JP2011014451A5 - - Google Patents
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- Publication number
- JP2011014451A5 JP2011014451A5 JP2009158994A JP2009158994A JP2011014451A5 JP 2011014451 A5 JP2011014451 A5 JP 2011014451A5 JP 2009158994 A JP2009158994 A JP 2009158994A JP 2009158994 A JP2009158994 A JP 2009158994A JP 2011014451 A5 JP2011014451 A5 JP 2011014451A5
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- connection terminal
- board
- substrate
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009158994A JP5606695B2 (ja) | 2009-07-03 | 2009-07-03 | 接続端子付き基板 |
US12/824,456 US8179692B2 (en) | 2009-07-03 | 2010-06-28 | Board having connection terminal |
TW099121640A TW201112500A (en) | 2009-07-03 | 2010-07-01 | Board having connection terminal |
CN201010223392.XA CN101944523B (zh) | 2009-07-03 | 2010-07-02 | 具有连接端子的基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009158994A JP5606695B2 (ja) | 2009-07-03 | 2009-07-03 | 接続端子付き基板 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011014451A JP2011014451A (ja) | 2011-01-20 |
JP2011014451A5 true JP2011014451A5 (zh) | 2012-08-16 |
JP5606695B2 JP5606695B2 (ja) | 2014-10-15 |
Family
ID=43412923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009158994A Active JP5606695B2 (ja) | 2009-07-03 | 2009-07-03 | 接続端子付き基板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8179692B2 (zh) |
JP (1) | JP5606695B2 (zh) |
CN (1) | CN101944523B (zh) |
TW (1) | TW201112500A (zh) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5500870B2 (ja) * | 2009-05-28 | 2014-05-21 | 新光電気工業株式会社 | 接続端子付き基板及び電子部品のソケット等 |
JP5009972B2 (ja) * | 2009-12-21 | 2012-08-29 | 日立オートモティブシステムズ株式会社 | コネクタの製造方法 |
JP5394309B2 (ja) * | 2010-04-19 | 2014-01-22 | 富士通コンポーネント株式会社 | プローブ及びプローブの製造方法 |
US8294042B2 (en) * | 2010-07-27 | 2012-10-23 | Unimicron Technology Corp. | Connector and manufacturing method thereof |
JP5663379B2 (ja) * | 2011-04-11 | 2015-02-04 | 新光電気工業株式会社 | 接続端子構造及びソケット並びに電子部品パッケージ |
WO2012144326A1 (ja) * | 2011-04-20 | 2012-10-26 | タイコエレクトロニクスジャパン合同会社 | コネクタおよびコネクタの製造方法 |
JP5794833B2 (ja) * | 2011-06-10 | 2015-10-14 | 新光電気工業株式会社 | 接続端子及びその製造方法、並びにソケット |
JP2013089313A (ja) * | 2011-10-13 | 2013-05-13 | Tyco Electronics Japan Kk | コネクタ |
US8641428B2 (en) * | 2011-12-02 | 2014-02-04 | Neoconix, Inc. | Electrical connector and method of making it |
US9119320B2 (en) * | 2012-04-13 | 2015-08-25 | Quanta Computer Inc. | System in package assembly |
JP6046392B2 (ja) | 2012-06-22 | 2016-12-14 | 新光電気工業株式会社 | 接続端子構造、インターポーザ、及びソケット |
US8614514B1 (en) * | 2013-03-13 | 2013-12-24 | Palo Alto Research Center Incorporated | Micro-spring chip attachment using ribbon bonds |
CN104064895A (zh) * | 2013-03-22 | 2014-09-24 | 富士康(昆山)电脑接插件有限公司 | 端子模组及其制造方法 |
US20140374912A1 (en) * | 2013-06-24 | 2014-12-25 | Palo Alto Research Center Incorporated | Micro-Spring Chip Attachment Using Solder-Based Interconnect Structures |
FR3009445B1 (fr) * | 2013-07-31 | 2017-03-31 | Hypertac Sa | Organe de contact entre un support et un dispositif et connecteur electrique comprenant un tel organe de contact |
JP6500258B2 (ja) * | 2015-06-12 | 2019-04-17 | 北川工業株式会社 | 接触部材 |
US9692147B1 (en) * | 2015-12-22 | 2017-06-27 | Intel Corporation | Small form factor sockets and connectors |
KR101947425B1 (ko) | 2016-05-12 | 2019-02-13 | 주식회사 아모텍 | 기능성 컨택터 |
WO2017196116A1 (ko) * | 2016-05-12 | 2017-11-16 | 주식회사 아모텍 | 기능성 컨택터 |
JP6358569B2 (ja) * | 2016-06-22 | 2018-07-18 | カシオ計算機株式会社 | 接続装置および時計 |
CN110927416B (zh) * | 2018-09-19 | 2022-01-28 | 台湾中华精测科技股份有限公司 | 探针卡测试装置及测试装置 |
TWI669511B (zh) * | 2018-09-19 | 2019-08-21 | 中華精測科技股份有限公司 | 探針卡測試裝置及測試裝置 |
CN111880067B (zh) * | 2019-04-15 | 2023-05-05 | 台湾中华精测科技股份有限公司 | 晶片测试组件及其电性连接模块 |
CN113130432B (zh) * | 2019-12-30 | 2022-12-27 | 华为机器有限公司 | 一种电子模块及电子设备 |
WO2021200642A1 (ja) * | 2020-03-31 | 2021-10-07 | 積水ポリマテック株式会社 | 導電部材 |
Family Cites Families (38)
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US3842189A (en) * | 1973-01-08 | 1974-10-15 | Rca Corp | Contact array and method of making the same |
US4553192A (en) * | 1983-08-25 | 1985-11-12 | International Business Machines Corporation | High density planar interconnected integrated circuit package |
US4677458A (en) * | 1983-11-04 | 1987-06-30 | Control Data Corporation | Ceramic IC package attachment apparatus |
JPH03100364U (zh) * | 1990-01-30 | 1991-10-21 | ||
