JP2011011917A5 - - Google Patents

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Publication number
JP2011011917A5
JP2011011917A5 JP2009154579A JP2009154579A JP2011011917A5 JP 2011011917 A5 JP2011011917 A5 JP 2011011917A5 JP 2009154579 A JP2009154579 A JP 2009154579A JP 2009154579 A JP2009154579 A JP 2009154579A JP 2011011917 A5 JP2011011917 A5 JP 2011011917A5
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JP
Japan
Prior art keywords
mirror
axis direction
disposed
laser light
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009154579A
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Japanese (ja)
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JP2011011917A (en
JP5667347B2 (en
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2009154579A external-priority patent/JP5667347B2/en
Priority to JP2009154579A priority Critical patent/JP5667347B2/en
Priority to TW099120760A priority patent/TWI395630B/en
Priority to EP10167689.8A priority patent/EP2275223B1/en
Priority to KR1020100061831A priority patent/KR101226200B1/en
Priority to US12/827,267 priority patent/US8448471B2/en
Priority to CN2010102211704A priority patent/CN101935156A/en
Publication of JP2011011917A publication Critical patent/JP2011011917A/en
Publication of JP2011011917A5 publication Critical patent/JP2011011917A5/ja
Publication of JP5667347B2 publication Critical patent/JP5667347B2/en
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

第1ミラー25は、レーザ光出力部15の出力側の近傍に配置されており、y軸方向に出射されたレーザ光をx軸方向に反射する。第2ミラー26は、y軸方向において第1ミラー25と並べて配置されており、x軸方向に進行するレーザ光をy軸方向に反射して、ワークテーブル2側に導く。第3ミラー27は、中空モータ17の上方に配置されており、第2ミラー26によって反射されてきたレーザ光を下方(z軸方向)に導く。第4ミラー28は中空モータ17の横方向に近接して配置されており、第3ミラー27によって反射されてきたレーザ光を中空モータ17に導く。ビームエキスパンダ30は第2ミラー26と第3ミラー27との間に配置され、第2ミラー26によって反射されてきたレーザ光を一定の倍率の平行光束に拡げるために設けられている。このビームエキスパンダ30によって、レーザ光をより小さなスポットに集光させることが可能となる。 The first mirror 25 is disposed in the vicinity of the output side of the laser beam output unit 15 and reflects the laser beam emitted in the y-axis direction in the x-axis direction. The second mirror 26 is arranged side by side with the first mirror 25 in the y-axis direction, reflects the laser light traveling in the x-axis direction in the y-axis direction, and guides it to the work table 2 side. The third mirror 27 is disposed above the hollow motor 17 and guides the laser light reflected by the second mirror 26 downward (z-axis direction) . The fourth mirror 28 is disposed in proximity to the transverse direction of the hollow motor 17, guiding the laser beam that has been reflected by the third mirror 27 to the intermediate air motor 17. The beam expander 30 is disposed between the second mirror 26 and the third mirror 27, and is provided to spread the laser light reflected by the second mirror 26 into a parallel light beam having a constant magnification. This beam expander 30 makes it possible to focus laser light on a smaller spot.

JP2009154579A 2009-06-30 2009-06-30 Glass substrate processing equipment using laser light Expired - Fee Related JP5667347B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2009154579A JP5667347B2 (en) 2009-06-30 2009-06-30 Glass substrate processing equipment using laser light
TW099120760A TWI395630B (en) 2009-06-30 2010-06-25 Apparatus for processing glass substrate by laser beam
EP10167689.8A EP2275223B1 (en) 2009-06-30 2010-06-29 Glass substrate processing device using laser beam with rotation of multi-spot focused beams
KR1020100061831A KR101226200B1 (en) 2009-06-30 2010-06-29 Apparatus for processing glass substrate by laser beam
US12/827,267 US8448471B2 (en) 2009-06-30 2010-06-30 Glass substrate processing device using laser beam
CN2010102211704A CN101935156A (en) 2009-06-30 2010-06-30 Utilize the glass substrate processing unit (plant) of laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009154579A JP5667347B2 (en) 2009-06-30 2009-06-30 Glass substrate processing equipment using laser light

Publications (3)

Publication Number Publication Date
JP2011011917A JP2011011917A (en) 2011-01-20
JP2011011917A5 true JP2011011917A5 (en) 2012-03-29
JP5667347B2 JP5667347B2 (en) 2015-02-12

Family

ID=43591182

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009154579A Expired - Fee Related JP5667347B2 (en) 2009-06-30 2009-06-30 Glass substrate processing equipment using laser light

Country Status (1)

Country Link
JP (1) JP5667347B2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013146780A (en) * 2012-01-23 2013-08-01 Mitsuboshi Diamond Industrial Co Ltd Method for laser processing brittle material substrate
JP2013180298A (en) 2012-02-29 2013-09-12 Mitsuboshi Diamond Industrial Co Ltd Laser beam machining apparatus
JP2014042916A (en) * 2012-08-24 2014-03-13 Mitsuboshi Diamond Industrial Co Ltd Laser processing apparatus
JP6035096B2 (en) * 2012-09-27 2016-11-30 三星ダイヤモンド工業株式会社 Laser processing equipment
JP2015047621A (en) * 2013-09-02 2015-03-16 三菱重工業株式会社 Composite processing device and composite processing method
JP6813168B2 (en) * 2016-07-29 2021-01-13 三星ダイヤモンド工業株式会社 Laser processing method and laser processing equipment for brittle material substrates
JP6810951B2 (en) * 2016-07-29 2021-01-13 三星ダイヤモンド工業株式会社 Laser processing method and laser processing equipment for brittle material substrates
CN106271118B (en) * 2016-09-29 2018-10-30 常州英诺激光科技有限公司 A kind of device and method improving multiple aperture micropore laser processing quality

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05305467A (en) * 1992-04-27 1993-11-19 Central Glass Co Ltd Method for cutting optical transmission material by laser beam
DE19983939B4 (en) * 1999-03-05 2005-02-17 Mitsubishi Denki K.K. laser beam machine
JP2003305585A (en) * 2001-09-11 2003-10-28 Seiko Epson Corp Laser beam machining method and machining device
JP2004268144A (en) * 2003-02-21 2004-09-30 Seishin Shoji Kk Laser beam machining device
JP2004262686A (en) * 2003-02-28 2004-09-24 Central Glass Co Ltd Method for cutting glass plate and cut glass plate
US7820941B2 (en) * 2004-07-30 2010-10-26 Corning Incorporated Process and apparatus for scoring a brittle material
JP2007015169A (en) * 2005-07-06 2007-01-25 Seiko Epson Corp Scribing formation method, scribing formation apparatus, and multilayer substrate
JP2007118054A (en) * 2005-10-28 2007-05-17 Aisin Seiki Co Ltd Method and apparatus for laser beam machining
JP2006173651A (en) * 2006-02-17 2006-06-29 Matsushita Electric Ind Co Ltd Component-mounting equipment, component-mounting facility, and method for component-mounting

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