JP2011029475A - プラズマ処理装置及びプラズマ処理方法 - Google Patents
プラズマ処理装置及びプラズマ処理方法 Download PDFInfo
- Publication number
- JP2011029475A JP2011029475A JP2009175076A JP2009175076A JP2011029475A JP 2011029475 A JP2011029475 A JP 2011029475A JP 2009175076 A JP2009175076 A JP 2009175076A JP 2009175076 A JP2009175076 A JP 2009175076A JP 2011029475 A JP2011029475 A JP 2011029475A
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- plasma
- temperature
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- plasma processing
- discharge tube
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- 238000012545 processing Methods 0.000 title claims abstract description 268
- 238000003672 processing method Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 91
- 238000001514 detection method Methods 0.000 claims abstract description 87
- 230000008569 process Effects 0.000 claims abstract description 84
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- 239000007789 gas Substances 0.000 description 81
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- 238000007781 pre-processing Methods 0.000 description 23
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
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- 238000001816 cooling Methods 0.000 description 2
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32357—Generation remote from the workpiece, e.g. down-stream
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
- H05H1/461—Microwave discharges
- H05H1/4622—Microwave discharges using waveguides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8158—With indicator, register, recorder, alarm or inspection means
Landscapes
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Electromagnetism (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
- Cleaning In General (AREA)
- Chemical Vapour Deposition (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009175076A JP2011029475A (ja) | 2009-07-28 | 2009-07-28 | プラズマ処理装置及びプラズマ処理方法 |
PCT/JP2010/062699 WO2011013702A1 (ja) | 2009-07-28 | 2010-07-28 | プラズマ処理装置及びプラズマ処理方法 |
TW99124969A TW201130399A (en) | 2009-07-28 | 2010-07-28 | Plasma processing device, and plasma processing method |
US13/387,635 US20120192953A1 (en) | 2009-07-28 | 2010-07-28 | Plasma processing apparatus and plasma processing method |
KR1020127003962A KR101308852B1 (ko) | 2009-07-28 | 2010-07-28 | 플라즈마 처리 장치 및 플라즈마 처리 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009175076A JP2011029475A (ja) | 2009-07-28 | 2009-07-28 | プラズマ処理装置及びプラズマ処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011029475A true JP2011029475A (ja) | 2011-02-10 |
JP2011029475A5 JP2011029475A5 (ko) | 2012-09-06 |
Family
ID=43529355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009175076A Pending JP2011029475A (ja) | 2009-07-28 | 2009-07-28 | プラズマ処理装置及びプラズマ処理方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20120192953A1 (ko) |
JP (1) | JP2011029475A (ko) |
KR (1) | KR101308852B1 (ko) |
TW (1) | TW201130399A (ko) |
WO (1) | WO2011013702A1 (ko) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013004474A (ja) * | 2011-06-21 | 2013-01-07 | Toshiba Mitsubishi-Electric Industrial System Corp | プラズマ発生装置およびcvd装置 |
JP2014522277A (ja) * | 2011-06-03 | 2014-09-04 | コリア・ベーシック・サイエンス・インスティテュート | 医療用プラズマ滅菌装置 |
