JP2011086871A - Substrate processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technique for reducing the occurrence of heating unevenness in heat processing on a substrate while suppressing a remarkable increase in substrate processing cost. <P>SOLUTION: A heating plate 9 is provided with a discharge port 101 for jetting a heated gas at a surface part opposed to the substrate 9. The discharge port 101 comprises: a first hole H1 having a relatively wide opening; and a second hole H2 communicating with the first hole H1 and an internal flow passage 102 and having a relatively narrow opening. Thus, the opening of the first hole H1 is relatively wide, so that air having passed through the second hole H2 is spread over the entire opening in the first hole H1, and consequently the flow velocity of the air jetting from the discharge port 101 can be reduced. Local heating of the substrate 9 is therefore reducible. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus that heat-treats a substrate.

  In the manufacturing process of a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a PDP, or a substrate for a recording disk, a heat treatment is appropriately performed on the substrate. For example, in the photolithography process of the substrate, after the resist solution is applied to the surface of the substrate, the substrate is heat-treated in order to improve the adhesion between the surface of the substrate and the resist. A substrate processing apparatus that performs such heat treatment is disclosed in Patent Document 1, for example.

  The substrate processing apparatus of patent document 1 heat-processes, giving a floating force to a board | substrate on a high temperature plate by discharging gas from several discharge holes. Moreover, the heat processing of a board | substrate is accelerated | stimulated by spraying the gas heated previously on a board | substrate.

JP 2008-16543 A

  However, in the conventional substrate processing apparatus, a temperature difference is likely to occur between the portion where the gas is blown and the portion where the gas is not sprayed on the surface of the substrate, which may cause uneven heating. Therefore, there is a demand for a technique for suppressing the occurrence of uneven heating.

  For example, the occurrence of uneven heating can be suppressed to some extent by increasing the separation distance between the substrate and the plate. However, in this case, in order to maintain the heating efficiency, it is necessary to increase the amount of gas blown to the substrate or to further increase the temperature of the gas. In either case, the processing cost of the substrate is greatly increased. Will increase.

  Therefore, the present application provides a technique for reducing the occurrence of heating unevenness in the substrate heat treatment while suppressing a significant increase in substrate processing costs.

  In order to solve the above-described problem, a first aspect is a substrate processing apparatus for heat-treating a substrate, wherein the substrate is heated in a planar shape, provided with a discharge port for ejecting gas at a portion of the surface facing the substrate. And a gas supply unit that supplies the gas to be ejected from the discharge port to the inside of the plate, and the discharge port includes a portion having an opening that increases from the inside toward the surface of the plate.

  According to a second aspect, in the substrate processing apparatus according to the first aspect, the gas ejected from the discharge port is heated to a predetermined temperature.

  According to a third aspect, in the substrate processing apparatus according to the first or second aspect, the discharge port includes a portion in which an opening increases concentrically from the inside toward the surface.

  According to a fourth aspect, in the substrate processing apparatus according to any one of the first to third aspects, the discharge port has a slit-like hole that opens in a slit shape on the surface, and the size of the opening is the above-described size. The connecting hole is smaller than the slit-shaped hole and communicates with the slit-shaped hole.

  According to a fifth aspect, in the substrate processing apparatus according to any one of the first to fourth aspects, the inner wall surface of the discharge port gradually increases in size from the inside toward the surface. So as to include an inclined portion.

  According to a sixth aspect, in the substrate processing apparatus according to any one of the first to fifth aspects, the discharge port has a discontinuous increase in size from the inside toward the surface. And forms a staying portion in which the gas stays.

  According to the substrate processing apparatus according to the first to fifth aspects, it is possible to moderately reduce the gas flow velocity while maintaining the flow rate of the gas ejected from the discharge port. Therefore, the occurrence of uneven heating can be reduced.

  In particular, according to the substrate processing apparatus according to the second aspect, since the flow rate of the high-temperature gas ejected from the discharge port can be weakened, the occurrence of uneven heating can be reduced while promoting the heat treatment of the substrate.

  In particular, according to the substrate processing apparatus which concerns on a 3rd aspect, since the discharge port is provided concentrically, the flow velocity of the gas ejected from a discharge port can be suppressed comparatively uniformly. Therefore, the occurrence of uneven heating can be reduced.

