JP2011011917A5 - - Google Patents

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Publication number
JP2011011917A5
JP2011011917A5 JP2009154579A JP2009154579A JP2011011917A5 JP 2011011917 A5 JP2011011917 A5 JP 2011011917A5 JP 2009154579 A JP2009154579 A JP 2009154579A JP 2009154579 A JP2009154579 A JP 2009154579A JP 2011011917 A5 JP2011011917 A5 JP 2011011917A5
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JP
Japan
Prior art keywords
mirror
axis direction
disposed
laser light
laser
Prior art date
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Application number
JP2009154579A
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English (en)
Japanese (ja)
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JP5667347B2 (ja
JP2011011917A (ja
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Publication date
Application filed filed Critical
Priority claimed from JP2009154579A external-priority patent/JP5667347B2/ja
Priority to JP2009154579A priority Critical patent/JP5667347B2/ja
Priority to TW099120760A priority patent/TWI395630B/zh
Priority to EP10167689.8A priority patent/EP2275223B1/en
Priority to KR1020100061831A priority patent/KR101226200B1/ko
Priority to US12/827,267 priority patent/US8448471B2/en
Priority to CN2010102211704A priority patent/CN101935156A/zh
Publication of JP2011011917A publication Critical patent/JP2011011917A/ja
Publication of JP2011011917A5 publication Critical patent/JP2011011917A5/ja
Publication of JP5667347B2 publication Critical patent/JP5667347B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009154579A 2009-06-30 2009-06-30 レーザ光によるガラス基板加工装置 Expired - Fee Related JP5667347B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2009154579A JP5667347B2 (ja) 2009-06-30 2009-06-30 レーザ光によるガラス基板加工装置
TW099120760A TWI395630B (zh) 2009-06-30 2010-06-25 使用雷射光之玻璃基板加工裝置
EP10167689.8A EP2275223B1 (en) 2009-06-30 2010-06-29 Glass substrate processing device using laser beam with rotation of multi-spot focused beams
KR1020100061831A KR101226200B1 (ko) 2009-06-30 2010-06-29 레이저광에 의한 유리 기판 가공 장치
US12/827,267 US8448471B2 (en) 2009-06-30 2010-06-30 Glass substrate processing device using laser beam
CN2010102211704A CN101935156A (zh) 2009-06-30 2010-06-30 利用激光的玻璃基板加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009154579A JP5667347B2 (ja) 2009-06-30 2009-06-30 レーザ光によるガラス基板加工装置

Publications (3)

Publication Number Publication Date
JP2011011917A JP2011011917A (ja) 2011-01-20
JP2011011917A5 true JP2011011917A5 (https=) 2012-03-29
JP5667347B2 JP5667347B2 (ja) 2015-02-12

Family

ID=43591182

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009154579A Expired - Fee Related JP5667347B2 (ja) 2009-06-30 2009-06-30 レーザ光によるガラス基板加工装置

Country Status (1)

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JP (1) JP5667347B2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013146780A (ja) * 2012-01-23 2013-08-01 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板のレーザ加工方法
JP2013180298A (ja) 2012-02-29 2013-09-12 Mitsuboshi Diamond Industrial Co Ltd レーザ加工装置
JP2014042916A (ja) * 2012-08-24 2014-03-13 Mitsuboshi Diamond Industrial Co Ltd レーザ加工装置
JP6035096B2 (ja) * 2012-09-27 2016-11-30 三星ダイヤモンド工業株式会社 レーザ加工装置
JP2015047621A (ja) * 2013-09-02 2015-03-16 三菱重工業株式会社 複合加工装置及び複合加工方法
JP2018006509A (ja) * 2016-06-30 2018-01-11 三星ダイヤモンド工業株式会社 基板の加工方法及び加工装置
JP6813168B2 (ja) * 2016-07-29 2021-01-13 三星ダイヤモンド工業株式会社 脆性材料基板のレーザー加工方法およびレーザー加工装置
JP6810951B2 (ja) * 2016-07-29 2021-01-13 三星ダイヤモンド工業株式会社 脆性材料基板のレーザー加工方法およびレーザー加工装置
CN106271118B (zh) * 2016-09-29 2018-10-30 常州英诺激光科技有限公司 一种提高多孔径微孔激光加工质量的装置及方法
JP7768757B2 (ja) * 2021-12-24 2025-11-12 株式会社ディスコ 面処理装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05305467A (ja) * 1992-04-27 1993-11-19 Central Glass Co Ltd 光透過性材料のレーザー切断法
DE19983939B4 (de) * 1999-03-05 2005-02-17 Mitsubishi Denki K.K. Laserstrahlmaschine
JP2003305585A (ja) * 2001-09-11 2003-10-28 Seiko Epson Corp レーザー加工方法および加工装置
JP2004268144A (ja) * 2003-02-21 2004-09-30 Seishin Shoji Kk レーザ加工装置
JP2004262686A (ja) * 2003-02-28 2004-09-24 Central Glass Co Ltd ガラス板の切断方法及び切断されたガラス板
US7820941B2 (en) * 2004-07-30 2010-10-26 Corning Incorporated Process and apparatus for scoring a brittle material
JP2007015169A (ja) * 2005-07-06 2007-01-25 Seiko Epson Corp スクライブ形成方法、スクライブ形成装置、多層基板
JP2007118054A (ja) * 2005-10-28 2007-05-17 Aisin Seiki Co Ltd レーザ加工方法及びレーザ加工装置
JP2006173651A (ja) * 2006-02-17 2006-06-29 Matsushita Electric Ind Co Ltd 部品実装装置、部品実装設備および部品実装方法

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