JP2011029401A - ウエハ搬送方法およびウエハ搬送装置 - Google Patents

ウエハ搬送方法およびウエハ搬送装置 Download PDF

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Publication number
JP2011029401A
JP2011029401A JP2009173508A JP2009173508A JP2011029401A JP 2011029401 A JP2011029401 A JP 2011029401A JP 2009173508 A JP2009173508 A JP 2009173508A JP 2009173508 A JP2009173508 A JP 2009173508A JP 2011029401 A JP2011029401 A JP 2011029401A
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JP
Japan
Prior art keywords
wafer
wafers
liquid
wafer transfer
uppermost
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Pending
Application number
JP2009173508A
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English (en)
Japanese (ja)
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JP2011029401A5 (cg-RX-API-DMAC10.html
Inventor
Hironari Sekime
浩成 關目
Koichi Tomita
弘一 富田
Masataka Hara
正敬 原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Precision Machining Co Ltd
Original Assignee
Sumitomo Metal Fine Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Sumitomo Metal Fine Tech Co Ltd filed Critical Sumitomo Metal Fine Tech Co Ltd
Priority to JP2009173508A priority Critical patent/JP2011029401A/ja
Priority to CN201080033609.9A priority patent/CN102473666B/zh
Priority to PCT/JP2010/062303 priority patent/WO2011010683A1/ja
Priority to KR1020117029322A priority patent/KR101370578B1/ko
Publication of JP2011029401A publication Critical patent/JP2011029401A/ja
Publication of JP2011029401A5 publication Critical patent/JP2011029401A5/ja
Pending legal-status Critical Current

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2009173508A 2009-07-24 2009-07-24 ウエハ搬送方法およびウエハ搬送装置 Pending JP2011029401A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009173508A JP2011029401A (ja) 2009-07-24 2009-07-24 ウエハ搬送方法およびウエハ搬送装置
CN201080033609.9A CN102473666B (zh) 2009-07-24 2010-07-22 晶片输送方法和晶片输送装置
PCT/JP2010/062303 WO2011010683A1 (ja) 2009-07-24 2010-07-22 ウエハ搬送方法およびウエハ搬送装置
KR1020117029322A KR101370578B1 (ko) 2009-07-24 2010-07-22 웨이퍼 반송방법 및 웨이퍼 반송장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009173508A JP2011029401A (ja) 2009-07-24 2009-07-24 ウエハ搬送方法およびウエハ搬送装置

Publications (2)

Publication Number Publication Date
JP2011029401A true JP2011029401A (ja) 2011-02-10
JP2011029401A5 JP2011029401A5 (cg-RX-API-DMAC10.html) 2012-07-05

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JP2009173508A Pending JP2011029401A (ja) 2009-07-24 2009-07-24 ウエハ搬送方法およびウエハ搬送装置

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JP (1) JP2011029401A (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011029390A (ja) * 2009-07-24 2011-02-10 Sumitomo Metal Fine Technology Co Ltd ウエハ搬送方法およびウエハ搬送装置
JP2011061122A (ja) * 2009-09-14 2011-03-24 Sumitomo Metal Fine Technology Co Ltd ウエハ搬送方法およびウエハ搬送装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09237770A (ja) * 1995-12-25 1997-09-09 Nippei Toyama Corp ウエハの処理システム
JPH09326375A (ja) * 1996-06-04 1997-12-16 Mitsubishi Materials Corp ウェハの洗浄方法および装置
JPH1059544A (ja) * 1996-08-13 1998-03-03 Mitsubishi Materials Shilicon Corp 板材の搬送装置
JP2002254378A (ja) * 2001-02-22 2002-09-10 Hiroshi Akashi 液中ワーク取り出し装置
WO2008075970A1 (en) * 2006-12-19 2008-06-26 Rec Scanwafer As Method and device for se aration of silicon wafers
JP2011029390A (ja) * 2009-07-24 2011-02-10 Sumitomo Metal Fine Technology Co Ltd ウエハ搬送方法およびウエハ搬送装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09237770A (ja) * 1995-12-25 1997-09-09 Nippei Toyama Corp ウエハの処理システム
JPH09326375A (ja) * 1996-06-04 1997-12-16 Mitsubishi Materials Corp ウェハの洗浄方法および装置
JPH1059544A (ja) * 1996-08-13 1998-03-03 Mitsubishi Materials Shilicon Corp 板材の搬送装置
JP2002254378A (ja) * 2001-02-22 2002-09-10 Hiroshi Akashi 液中ワーク取り出し装置
WO2008075970A1 (en) * 2006-12-19 2008-06-26 Rec Scanwafer As Method and device for se aration of silicon wafers
JP2010514205A (ja) * 2006-12-19 2010-04-30 アール・イー・シー・スキャンウェハー・アー・エス シリコンウェハを分離させるための方法および装置
JP2011029390A (ja) * 2009-07-24 2011-02-10 Sumitomo Metal Fine Technology Co Ltd ウエハ搬送方法およびウエハ搬送装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011029390A (ja) * 2009-07-24 2011-02-10 Sumitomo Metal Fine Technology Co Ltd ウエハ搬送方法およびウエハ搬送装置
JP2011061122A (ja) * 2009-09-14 2011-03-24 Sumitomo Metal Fine Technology Co Ltd ウエハ搬送方法およびウエハ搬送装置

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