JP2011082480A - ダイアタッチフィルム及びダイシングダイアタッチフィルム - Google Patents

ダイアタッチフィルム及びダイシングダイアタッチフィルム Download PDF

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Publication number
JP2011082480A
JP2011082480A JP2010053551A JP2010053551A JP2011082480A JP 2011082480 A JP2011082480 A JP 2011082480A JP 2010053551 A JP2010053551 A JP 2010053551A JP 2010053551 A JP2010053551 A JP 2010053551A JP 2011082480 A JP2011082480 A JP 2011082480A
Authority
JP
Japan
Prior art keywords
die attach
attach film
film
weight
dicing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010053551A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011082480A5 (enExample
Inventor
Masateru Fukuoka
正輝 福岡
Satoshi Hayashi
聡史 林
Hideaki Ishizawa
英亮 石澤
Akinobu Hayakawa
明伸 早川
Kohei Takeda
幸平 竹田
Ryohei Masui
良平 増井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2010053551A priority Critical patent/JP2011082480A/ja
Publication of JP2011082480A publication Critical patent/JP2011082480A/ja
Publication of JP2011082480A5 publication Critical patent/JP2011082480A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
JP2010053551A 2009-03-13 2010-03-10 ダイアタッチフィルム及びダイシングダイアタッチフィルム Pending JP2011082480A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010053551A JP2011082480A (ja) 2009-03-13 2010-03-10 ダイアタッチフィルム及びダイシングダイアタッチフィルム

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009062032 2009-03-13
JP2009210316 2009-09-11
JP2010053551A JP2011082480A (ja) 2009-03-13 2010-03-10 ダイアタッチフィルム及びダイシングダイアタッチフィルム

Publications (2)

Publication Number Publication Date
JP2011082480A true JP2011082480A (ja) 2011-04-21
JP2011082480A5 JP2011082480A5 (enExample) 2012-11-29

Family

ID=44076194

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010053551A Pending JP2011082480A (ja) 2009-03-13 2010-03-10 ダイアタッチフィルム及びダイシングダイアタッチフィルム

Country Status (1)

Country Link
JP (1) JP2011082480A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017002610A1 (ja) * 2015-06-29 2017-01-05 三井化学東セロ株式会社 半導体部品製造用フィルム
WO2018221675A1 (ja) * 2017-06-01 2018-12-06 日立化成株式会社 半導体加工用テープ
US10483131B2 (en) 2015-06-11 2019-11-19 Mitsui Chemicals Tohcello, Inc. Electronic-device-protecting film, electronic-device-protecting member, method for manufacturing electronic device, and method for manufacturing package
JP2019201046A (ja) * 2018-05-14 2019-11-21 株式会社ディスコ Ｄａｆ
CN113185806A (zh) * 2021-04-16 2021-07-30 华南理工大学 一种聚酰亚胺微球改性的热固性树脂基复合材料及其制备方法与应用
JP2021141279A (ja) * 2020-03-09 2021-09-16 キオクシア株式会社 半導体装置
KR20220134748A (ko) 2021-03-26 2022-10-05 후루카와 덴키 고교 가부시키가이샤 다이싱 다이어태치 필름 및 그 제조 방법과, 반도체 패키지 및 그 제조 방법
JP2023007156A (ja) * 2021-07-01 2023-01-18 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料及び接続構造体
JP7713609B1 (ja) * 2025-03-27 2025-07-25 古河電気工業株式会社 導電性ダイアタッチフィルム、ダイシングダイアタッチフィルム、及び半導体チップの実装方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10330616A (ja) * 1997-05-30 1998-12-15 Hitachi Chem Co Ltd 耐熱樹脂ペースト
JP2007112927A (ja) * 2005-10-21 2007-05-10 Toyobo Co Ltd ポリイミド樹脂粉末およびポリイミド樹脂成形体の製法
WO2008010547A1 (en) * 2006-07-19 2008-01-24 Sekisui Chemical Co., Ltd. Dicing/die-bonding tape and method for manufacturing semiconductor chip
JP2008179820A (ja) * 2008-01-22 2008-08-07 Sumitomo Bakelite Co Ltd 半導体用接着フィルム及びこれを用いた半導体装置
JP2008265069A (ja) * 2007-04-18 2008-11-06 Kaneka Corp 絶縁性接着シート、積層体及びプリント配線板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10330616A (ja) * 1997-05-30 1998-12-15 Hitachi Chem Co Ltd 耐熱樹脂ペースト
JP2007112927A (ja) * 2005-10-21 2007-05-10 Toyobo Co Ltd ポリイミド樹脂粉末およびポリイミド樹脂成形体の製法
WO2008010547A1 (en) * 2006-07-19 2008-01-24 Sekisui Chemical Co., Ltd. Dicing/die-bonding tape and method for manufacturing semiconductor chip
JP2008265069A (ja) * 2007-04-18 2008-11-06 Kaneka Corp 絶縁性接着シート、積層体及びプリント配線板
JP2008179820A (ja) * 2008-01-22 2008-08-07 Sumitomo Bakelite Co Ltd 半導体用接着フィルム及びこれを用いた半導体装置