  In particular, according to the substrate processing apparatus which concerns on a 4th aspect, the flow velocity of gas can be moderately weakened by making the opening shape of a discharge outlet into a slit shape.

  In particular, according to the substrate processing apparatus which concerns on a 5th aspect, since the flow of gas spreads in a discharge outlet along an inclined surface, gas can be uniformly ejected from the whole discharge outlet.

  In particular, according to the substrate processing apparatus which concerns on a 6th aspect, a part of gas ejected from a discharge outlet can be temporarily retained in a discharge outlet by changing the magnitude | size of an opening discontinuously. Therefore, the flow velocity of the gas ejected from the discharge port can be moderately reduced.

1 is a perspective view of a substrate processing apparatus according to a first embodiment. It is a top view of a substrate processing apparatus. It is the III-III sectional view taken on the line shown in FIG. It is a top view of a heating plate. It is the VV sectional view taken on the line shown in FIG. It is a perspective view which expands and shows the discharge port vicinity of a heating plate. It is a longitudinal cross-sectional view which expands and shows the discharge outlet part of a heating plate. It is a longitudinal cross-sectional view of a free roller and the site | part of the vicinity. It is a top view of the heating plate which concerns on 2nd Embodiment. It is a perspective view which expands and shows the discharge port vicinity of a heating plate. It is a perspective view which expands and shows the discharge outlet vicinity of the heating plate which concerns on 3rd Embodiment. It is a perspective view which expands and shows the discharge outlet vicinity of the heating plate which concerns on 4th Embodiment. It is a side view which shows the other example of arrangement | positioning of a conveyance roller. It is sectional drawing which shows the other example of arrangement | positioning of a conveyance roller and a free roller.

  Hereinafter, embodiments will be described with reference to the drawings.

<1. First Embodiment>
FIG. 1 is a perspective view of a substrate processing apparatus 1 according to the first embodiment. FIG. 2 is a top view of the substrate processing apparatus 1. 3 is a cross-sectional view taken along line III-III shown in FIG. In the following description, the direction in which the substrate 9 is transported is referred to as “transport direction”, and the horizontal direction orthogonal to the transport direction is referred to as “width direction”. In the drawings, the conveyance direction and the width direction are indicated by arrows. However, this is defined for convenience of explanation, and does not limit the positional relationship of each element described below.

  The substrate processing apparatus 1 heat-treats the substrate 9 after resist application in a photolithography process in which a surface of a rectangular glass substrate 9 for liquid crystal display device (hereinafter simply referred to as “substrate 9”) is selectively etched. Device. In the manufacturing process of the substrate 9, for example, a plurality of substrate processing apparatuses 1 are arranged along the transport direction. The substrate 9 is subjected to heat treatment while being transported on the plurality of substrate processing apparatuses 1.

  As shown in FIGS. 1 to 3, the substrate processing apparatus 1 includes a heating plate 10. The heating plate 10 is a plate for heating the substrate 9 conveyed along the upper surface thereof. The heating plate 10 is formed in a substantially rectangular flat plate shape. As shown in an enlarged manner in FIG. 3, the heating plate 10 has a structure in which an upper plate 11, a lower plate 12, a heater 13, and a pressing plate 14 are laminated in order from the top.

  The upper plate 11, the lower plate 12, and the pressing plate 14 are made of a metal such as aluminum, for example. The holding plate 14 plays a role of holding the heater 13 with the lower plate 12. The heater 13 is a thin plate-like heating element and is formed by, for example, etching of stainless steel, but is not limited to this. The heater 13 is connected to a predetermined power supply device (not shown).

  When a current is supplied from the power supply device to the heater 13, the heater 13 generates heat according to its resistance. The heat generated from the heater 13 is conducted to the lower plate 12 and the upper plate 11 to raise the temperature of the lower plate 12 and the upper plate 11. The substrate 9 transported on the heating plate 10 is heated by receiving radiant heat from the upper surface of the upper plate 11.

  A plurality of discharge ports 101 are formed on the upper surface of the heating plate 10 to eject clean air heated toward the lower surface of the substrate 9. The discharge ports 101 are arranged at equal intervals along the transport direction and the width direction on the upper surface of the heating plate 10.