JPH076840A (ja) * | 1993-06-18 | 1995-01-10 | Fujitsu Ltd | Ic試験用コンタクト |
US7073254B2 (en) * | 1993-11-16 | 2006-07-11 | Formfactor, Inc. | Method for mounting a plurality of spring contact elements |
US6482013B2 (en) * | 1993-11-16 | 2002-11-19 | Formfactor, Inc. | Microelectronic spring contact element and electronic component having a plurality of spring contact elements |
US6117694A (en) * | 1994-07-07 | 2000-09-12 | Tessera, Inc. | Flexible lead structures and methods of making same |
JPH08250243A (ja) * | 1995-03-15 | 1996-09-27 | Matsushita Electric Works Ltd | プリント基板接続構造 |
US5612520A (en) * | 1995-06-07 | 1997-03-18 | Ast Research, Inc. | Suspend switch for portable electronic equipment |
US5763941A (en) * | 1995-10-24 | 1998-06-09 | Tessera, Inc. | Connection component with releasable leads |
US7714235B1 (en) * | 1997-05-06 | 2010-05-11 | Formfactor, Inc. | Lithographically defined microelectronic contact structures |
US6807734B2 (en) * | 1998-02-13 | 2004-10-26 | Formfactor, Inc. | Microelectronic contact structures, and methods of making same |
CA2266158C (en) | 1999-03-18 | 2003-05-20 | Ibm Canada Limited-Ibm Canada Limitee | Connecting devices and method for interconnecting circuit components |
US7126220B2 (en) * | 2002-03-18 | 2006-10-24 | Nanonexus, Inc. | Miniaturized contact spring |
US6888362B2 (en) * | 2000-11-09 | 2005-05-03 | Formfactor, Inc. | Test head assembly for electronic components with plurality of contoured microelectronic spring contacts |
US7435108B1 (en) * | 1999-07-30 | 2008-10-14 | Formfactor, Inc. | Variable width resilient conductive contact structures |
US6827584B2 (en) * | 1999-12-28 | 2004-12-07 | Formfactor, Inc. | Interconnect for microelectronic structures with enhanced spring characteristics |
US7458816B1 (en) * | 2000-04-12 | 2008-12-02 | Formfactor, Inc. | Shaped spring |
JP2002033171A (ja) * | 2000-05-09 | 2002-01-31 | Sony Corp | 接続端子及びこれを有する電子部品コネクタ |
JP2002164104A (ja) * | 2000-11-22 | 2002-06-07 | Ando Electric Co Ltd | プローブカード |
US6532654B2 (en) * | 2001-01-12 | 2003-03-18 | International Business Machines Corporation | Method of forming an electrical connector |
US6528350B2 (en) * | 2001-05-21 | 2003-03-04 | Xerox Corporation | Method for fabricating a metal plated spring structure |
US6777319B2 (en) * | 2001-12-19 | 2004-08-17 | Formfactor, Inc. | Microelectronic spring contact repair |
US6684499B2 (en) * | 2002-01-07 | 2004-02-03 | Xerox Corporation | Method for fabricating a spring structure |
US7047638B2 (en) * | 2002-07-24 | 2006-05-23 | Formfactor, Inc | Method of making microelectronic spring contact array |
JP2004259530A (ja) * | 2003-02-25 | 2004-09-16 | Shinko Electric Ind Co Ltd | 外部接触端子を有する半導体装置及びその使用方法 |
KR100443999B1 (ko) * | 2003-02-28 | 2004-08-21 | 주식회사 파이컴 | 인쇄회로기판용 상호 접속체, 이의 제조방법 및 이를구비한 상호 접속 조립체 |
US20070020960A1 (en) * | 2003-04-11 | 2007-01-25 | Williams John D | Contact grid array system |
US6965245B2 (en) * | 2003-05-01 | 2005-11-15 | K&S Interconnect, Inc. | Prefabricated and attached interconnect structure |
US7015584B2 (en) * | 2003-07-08 | 2006-03-21 | Xerox Corporation | High force metal plated spring structure |
JP4170278B2 (ja) * | 2004-03-19 | 2008-10-22 | タイコエレクトロニクスアンプ株式会社 | コンタクト及び電気コネクタ |
US7057295B2 (en) * | 2004-04-22 | 2006-06-06 | Ted Ju | IC module assembly |
US7541219B2 (en) * | 2004-07-02 | 2009-06-02 | Seagate Technology Llc | Integrated metallic contact probe storage device |
US20060030179A1 (en) * | 2004-08-05 | 2006-02-09 | Palo Alto Research Center, Incorporated | Transmission-line spring structure |
US7782072B2 (en) * | 2006-09-27 | 2010-08-24 | Formfactor, Inc. | Single support structure probe group with staggered mounting pattern |
US7674112B2 (en) * | 2006-12-28 | 2010-03-09 | Formfactor, Inc. | Resilient contact element and methods of fabrication |
US8179693B2 (en) * | 2007-03-30 | 2012-05-15 | International Business Machines Corporation | Apparatus for electrically connecting two substrates using a land grid array connector provided with a frame structure having power distribution elements |
-
2009
- 2009-07-03 JP JP2009158994A patent/JP5606695B2/ja active Active
-
2010
- 2010-06-28 US US12/824,456 patent/US8179692B2/en active Active
- 2010-07-01 TW TW099121640A patent/TW201112500A/zh unknown
- 2010-07-02 CN CN201010223392.XA patent/CN101944523B/zh active Active
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