JP2011014451A5 - - Google Patents

Download PDF

Info

Publication number
JP2011014451A5
JP2011014451A5 JP2009158994A JP2009158994A JP2011014451A5 JP 2011014451 A5 JP2011014451 A5 JP 2011014451A5 JP 2009158994 A JP2009158994 A JP 2009158994A JP 2009158994 A JP2009158994 A JP 2009158994A JP 2011014451 A5 JP2011014451 A5 JP 2011014451A5
Authority
JP
Japan
Prior art keywords
conductor
connection terminal
board
substrate
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009158994A
Other languages
English (en)
Japanese (ja)
Other versions
JP5606695B2 (ja
JP2011014451A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009158994A priority Critical patent/JP5606695B2/ja
Priority claimed from JP2009158994A external-priority patent/JP5606695B2/ja
Priority to US12/824,456 priority patent/US8179692B2/en
Priority to TW099121640A priority patent/TW201112500A/zh
Priority to CN201010223392.XA priority patent/CN101944523B/zh
Publication of JP2011014451A publication Critical patent/JP2011014451A/ja
Publication of JP2011014451A5 publication Critical patent/JP2011014451A5/ja
Application granted granted Critical
Publication of JP5606695B2 publication Critical patent/JP5606695B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009158994A 2009-07-03 2009-07-03 接続端子付き基板 Active JP5606695B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009158994A JP5606695B2 (ja) 2009-07-03 2009-07-03 接続端子付き基板
US12/824,456 US8179692B2 (en) 2009-07-03 2010-06-28 Board having connection terminal
TW099121640A TW201112500A (en) 2009-07-03 2010-07-01 Board having connection terminal
CN201010223392.XA CN101944523B (zh) 2009-07-03 2010-07-02 具有连接端子的基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009158994A JP5606695B2 (ja) 2009-07-03 2009-07-03 接続端子付き基板

Publications (3)

Publication Number Publication Date
JP2011014451A JP2011014451A (ja) 2011-01-20
JP2011014451A5 true JP2011014451A5 (zh) 2012-08-16
JP5606695B2 JP5606695B2 (ja) 2014-10-15

Family

ID=43412923

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009158994A Active JP5606695B2 (ja) 2009-07-03 2009-07-03 接続端子付き基板

Country Status (4)