  FIG. 4 is a top view of the heating plate 10. FIG. 5 is a cross-sectional view taken along line VV shown in FIG. As shown in FIGS. 4 and 5, an internal flow path 102 for sending air to the plurality of discharge ports 101 is formed inside the heating plate 10. In the present embodiment, a space surrounded by the groove formed on the lower surface of the upper plate 11 and the upper surface of the lower plate 12 is the internal flow path 102. The internal flow path 102 extends from the introduction port 103 formed on the lower surface side of the heating plate 10 to each discharge port 101 so as not to overlap the free roller 30 while branching into a plurality of lines.

  An air supply pipe 151 for supplying air to the internal flow path 102 is connected to the introduction port 103. The upstream end of the supply pipe 151 is connected to the air supply source 152. In addition, an opening / closing valve 153 and a heater 154 are interposed in the air supply pipe 151.

  When the on-off valve 153 is opened, compressed air is supplied from the air supply source 152 to the air supply pipe 151. The air is heated by the heater 154 and then introduced into the internal flow path 102 through the introduction port 103. Then, the air sent to each discharge port 101 through the internal flow path 102 is ejected upward from the plurality of discharge ports 101 and blown to the lower surface of the substrate 9. The substrate 9 transported on the heating plate 10 is heated by receiving heat from a relatively high temperature air, and is given a levitation force for floating on the surface of the heating plate 10.

  As described above, the substrate processing apparatus 1 according to this embodiment includes the first heating unit that heats the substrate 9 by radiant heat from the upper surface of the heating plate 10 and the substrate 9 by ejecting high-temperature air from the upper surface of the heating plate 10. And a second heating means for heating. For this reason, the board | substrate 9 can be heated more efficiently than the case where the board | substrate 9 is heated only with radiant heat.

  FIG. 6 is an enlarged perspective view showing the vicinity of the discharge port 101 of the heating plate 10. FIG. 7 is an enlarged vertical sectional view showing the discharge port 101 portion of the heating plate 10. As shown in FIGS. 6 and 7, the discharge port 101 spatially communicates with the first hole H <b> 1 provided in a cylindrical shape on the upper surface portion of the heating plate 10, the first hole H <b> 1, and the internal channel 102. It is formed with a cylindrical second hole H2.

  The center positions of the first hole H1 and the second hole H2 coincide with the axis P extending along the depth direction (here, the vertical direction) of the discharge hole 101. Thus, the 1st hole H1 and the 2nd hole H2 are opened concentrically. In other words, when the discharge hole 101 is viewed from above, the edge portions of the first hole H1 and the second hole H2 form concentric circles.

  The diameter b of the second hole H2 is smaller than the diameter a of the first hole H1 (a> b), and the diameter of the discharge port 101 is increased from the inside toward the upper surface of the heating plate 10. More specifically, the aperture diameter of the discharge port 101 changes discontinuously from b to a at the boundary between the first hole H1 and the second hole H2.

  The air supplied to the internal flow path 102 first enters the second hole H2, as indicated by an arrow in FIG. At the boundary portion between the first hole H1 and the second hole H2, the diameter of the discharge hole 101 is widened, so that part of the air flows so as to spread laterally in the first hole H1, and further, the first hole H1. It hits the inner wall surface H1S and flows downward. Therefore, the 1st hole H1 forms the residence part in which air stays temporarily.

  Further, since such a staying portion is formed, the flow velocity of the air ejected from the discharge port 101 is moderately reduced. Therefore, air can be gently applied to the substrate 9 and air can be ejected to a relatively wide range (at least a range wider than the opening of the first hole H1). Thereby, it can suppress that the board | substrate 9 raises temperature locally. Moreover, since the flow rate of the air ejected from the ejection holes 101 does not change, the heating efficiency of the substrate 9 is maintained.

  In order to sufficiently suppress the air flow rate, it is preferable that the depth h of the first hole H1 is sufficiently larger than the diameter b of the second hole H2. By deepening the first hole H1, the air flow can be sufficiently expanded toward the inner wall surface H1S in the portion of the first hole H1 having a wide diameter. Thereby, the flow velocity of air can be weakened favorably.

  Further, when the openings are formed concentrically like the discharge port 101, the air flow velocity at each position of the discharge port 101 is easily distributed symmetrically about the axis P. Therefore, it becomes easy to uniformly weaken the flow velocity of the air ejected from the discharge port 101.

