JP2011084067A - 光学フィルム及びこれを製造する方法 - Google Patents
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Classifications
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- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
- F21V13/12—Combinations of only three kinds of elements
- F21V13/14—Combinations of only three kinds of elements the elements being filters or photoluminescent elements, reflectors and refractors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
- F21V9/32—Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
- F21V9/38—Combination of two or more photoluminescent elements of different materials
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133617—Illumination with ultraviolet light; Luminescent elements or materials associated to the cell
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
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- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- G02B2207/113—Fluorescence
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/1476—Release layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
【解決手段】実施例は、光透過率と耐熱性を有する材質を含むベースフィルム;前記ベースフィルム上に形成され、蛍光体を含むマトリックス層;前記マトリックス層上に配置され、接着性を有する材質を含む保護層;保護層を含む光学フィルム及びこれを製造する方法を提供する。
【選択図】図1
Description
[第1の実施形態]
図1は、第1の実施形態による光学フィルム1の断面図である。
[第2の実施形態]
以下、第2の実施形態による光学フィルム2及びその製造方法に対して詳しく説明する。第2の実施形態に対する説明において、第1の実施形態と重複される内容は略する。
[第3の実施形態]
図8は、第3の実施形態による光学フィルム3の断面図である。
前記粘着性樹脂層30aは、良好な光透過率、耐熱性を有して、特に、優れた粘着性を有する樹脂材質または/及びシリコン材質で形成されることができる。例えば、前記粘着性樹脂層30aはシリコン樹脂、望ましくは、トルエン(Toluene)を含む溶剤タイプのシリコン樹脂で形成されることができる。
10 ベースフィルム
20 マトリックス層
30 保護層
40 保護フィルム
50 接着部材
60 離型フィルム
Claims (15)
- 光透過率と耐熱性を有する材質を含むベースフィルム;
前記ベースフィルム上に形成され、蛍光体を含むマトリックス層;
前記マトリックス層上に配置され、接着性を有する材質を含む保護層を含む保護層;
前記保護層を含む光学フィルム。 - 前記マトリックス層は、シリコン樹脂(Silicone Resin)を含むことを特徴とする請求項1に記載の光学フィルム。
- 前記マトリックス層の厚さは、20μmないし500μmであることを特徴とする請求項1に記載の光学フィルム。
- 前記マトリックス層には光を拡散させる拡散剤、気泡をとり除く消泡剤、前記蛍光体を前記マトリックス層内に均一に分散させる添加剤及び前記マトリックス層を硬化させる硬化剤のうちで少なくとも一つが含まれたことを特徴とする請求項1に記載の光学フィルム。
- 前記蛍光体は、ケイ酸(Silicate)系列、スルフィド(Sulfide)系列、YAG系列及びTAG系列のうちで少なくともいずれか一つの蛍光体を含むことを特徴とする請求項1に記載の光学フィルム。
- 前記保護層は、樹脂材質及びシリコン材質のうちで少なくとも一つを含むことを特徴とする請求項1に記載の光学フィルム。
- 前記保護層は、光透過率が80%以上であり、接着力を有するシリコン樹脂を含むことを特徴とする請求項1に記載の光学フィルム。
- 前記蛍光体は黄色、赤色、緑色及び青色蛍光体のうちで少なくともいずれか一つを含む光学フィルム。
- 前記マトリックス層が100重量部であるとする時、前記マトリックス層内には前記赤色蛍光体1ないし60重量部及び前記緑色蛍光体1ないし60重量部が含まれたことを特徴とする請求項8に記載の光学フィルム。
- 前記マトリックス層が100重量部であるとする時、前記マトリックス層内には前記赤色蛍光体1ないし60重量部、前記緑色蛍光体1ないし60重量部及び前記黄色蛍光体1ないし60重量部が含まれたことを特徴とする請求項8に記載の光学フィルム。
