from adhering to the substrate 9.

  Further, the center roller 30 of this embodiment is attached to a bearing block 60 fixed to the heating plate 10 itself. For this reason, even if the heating plate 10 expands due to the temperature rise, the relative position between the heating plate 10 and the center roller 30 hardly changes. Therefore, the dimension of the gap between the inner surface of the through hole 10e and the center roller 30 can be designed to be small. Thereby, the heating nonuniformity of the board | substrate 9 by the through-hole 10e can further be suppressed.

  In particular, the bearing block 60 of the present embodiment is fixed to the lower surface of the upper plate 11. For this reason, mechanisms such as the bearing block 60, the rotating shaft 31, and the gear 32 are not exposed on the upper surface of the heating plate 10. Thereby, the heating plate 10 can heat the substrate 9 more uniformly. Further, the particles that can be generated from these mechanisms are also prevented from adhering to the substrate 9.

  In the present embodiment, the rotation of the drive shaft 53 is transmitted to the rotation shaft 31 of the center roller 30 via gears 55 and 32 using mechanical tooth meshing. For this reason, the rotation of the drive shaft 53 can be transmitted to the center roller 30 more reliably.

  Further, as shown in FIG. 7, the center roller 30 has an arc shape whose end surface swells outward in a cross section perpendicular to the transport direction. Thereby, the contact area between the end surface of the center roller 30 and the lower surface of the substrate 9 is suppressed, and the substrate 9 is heated more uniformly.

  The side roller 20 and the center roller 30 are formed of a resin having high heat resistance and high wear resistance. As such a resin, for example, polyether ether ketone (PEEK) can be used. Further, the side roller 20 and the center roller 30 may be formed of a metal such as stainless steel. However, in order to prevent the roller and the substrate 9 from slipping and the substrate 9 from being damaged, it is preferable to form the side roller 20 and the center roller 30 from resin.

<2. Modification>
Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment.

  In the above embodiment, the gears 55 and 32 using the meshing of mechanical teeth are used. However, the rotation of the drive shaft 53 may be transmitted to the center roller 30 through another mechanism. For example, the rotation of the drive shaft 53 may be transmitted to the center roller 30 via a belt stretched between the drive shaft 53 and the rotation shaft 31 of the center roller 30.

  Further, as shown in FIG. 9, the rotation of the drive shaft 53 may be transmitted to the rotation shaft 31 of the center roller 30 via gears 55A and 32A using magnetic force. In the example of FIG. 9, a gear 55A is attached to the drive shaft 53, and a magnetic pole portion 551 is formed on the end surface of the gear 55A. A gear 32A is attached to the rotation shaft 31 of the center roller 30, and a magnetic pole portion 321 is formed on the end surface of the gear 32A. Therefore, when the drive shaft 53 is rotated, the rotation shaft 31 of the center roller 30 is rotated by the magnetic action of the magnetic pole portion 551 of the gear 55A and the magnetic pole portion 321 of the gear 32A.

  Further, as shown in FIG. 10, a magnetic pole portion 301 may be provided on the center roller 30 itself. In the example of FIG. 10, a gear 55B is attached to the drive shaft 53, and a magnetic pole portion 552 is formed on the surface of the gear 55B facing the center roller 30. Therefore, when the drive shaft 53 is rotated, the center roller 30 is rotated by a magnetic action between the magnetic pole portion 552 of the gear 55B and the magnetic pole portion 301 of the center roller 30.

  As shown in FIGS. 9 and 10, if the magnetic force is used, the rotation of the drive shaft 53 can be transmitted to the center roller 30 without contact. For this reason, generation | occurrence | production of the particle by contact of a member can be suppressed.

  Further, as shown in FIG. 11, the rotation of the drive shaft 53 may be transmitted to the rotation shaft 31 of the center roller 30 via the helical gears 55C and 32C. In the example of FIG. 11, the drive shaft 53 extends in a direction orthogonal to the rotation shaft 31 of the center roller 30 in the top view (that is, the transport direction). Helical gears 55C and 32C having helical teeth are attached to the drive shaft 53 and the rotation shaft 31 of the center roller 30 so as to mesh with each other. For this reason, when the drive shaft 53 is rotated, the rotation shaft 31 of the center roller 30 is also rotated.

  As shown in FIG. 11, if the drive shaft 53 is extended in the transport direction, only the center roller 30 arranged at a specific width direction position can be rotated. For this reason, the number of drive shafts 53 can be reduced depending on the arrangement of the center rollers 30 to be rotated.

  In the above embodiment, the center roller 30 is formed integrally with the rotation shaft 31 and rotates together with the rotation shaft 31. However, the center roller 30 is attached to the rotation shaft 31 fixed to the heating plate 10. On the other hand, you may rotate.

  In the above embodiment, the plurality of center rollers 30 are arranged at regular intervals in the conveyance direction and the width direction. However, the intervals in the conveyance direction and the width direction of the center rollers 30 are not necessarily constant. Good.