  In addition, in this embodiment, although the opening shape of the 1st hole H1 and the 2nd hole H2 is made into circular, you may make it polygonal, such as an ellipse or a tetragon | quadrangle. Further, it is not hindered to further provide a hole having a different opening size from the second hole H2 between the second hole H2 and the internal flow path 102.

  Returning to FIGS. 1 to 3, four drive rollers 20 are arranged at equal intervals in the transport direction on both sides of the heating plate 10 (left and right sides in the transport direction of the substrate 9). Yes. Each drive roller 20 is disposed inside a recess 104 formed on the side surface of the heating plate 10.

  The drive shaft 21 of each drive roller 20 is rotatably supported by frames 22 arranged on the left and right sides of the heating plate 10. The frame 22 is a separate member from the heating plate 10. A motor 23 serving as a drive source for the drive roller 20 is disposed outside the frame 22. An endless belt 24 is stretched around the drive shaft 21 of each drive roller 20 and the drive shaft 231 of the motor 23. When the motor 23 is operated, the driving force generated from the motor 23 is transmitted to each driving roller 20 via the endless belt 24. Thereby, each drive roller 20 rotates actively in the same direction. The substrate 9 supported on the drive roller 20 is transported in the transport direction by the rotation of the drive roller 20.

  On the other hand, a plurality of free rollers 30 are arranged at portions other than both side portions of the heating plate 10. In the present embodiment, four free rollers 30 are arranged at equal intervals in the width direction, and four rows of the free rollers 30 are arranged at equal intervals in the transport direction. That is, in this embodiment, a total of 16 free rollers 30 are arranged at equal intervals in the transport direction and the width direction.

  FIG. 8 is a longitudinal sectional view of the free roller 30 and the vicinity thereof. As shown in FIG. 8, the upper plate 11 of the heating plate 10 is formed with a through hole 105 for securing a space for arranging the free roller 30. The upper part of the free roller 30 is located above the upper surface of the upper plate 11. Further, the lower plate 12, the heater 13, and the pressing plate 14 are formed with through holes 106 that are larger in the width direction than the through holes 105.

  The rotation shaft 31 of the free roller 30 is fixed to the lower surface of the upper plate 11 with bolts 311. The free roller 30 is rotatably attached to the rotary shaft 31 via a bearing 32. The free roller 30 is not connected to a drive source such as a motor. For this reason, the free roller 30 does not actively rotate. The free roller 30 is rotated following the movement of the substrate 9 while supporting the lower surface of the substrate 9.

  As described above, the substrate 9 is transported along the upper surface of the heating plate 10 while being supported on the driving roller 20 and the free roller 30. That is, in the present embodiment, the drive roller 20 and the free roller 30 constitute a transport unit that transports the substrate 9. Further, when the substrate 9 is transported, the heating plate 10 holds the substrate 9 by the driving roller 20 and the free roller 30.

  The distance between the upper surface of the heating plate 10 and the lower surface of the substrate 9 is determined according to the dimensions of the upper plate 11, the rotating shaft 31, and the free roller 30. For this reason, the space | interval of the heating plate 10 and the board | substrate 9 can be taken larger than the case where the board | substrate 9 is levitated from the heating plate 10 only by blowing of gas. Further, when the substrate 9 is large in size, even if the substrate 9 is warped by heating, the distance between the heating plate 10 and the substrate 9 is maintained at least at the position of the free roller 30. Thereby, it can suppress that the board | substrate 9 contacts the heating plate 10 during conveyance.

  Moreover, the free roller 30 arrange | positioned in parts other than the side part of the heating plate 10 is not connected to drive sources, such as a motor. For this reason, the height position of the rotation shaft 31 of the free roller 30 is not limited to the position of the drive shaft extending from the drive source. Therefore, by arranging the rotation shaft 31 of the free roller 30 at a higher position, the radius of the free roller 30 can be further reduced, so that the dimension in the transport direction of the through hole 105 formed in the upper plate 11 is also small. can do. Thereby, heating unevenness of the substrate 9 due to the through hole 105 can be suppressed, and the surface of the substrate 9 can be heated more uniformly.

  The drive roller 20 and the free roller 30 are formed of a resin having high heat resistance and high wear resistance. As such a resin, for example, polyether ether ketone (PEEK) can be used. Further, the drive roller 20 and the free roller 30 may be formed of a metal such as stainless steel. However, in order to prevent the roller and the substrate 9 from slipping and the substrate 9 from being damaged, it is preferable that the drive roller 20 and the free roller 30 are formed of resin.