KR101609576B1 (ko) * | 2011-06-28 | 2016-04-06 | 리카본 인코포레이티드 | 가스변환시스템 |
CN106944419A (zh) * | 2017-05-12 | 2017-07-14 | 中国工程物理研究院核物理与化学研究所 | 一种去除表面氚污染的等离子体去污系统 |
CN110389607A (zh) * | 2018-04-23 | 2019-10-29 | 东京毅力科创株式会社 | 温度控制方法 |
JPWO2019180840A1 (ja) * | 2018-03-20 | 2021-03-11 | 株式会社Fuji | プラズマ装置 |
JP7480247B2 (ja) | 2017-09-20 | 2024-05-09 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法及びプログラム |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI611454B (zh) * | 2011-09-26 | 2018-01-11 | Tokyo Electron Ltd | 電漿蝕刻方法 |
JP6286215B2 (ja) * | 2014-01-28 | 2018-02-28 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
US9934941B2 (en) * | 2014-09-30 | 2018-04-03 | Toshiba Memory Corporation | Etching apparatus and etching method |
JP6739201B2 (ja) * | 2016-03-25 | 2020-08-12 | スピードファム株式会社 | 局所ドライエッチング装置 |
JP6749258B2 (ja) | 2017-01-31 | 2020-09-02 | 東京エレクトロン株式会社 | マイクロ波プラズマ源、マイクロ波プラズマ処理装置、およびプラズマ処理方法 |
JP6560704B2 (ja) * | 2017-03-14 | 2019-08-14 | 株式会社Kokusai Electric | 半導体装置の製造方法および基板処理装置 |
JP7131916B2 (ja) * | 2017-03-31 | 2022-09-06 | 芝浦メカトロニクス株式会社 | プラズマ処理装置 |
CN108690965B (zh) | 2017-03-31 | 2020-06-30 | 芝浦机械电子装置株式会社 | 等离子体处理装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07169592A (ja) * | 1993-12-13 | 1995-07-04 | Ulvac Japan Ltd | プラズマ処理装置における放電管冷却機構 |
JPH08311666A (ja) * | 1995-05-19 | 1996-11-26 | Hitachi Ltd | プラズマ処理装置及びプラズマ処理方法 |
JPH1131599A (ja) * | 1997-07-08 | 1999-02-02 | Sumitomo Metal Ind Ltd | プラズマ処理装置における予熱方法及びプラズマ処理装置 |
-
2009
- 2009-07-28 JP JP2009175076A patent/JP2011029475A/ja active Pending
-
2010
- 2010-07-28 WO PCT/JP2010/062699 patent/WO2011013702A1/ja active Application Filing
- 2010-07-28 KR KR1020127003962A patent/KR101308852B1/ko not_active IP Right Cessation
- 2010-07-28 US US13/387,635 patent/US20120192953A1/en not_active Abandoned
- 2010-07-28 TW TW99124969A patent/TW201130399A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07169592A (ja) * | 1993-12-13 | 1995-07-04 | Ulvac Japan Ltd | プラズマ処理装置における放電管冷却機構 |
JPH08311666A (ja) * | 1995-05-19 | 1996-11-26 | Hitachi Ltd | プラズマ処理装置及びプラズマ処理方法 |
JPH1131599A (ja) * | 1997-07-08 | 1999-02-02 | Sumitomo Metal Ind Ltd | プラズマ処理装置における予熱方法及びプラズマ処理装置 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014522277A (ja) * | 2011-06-03 | 2014-09-04 | コリア・ベーシック・サイエンス・インスティテュート | 医療用プラズマ滅菌装置 |
US9855354B2 (en) | 2011-06-03 | 2018-01-02 | Korea Basic Science Institute | Apparatus for medical sterilization using plasma |
JP2013004474A (ja) * | 2011-06-21 | 2013-01-07 | Toshiba Mitsubishi-Electric Industrial System Corp | プラズマ発生装置およびcvd装置 |
KR101609576B1 (ko) * | 2011-06-28 | 2016-04-06 | 리카본 인코포레이티드 | 가스변환시스템 |
CN106944419A (zh) * | 2017-05-12 | 2017-07-14 | 中国工程物理研究院核物理与化学研究所 | 一种去除表面氚污染的等离子体去污系统 |
JP7480247B2 (ja) | 2017-09-20 | 2024-05-09 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法及びプログラム |
JPWO2019180840A1 (ja) * | 2018-03-20 | 2021-03-11 | 株式会社Fuji | プラズマ装置 |
CN110389607A (zh) * | 2018-04-23 | 2019-10-29 | 东京毅力科创株式会社 | 温度控制方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2011013702A1 (ja) | 2011-02-03 |
KR20120037485A (ko) | 2012-04-19 |
US20120192953A1 (en) | 2012-08-02 |
KR101308852B1 (ko) | 2013-09-13 |
TW201130399A (en) | 2011-09-01 |
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