  In the above embodiment, four center rollers 30 are arranged in the transport direction at the same position in the width direction, but the positions in the width direction of these center rollers 30 may be different. For example, as shown in FIG. 12, the positions in the width direction of all the center rollers 30 arranged on the heating plate 10 may be different. In this way, it is possible to prevent the center roller 30 from hitting the same position of the substrate 9 a plurality of times in one substrate processing apparatus 1. Therefore, uneven heating of the substrate 9 by the center roller 30 can be further suppressed.

  In the above embodiment, the side roller 20 is in contact with the lower surface of the substrate 9, but the side roller 20 that is in contact with the upper surface of the substrate 9 may be further arranged. For example, as shown in FIG. 13, the pair of side rollers 20 may rotate while sandwiching the substrate 9 from above and below. In this way, the substrate 9 can be transported more reliably. Further, as shown in FIG. 14, the side roller 20 may be rotated about an axis extending vertically while being in contact with the end surface of the substrate 9.

  In the above embodiment, the side roller 20 is rotated by receiving the rotational drive from the motor 50. However, the side roller 20 may be a free roller that does not receive the rotational drive from the motor 50. Good. In addition, free rollers that are not subjected to rotational driving from the motor 50 may be further disposed at portions other than both sides of the heating plate 10.

  Moreover, in said embodiment, nitrogen gas was discharged from the several jet nozzle 10a, However, Instead of nitrogen gas, you may discharge other gas, such as clean air. However, in order to prevent an unintended chemical reaction from occurring on the surface of the substrate 9, it is preferable to use an inert gas such as nitrogen gas.

  In the above embodiment, the plurality of jet nozzles 10a are arranged at regular intervals in the transport direction and the width direction. However, the intervals in the transport direction and the width direction of the jet nozzles 10a may not be constant. Good.

  Further, in the above embodiment, the substrate 9 is heated by the radiant heat from the heating plate 10 and the blowing of nitrogen gas, but it is not always necessary to include such two types of heating means. For example, the substrate 9 may be heated only by radiant heat without ejecting gas from the upper surface of the heating plate 10.

  The substrate processing apparatus 1 described above is a device that performs heat treatment on a rectangular glass substrate for a liquid crystal display device. However, the substrate processing apparatus of the present invention includes a semiconductor wafer, a glass substrate for PDP, and a recording disk. A heat treatment may be performed on another substrate such as an industrial substrate.

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 9 Substrate 10 Heating plate 10a Spout 10b Internal flow path 10c Inlet 10d Recess 10e Through hole 10f Recess 11 Upper plate 12 Lower plate 13 Heater 14 Holding plate 20 Side roller 21 Rotating shaft 22 Gear 30 Center roller 31 Rotation Shaft 32, 32A Gear 32C Helical gear 40 Frame 50 Motor 51 Rotating shaft 52 Endless belt 53 Drive shaft 54 Gear 55, 55A, 55B Gear 55C Helical gear 60 Bearing block

Claims (11)

A substrate processing apparatus for performing a heat treatment on a substrate,
A flat heating plate;
Transport means for transporting the substrate along the upper surface of the heating plate;
With
The conveying means is
A roller that rotates while supporting the lower surface of the substrate;
Drive means for indirectly rotating the roller via a drive shaft provided separately from the rotation shaft of the roller;
A substrate processing apparatus. The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the drive shaft is disposed below the heating plate. The substrate processing apparatus according to claim 1 or 2, wherein
The substrate processing apparatus, wherein the roller is attached to a shaft or a bearing fixed to the heating plate. The substrate processing apparatus according to claim 1 or 2, wherein
The substrate processing apparatus, wherein the roller is attached to a shaft or a bearing fixed to a lower surface of a member constituting the heating plate. A substrate processing apparatus according to any one of claims 1 to 4, wherein
The substrate processing apparatus, wherein at least a part of a rotating shaft of the roller is disposed at a position higher than a lower surface of the heating plate. A substrate processing apparatus according to any one of claims 1 to 5, wherein
The substrate processing apparatus, wherein the drive means transmits the rotation of the drive shaft to the roller via a gear using mechanical tooth meshing. A substrate processing apparatus according to any one of claims 1 to 6,
The substrate processing apparatus, wherein the drive means transmits the rotation of the drive shaft to the roller through a gear using magnetic force. A substrate processing apparatus according to any one of claims 1 to 7,
The rotating shaft of the roller and the drive shaft are orthogonal to each other when viewed from above.
The substrate processing apparatus, wherein the drive means transmits the rotation of the drive shaft to the roller via a helical gear. A substrate processing apparatus according to any one of claims 1 to 8,
The heating plate is
First heating means for heating the substrate by radiant heat from the upper surface of the heating plate;
A second heating means for heating the substrate by ejecting a high-temperature gas from the upper surface of the heating plate;
A substrate processing apparatus. A substrate processing apparatus according to any one of claims 1 to 9, wherein
The roller is a substrate processing apparatus formed of resin. A substrate processing apparatus according to any one of claims 1 to 10, wherein
A substrate processing apparatus in which positions of all rollers arranged on the heating plate are different from each other in a direction orthogonal to a transport direction.

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