<2. Second Embodiment>
In the above embodiment, the discharge port 101 formed by the first hole H1 and the second hole H2 opening concentrically is provided in the heating plate 10, but the shape of the discharge port is limited to this. Absent. In the following description, elements having the same functions as those in the first embodiment are appropriately denoted by the same reference numerals and description thereof is omitted.

  FIG. 9 is a top view of the heating plate 10a according to the second embodiment. FIG. 10 is an enlarged perspective view showing the vicinity of the discharge port 101a of the heating plate 10a. As shown in FIG. 9, a slit-like discharge port 101a extending in the width direction is provided on the surface of the heating plate 10a of the present embodiment. In the present embodiment, the discharge port 101a is provided along the direction in which the internal flow path 102 extends.

  As shown in FIG. 10, the discharge port 101a of the present embodiment has a plurality of spatially communicating with the first hole H1a that opens in a slit shape on the surface portion of the heating plate 10a and the bottom of the first hole H1a ( In the example shown in FIG. 9, it is formed with 5) second holes H2.

  The length of the slit-shaped opening of the first hole H1a (length in the width direction) is larger than the diameter of the opening of the second hole H2. Therefore, the opening size of the discharge port 101a increases toward the surface of the heating plate 10a. The air supplied to the internal flow path 102 and passing through the second hole H2 is diffused not only in the upper direction but also in the extending direction (width direction) of the slit-like hole H1a in the first hole H1a. Therefore, the flow velocity of the air ejected from the discharge port 101a can be satisfactorily reduced.

  Further, by extending the discharge port 101a in a slit shape, high-temperature air can be ejected in a curtain shape. By applying such air to the substrate 9 moving on the heating plate 10a, the substrate 9 can be heated more uniformly.

  Note that the width of the opening of the discharge port 101a (the length in the transport direction) may be the same as the diameter of the opening of the second hole H2. Further, in the present embodiment, the discharge port 101a extends in the width direction, but it is not hindered to extend in the transport direction or in an oblique direction with respect to the width direction. In addition, the slit-shaped opening may be bent not only in a straight line but also in the middle or in a curved line.

<3. Third Embodiment>
In the first embodiment, the size of the opening of the discharge port 101 is discontinuously changed, but the shape of the discharge port 101 is not limited to this.

  FIG. 11 is an enlarged perspective view showing the vicinity of the discharge port 101b of the heating plate 10b according to the third embodiment. The first hole H1b that forms the upper surface portion of the heating plate 10b of the discharge port 101b of this embodiment has an inner wall surface H1Sb that extends from the inside of the discharge port 101b toward the upper surface of the heating plate 10a, and the opening of the discharge port 101b is large. It becomes the inclined surface which inclines like this.

  More specifically, the first hole H1b is formed such that the diameter of the first hole H1b gradually increases from the inside toward the upper surface of the heating plate 10a. The second hole H2 communicates spatially at the bottom of the first hole H1b.

  By providing such a first hole H1b, part of the air that has passed through the second hole H2 flows along the inner wall surface H1Sb (inclined surface) of the first hole H1b. Therefore, air can be easily ejected uniformly from the entire opening of the discharge hole 101b, so that the occurrence of uneven heating is reduced.

  In the first hole H1b as well, when the angle of inclination of the inclined surface is made relatively gentle, a retention portion where air stays temporarily is formed as in the first hole H1 of the first embodiment. It becomes easy.

<4. Fourth Embodiment>
In the third embodiment, the size of the opening of the discharge port 101b is gradually increased by linearly inclining the inner wall surface H1Sb of the first hole H1b with respect to the depth direction of the hole. However, the shape of the discharge port 101b is not limited to this.

  FIG. 12 is an enlarged perspective view showing the vicinity of the discharge port 101c of the heating plate 10c according to the fourth embodiment. The inner wall surface H1Sc of the first hole H1c forms a curved surface so that the opening gradually increases from the inside of the discharge port 101c toward the upper surface of the heating plate 10c.

  Even in the case of such a discharge port 101c, air can be easily ejected uniformly from the entire opening of the discharge port 101c, similarly to the discharge port 101b of the third embodiment.