Country Link
US (1) US8179692B2 (zh)
JP (1) JP5606695B2 (zh)
CN (1) CN101944523B (zh)
TW (1) TW201112500A (zh)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5500870B2 (ja) * 2009-05-28 2014-05-21 新光電気工業株式会社 接続端子付き基板及び電子部品のソケット等
JP5009972B2 (ja) * 2009-12-21 2012-08-29 日立オートモティブシステムズ株式会社 コネクタの製造方法
JP5394309B2 (ja) * 2010-04-19 2014-01-22 富士通コンポーネント株式会社 プローブ及びプローブの製造方法
US8294042B2 (en) * 2010-07-27 2012-10-23 Unimicron Technology Corp. Connector and manufacturing method thereof
JP5663379B2 (ja) * 2011-04-11 2015-02-04 新光電気工業株式会社 接続端子構造及びソケット並びに電子部品パッケージ
WO2012144326A1 (ja) * 2011-04-20 2012-10-26 タイコエレクトロニクスジャパン合同会社 コネクタおよびコネクタの製造方法
JP5794833B2 (ja) * 2011-06-10 2015-10-14 新光電気工業株式会社 接続端子及びその製造方法、並びにソケット
JP2013089313A (ja) * 2011-10-13 2013-05-13 Tyco Electronics Japan Kk コネクタ
US8641428B2 (en) * 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
US9119320B2 (en) * 2012-04-13 2015-08-25 Quanta Computer Inc. System in package assembly
JP6046392B2 (ja) 2012-06-22 2016-12-14 新光電気工業株式会社 接続端子構造、インターポーザ、及びソケット
US8614514B1 (en) * 2013-03-13 2013-12-24 Palo Alto Research Center Incorporated Micro-spring chip attachment using ribbon bonds
CN104064895A (zh) * 2013-03-22 2014-09-24 富士康(昆山)电脑接插件有限公司 端子模组及其制造方法
US20140374912A1 (en) * 2013-06-24 2014-12-25 Palo Alto Research Center Incorporated Micro-Spring Chip Attachment Using Solder-Based Interconnect Structures
FR3009445B1 (fr) * 2013-07-31 2017-03-31 Hypertac Sa Organe de contact entre un support et un dispositif et connecteur electrique comprenant un tel organe de contact
JP6500258B2 (ja) * 2015-06-12 2019-04-17 北川工業株式会社 接触部材
US9692147B1 (en) * 2015-12-22 2017-06-27 Intel Corporation Small form factor sockets and connectors
KR101947425B1 (ko) 2016-05-12 2019-02-13 주식회사 아모텍 기능성 컨택터
WO2017196116A1 (ko) * 2016-05-12 2017-11-16 주식회사 아모텍 기능성 컨택터
JP6358569B2 (ja) * 2016-06-22 2018-07-18 カシオ計算機株式会社 接続装置および時計
CN110927416B (zh) * 2018-09-19 2022-01-28 台湾中华精测科技股份有限公司 探针卡测试装置及测试装置
TWI669511B (zh) * 2018-09-19 2019-08-21 中華精測科技股份有限公司 探針卡測試裝置及測試裝置
CN111880067B (zh) * 2019-04-15 2023-05-05 台湾中华精测科技股份有限公司 晶片测试组件及其电性连接模块
CN113130432B (zh) * 2019-12-30 2022-12-27 华为机器有限公司 一种电子模块及电子设备
WO2021200642A1 (ja) * 2020-03-31 2021-10-07 積水ポリマテック株式会社 導電部材