- 前記保護層は、光透過率が90%以上であり粘性が約2000cp乃至1000cpであることを特徴とする請求項1に記載の粘着層である光学フィルム。
- ベースフィルムを準備する段階;
前記ベースフィルム上にマトリックス層を形成する段階;
前記マトリックス層上に保護層を形成する段階を含む光学フィルム製造方法。 - 前記マトリックス層は、シリコン樹脂及び蛍光体を混合して撹拌して、液状のマトリックス樹脂物を形成して、前記液状のマトリックス樹脂物を前記ベースフィルム上に塗布した後硬化させることで形成することを特徴とする請求項12に記載の光学フィルム製造方法。
- 前記光学フィルムを製造する方法は、
前記保護層上に前記保護フィルムを形成し、
前記マトリックス層上に半硬化状態の保護層を塗布する段階;
前記半硬化状態の保護層上に前記保護フィルムを付着する段階;及び
前記保護層を硬化する段階を含むことを特徴とする請求項12に記載の光学フィルム製造方法。 - 前記保護フィルム上に接着部材を形成する段階をさらに含むことを特徴とする請求項12に記載の光学フィルム製造方法。
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
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KR10-2009-0099292 | 2009-10-19 | ||
KR1020090099293A KR101592581B1 (ko) | 2009-10-19 | 2009-10-19 | 광학 필름 및 그 제조방법 |
KR1020090099292A KR101558598B1 (ko) | 2009-10-19 | 2009-10-19 | 광학 필름 및 그 제조방법 |
KR1020090099294A KR101637569B1 (ko) | 2009-10-19 | 2009-10-19 | 발광 소자 및 이를 이용한 라이트 유닛 |
KR10-2009-0099293 | 2009-10-19 | ||
KR10-2009-0099294 | 2009-10-19 | ||
KR1020100033023A KR101623464B1 (ko) | 2010-04-10 | 2010-04-10 | 발광 소자 및 이를 이용한 라이트 유닛 |
KR10-2010-0033023 | 2010-04-10 |
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JP2011084067A true JP2011084067A (ja) | 2011-04-28 |
JP2011084067A5 JP2011084067A5 (ja) | 2013-06-20 |
JP5782246B2 JP5782246B2 (ja) | 2015-09-24 |
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US (2) | US8517552B2 (ja) |
EP (2) | EP2587284B1 (ja) |
JP (1) | JP5782246B2 (ja) |
CN (2) | CN105911623B (ja) |
Cited By (6)
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JP2013045771A (ja) * | 2011-08-24 | 2013-03-04 | Samsung Electronics Co Ltd | バックライトアセンブリ及びその製造方法 |
JP2014070136A (ja) * | 2012-09-28 | 2014-04-21 | Nitto Denko Corp | 蛍光接着シート、光半導体素子−蛍光体層感圧接着体および光半導体装置 |
CN103782092A (zh) * | 2011-09-08 | 2014-05-07 | Lg伊诺特有限公司 | 照明装置及照明控制方法 |
KR101701740B1 (ko) * | 2015-11-06 | 2017-02-03 | 주식회사 에스엘네트웍스 | 형광몰딩층을 갖지 않는 led 모듈 |
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CN105911623B (zh) | 2018-02-06 |
EP2587284B1 (en) | 2017-10-11 |
EP2312346A1 (en) | 2011-04-20 |
CN102082224A (zh) | 2011-06-01 |
US20130314895A1 (en) | 2013-11-28 |
CN105911623A (zh) | 2016-08-31 |
US8727577B2 (en) | 2014-05-20 |
EP2312346B1 (en) | 2013-03-20 |
JP5782246B2 (ja) | 2015-09-24 |
EP2587284A3 (en) | 2013-08-21 |
US8517552B2 (en) | 2013-08-27 |
US20110090670A1 (en) | 2011-04-21 |
EP2587284A2 (en) | 2013-05-01 |
CN102082224B (zh) | 2016-05-04 |
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