  In the present embodiment, the inclination angle of the inner wall surface H1Sc of the first hole H1c gradually increases from the inside toward the upper surface of the heating plate 10c. On the contrary, the opening of the discharge port 101c may be enlarged so that the inclination angle of the inner wall surface H1Sc gradually decreases. In this case, the first hole H1c is formed in a trumpet shape.

  In the third and fourth embodiments, the inner wall surfaces H1Sb and H1Sc of the first holes H1b and H1c are inclined, but the inner wall surface of the second hole H2 may be inclined.

<5. Modification>
Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment.

  Further, the free rollers 30 do not necessarily have to be arranged at regular intervals, and may be arranged so that there are sparse or dense portions on the heating plate 10. Further, the ejection holes 112 are not necessarily provided at equal intervals, and may be provided so that there are sparse or dense portions on the heating plate 10.

  In the present embodiment, the actively rotating drive roller 20 is brought into contact with only the lower surface of the substrate 9. However, as shown in FIG. 13, for example, a drive roller 20 that is in contact with the upper surface of the substrate 9 is further provided. May be. Since the pair of drive rollers 20 rotate while sandwiching the substrate 9 from above and below, the substrate 9 can be more reliably transported. Note that the upper or lower drive roller 20 may be replaced with a free roller 30.

  In the present embodiment, the drive roller 20 rotates while contacting the front surface (rear surface) of the substrate 9 to convey the substrate 9. For example, as shown in FIG. The driving roller 20 may be disposed along the surface of the substrate 9, and the driving roller 20 may be brought into contact with the side end surface of the substrate 9 and rotated to convey the substrate 9.

  Further, in the present embodiment, the driving roller 20 is disposed on both sides of the heating plate 10, but may be disposed only on one side of the heating plate 10. Further, the drive roller 20 may be provided at a portion other than the both side portions (for example, the center in the width direction of the heating plate 10).

  Moreover, in the said embodiment, although a board | substrate is heated by the radiant heat from a heating plate and blowing of high temperature air, you may make it heat a board | substrate only with radiant heat. Even in such a case, it is possible to suppress the local cooling of the substrate by suppressing the flow velocity of the air ejected from the discharge port, and thus it is possible to suppress the occurrence of heating unevenness.

  In the above embodiment, air is discharged from a plurality of discharge ports, but other types of gas such as nitrogen gas may be ejected instead of air. For example, in order to suppress an unintended chemical reaction from occurring on the surface of the substrate, it is preferable to use an inert gas such as nitrogen gas.

  Moreover, although the substrate processing apparatus which concerns on the said embodiment was an apparatus which heat-processes with respect to the rectangular glass substrate for liquid crystal display devices, the substrate processing apparatus of this invention is a semiconductor wafer, the glass substrate for PDP, Heat treatment may be performed on another substrate such as a recording disk substrate.

  Furthermore, the elements described in the above embodiments and modifications can be freely selected and combined or appropriately omitted as long as no contradiction occurs.

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 9 Substrate 10, 10a, 10b, 10c Heating plate 101, 101a, 101b, 101c Discharge port 102 Internal flow path H1, H1a, H1b, H1c 1st hole H2 2nd hole

Claims (6)

A substrate processing apparatus for heating a substrate,
A plate for heating the substrate, provided with a discharge port for ejecting gas at a portion of the surface facing the substrate;
A gas supply unit for supplying gas to be ejected from the discharge port into the plate;
With
The substrate processing apparatus, wherein the discharge port includes a portion where an opening increases from the inside toward the surface of the plate. The substrate processing apparatus according to claim 1,
A substrate processing apparatus in which a gas ejected from the discharge port is heated to a predetermined temperature. The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the discharge port includes a portion where the opening increases concentrically from the inside toward the surface. In the substrate processing apparatus of any one of Claim 1 to 3,
The discharge port is
A slit-shaped hole opening in a slit shape on the surface;
A substrate processing apparatus formed by a connection hole having a size of an opening smaller than the slit-shaped hole and communicating with the slit-shaped hole. In the substrate processing apparatus of any one of Claim 1 to 4,
The substrate processing apparatus, wherein an inner wall surface of the discharge port includes a portion that is inclined so that an opening of the discharge port gradually increases from the inside toward the surface. In the substrate processing apparatus of any one of Claim 1-5,
The discharge port is a substrate processing apparatus in which a size of an opening is discontinuously increased from the inside toward the surface, and a staying portion in which the gas stays is formed.

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