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3842189A (en) * 1973-01-08 1974-10-15 Rca Corp Contact array and method of making the same
US4553192A (en) * 1983-08-25 1985-11-12 International Business Machines Corporation High density planar interconnected integrated circuit package
US4677458A (en) * 1983-11-04 1987-06-30 Control Data Corporation Ceramic IC package attachment apparatus
JPH03100364U (zh) * 1990-01-30 1991-10-21
JPH076840A (ja) * 1993-06-18 1995-01-10 Fujitsu Ltd Ic試験用コンタクト
US7073254B2 (en) * 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US6482013B2 (en) * 1993-11-16 2002-11-19 Formfactor, Inc. Microelectronic spring contact element and electronic component having a plurality of spring contact elements
US6117694A (en) * 1994-07-07 2000-09-12 Tessera, Inc. Flexible lead structures and methods of making same
JPH08250243A (ja) * 1995-03-15 1996-09-27 Matsushita Electric Works Ltd プリント基板接続構造
US5612520A (en) * 1995-06-07 1997-03-18 Ast Research, Inc. Suspend switch for portable electronic equipment
US5763941A (en) * 1995-10-24 1998-06-09 Tessera, Inc. Connection component with releasable leads
US7714235B1 (en) * 1997-05-06 2010-05-11 Formfactor, Inc. Lithographically defined microelectronic contact structures
US6807734B2 (en) * 1998-02-13 2004-10-26 Formfactor, Inc. Microelectronic contact structures, and methods of making same
CA2266158C (en) 1999-03-18 2003-05-20 Ibm Canada Limited-Ibm Canada Limitee Connecting devices and method for interconnecting circuit components
US7126220B2 (en) * 2002-03-18 2006-10-24 Nanonexus, Inc. Miniaturized contact spring
US6888362B2 (en) * 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US7435108B1 (en) * 1999-07-30 2008-10-14 Formfactor, Inc. Variable width resilient conductive contact structures
US6827584B2 (en) * 1999-12-28 2004-12-07 Formfactor, Inc. Interconnect for microelectronic structures with enhanced spring characteristics
US7458816B1 (en) * 2000-04-12 2008-12-02 Formfactor, Inc. Shaped spring
JP2002033171A (ja) * 2000-05-09 2002-01-31 Sony Corp 接続端子及びこれを有する電子部品コネクタ
JP2002164104A (ja) * 2000-11-22 2002-06-07 Ando Electric Co Ltd プローブカード
US6532654B2 (en) * 2001-01-12 2003-03-18 International Business Machines Corporation Method of forming an electrical connector
US6528350B2 (en) * 2001-05-21 2003-03-04 Xerox Corporation Method for fabricating a metal plated spring structure
US6777319B2 (en) * 2001-12-19 2004-08-17 Formfactor, Inc. Microelectronic spring contact repair
US6684499B2 (en) * 2002-01-07 2004-02-03 Xerox Corporation Method for fabricating a spring structure
US7047638B2 (en) * 2002-07-24 2006-05-23 Formfactor, Inc Method of making microelectronic spring contact array
JP2004259530A (ja) * 2003-02-25 2004-09-16 Shinko Electric Ind Co Ltd 外部接触端子を有する半導体装置及びその使用方法
KR100443999B1 (ko) * 2003-02-28 2004-08-21 주식회사 파이컴 인쇄회로기판용 상호 접속체, 이의 제조방법 및 이를구비한 상호 접속 조립체
US20070020960A1 (en) * 2003-04-11 2007-01-25 Williams John D Contact grid array system
US6965245B2 (en) * 2003-05-01 2005-11-15 K&S Interconnect, Inc. Prefabricated and attached interconnect structure
US7015584B2 (en) * 2003-07-08 2006-03-21 Xerox Corporation High force metal plated spring structure
JP4170278B2 (ja) * 2004-03-19 2008-10-22 タイコエレクトロニクスアンプ株式会社 コンタクト及び電気コネクタ
US7057295B2 (en) * 2004-04-22 2006-06-06 Ted Ju IC module assembly
US7541219B2 (en) * 2004-07-02 2009-06-02 Seagate Technology Llc Integrated metallic contact probe storage device
US20060030179A1 (en) * 2004-08-05 2006-02-09 Palo Alto Research Center, Incorporated Transmission-line spring structure
US7782072B2 (en) * 2006-09-27 2010-08-24 Formfactor, Inc. Single support structure probe group with staggered mounting pattern
US7674112B2 (en) * 2006-12-28 2010-03-09 Formfactor, Inc. Resilient contact element and methods of fabrication
US8179693B2 (en) * 2007-03-30 2012-05-15 International Business Machines Corporation Apparatus for electrically connecting two substrates using a land grid array connector provided with a frame structure having power distribution elements

Similar Documents

Publication Publication Date Title
JP2011014451A5 (zh)
EP1986279A3 (en) Connector and connector connecting body
JP2013546199A5 (zh)
EP2187411A3 (en) Ceramic electronic component terminals
JP2010277829A5 (zh)
JP2007012850A5 (zh)
JP2012221783A5 (zh)
MY166129A (en) Electronic card having an external connector
US20150171540A1 (en) Electrical connector and conductive terminal thereof
JP2009141169A5 (zh)
JP2013008467A (ja) コンタクトおよびソケット
JP2007218890A5 (zh)
JP2011122924A5 (zh)
EP2432013A3 (en) Sealing member for electronic component package and electronic component package
JP2012099352A5 (zh)
US20110294365A1 (en) Elastic electrical contact
US8272880B2 (en) Socket and semiconductor device including socket and semiconductor package
JP2010267830A5 (zh)
JP2011171168A5 (zh)
EP1926144A3 (en) Semiconductor device and manufacturing method thereof
JP2013162295A5 (zh)
JPWO2023135733A5 (zh)
JP2014007039A5 (zh)
JP3195397U (ja) 半導体装置
TW201023438A (en) Electrical connector