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10483131B2 (en) 2015-06-11 2019-11-19 Mitsui Chemicals Tohcello, Inc. Electronic-device-protecting film, electronic-device-protecting member, method for manufacturing electronic device, and method for manufacturing package
US10858547B2 (en) 2015-06-29 2020-12-08 Mitsui Chemicals Tohcello, Inc. Film for manufacturing semiconductor parts
JP6129446B1 (ja) * 2015-06-29 2017-05-17 三井化学東セロ株式会社 半導体部品製造用フィルム
KR20180015229A (ko) * 2015-06-29 2018-02-12 미쓰이 가가쿠 토세로 가부시키가이샤 반도체 부품 제조용 필름
CN107851602A (zh) * 2015-06-29 2018-03-27 三井化学东赛璐株式会社 半导体部件制造用膜
US11535776B2 (en) 2015-06-29 2022-12-27 Mitsui Chemicals Tohcello, Inc. Film for manufacturing semiconductor parts
WO2017002610A1 (ja) * 2015-06-29 2017-01-05 三井化学東セロ株式会社 半導体部品製造用フィルム
KR102034972B1 (ko) 2015-06-29 2019-10-21 미쓰이 가가쿠 토세로 가부시키가이샤 반도체 부품 제조용 필름
CN107851602B (zh) * 2015-06-29 2021-08-06 三井化学东赛璐株式会社 半导体部件制造用膜
JP2018206893A (ja) * 2017-06-01 2018-12-27 日立化成株式会社 半導体加工用テープ
TWI778070B (zh) * 2017-06-01 2022-09-21 日商昭和電工材料股份有限公司 半導體加工用帶的用途及半導體裝置的製造方法
WO2018221675A1 (ja) * 2017-06-01 2018-12-06 日立化成株式会社 半導体加工用テープ
KR20200014292A (ko) * 2017-06-01 2020-02-10 히타치가세이가부시끼가이샤 반도체 가공용 테이프
JP7031141B2 (ja) 2017-06-01 2022-03-08 昭和電工マテリアルズ株式会社 半導体加工用テープ
KR102442278B1 (ko) * 2017-06-01 2022-09-08 쇼와덴코머티리얼즈가부시끼가이샤 반도체 가공용 테이프
JP2019201046A (ja) * 2018-05-14 2019-11-21 株式会社ディスコ Ｄａｆ
JP2021141279A (ja) * 2020-03-09 2021-09-16 キオクシア株式会社 半導体装置
JP7427480B2 (ja) 2020-03-09 2024-02-05 キオクシア株式会社 半導体装置
KR20220134748A (ko) 2021-03-26 2022-10-05 후루카와 덴키 고교 가부시키가이샤 다이싱 다이어태치 필름 및 그 제조 방법과, 반도체 패키지 및 그 제조 방법
CN113185806A (zh) * 2021-04-16 2021-07-30 华南理工大学 一种聚酰亚胺微球改性的热固性树脂基复合材料及其制备方法与应用
CN113185806B (zh) * 2021-04-16 2023-02-10 华南理工大学 一种聚酰亚胺微球改性的热固性树脂基复合材料及其制备方法与应用
JP2023007156A (ja) * 2021-07-01 2023-01-18 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料及び接続構造体
JP7713609B1 (ja) * 2025-03-27 2025-07-25 古河電気工業株式会社 導電性ダイアタッチフィルム、ダイシングダイアタッチフィルム、及び半導体チップの実装方法

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