JP2011011917A5 - - Google Patents
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- JP2011011917A5 JP2011011917A5 JP2009154579A JP2009154579A JP2011011917A5 JP 2011011917 A5 JP2011011917 A5 JP 2011011917A5 JP 2009154579 A JP2009154579 A JP 2009154579A JP 2009154579 A JP2009154579 A JP 2009154579A JP 2011011917 A5 JP2011011917 A5 JP 2011011917A5
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- mirror
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- disposed
- laser light
- laser
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Description
第1ミラー25は、レーザ光出力部15の出力側の近傍に配置されており、y軸方向に出射されたレーザ光をx軸方向に反射する。第2ミラー26は、y軸方向において第1ミラー25と並べて配置されており、x軸方向に進行するレーザ光をy軸方向に反射して、ワークテーブル2側に導く。第3ミラー27は、中空モータ17の上方に配置されており、第2ミラー26によって反射されてきたレーザ光を下方(z軸方向)に導く。第4ミラー28は中空モータ17の横方向に近接して配置されており、第3ミラー27によって反射されてきたレーザ光を中空モータ17に導く。ビームエキスパンダ30は第2ミラー26と第3ミラー27との間に配置され、第2ミラー26によって反射されてきたレーザ光を一定の倍率の平行光束に拡げるために設けられている。このビームエキスパンダ30によって、レーザ光をより小さなスポットに集光させることが可能となる。 The first mirror 25 is disposed in the vicinity of the output side of the laser beam output unit 15 and reflects the laser beam emitted in the y-axis direction in the x-axis direction. The second mirror 26 is arranged side by side with the first mirror 25 in the y-axis direction, reflects the laser light traveling in the x-axis direction in the y-axis direction, and guides it to the work table 2 side. The third mirror 27 is disposed above the hollow motor 17 and guides the laser light reflected by the second mirror 26 downward (z-axis direction) . The fourth mirror 28 is disposed in proximity to the transverse direction of the hollow motor 17, guiding the laser beam that has been reflected by the third mirror 27 to the intermediate air motor 17. The beam expander 30 is disposed between the second mirror 26 and the third mirror 27, and is provided to spread the laser light reflected by the second mirror 26 into a parallel light beam having a constant magnification. This beam expander 30 makes it possible to focus laser light on a smaller spot.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009154579A JP5667347B2 (en) | 2009-06-30 | 2009-06-30 | Glass substrate processing equipment using laser light |
TW099120760A TWI395630B (en) | 2009-06-30 | 2010-06-25 | Apparatus for processing glass substrate by laser beam |
EP10167689.8A EP2275223B1 (en) | 2009-06-30 | 2010-06-29 | Glass substrate processing device using laser beam with rotation of multi-spot focused beams |
KR1020100061831A KR101226200B1 (en) | 2009-06-30 | 2010-06-29 | Apparatus for processing glass substrate by laser beam |
US12/827,267 US8448471B2 (en) | 2009-06-30 | 2010-06-30 | Glass substrate processing device using laser beam |
CN2010102211704A CN101935156A (en) | 2009-06-30 | 2010-06-30 | Utilize the glass substrate processing unit (plant) of laser |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009154579A JP5667347B2 (en) | 2009-06-30 | 2009-06-30 | Glass substrate processing equipment using laser light |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011011917A JP2011011917A (en) | 2011-01-20 |
JP2011011917A5 true JP2011011917A5 (en) | 2012-03-29 |
JP5667347B2 JP5667347B2 (en) | 2015-02-12 |
Family
ID=43591182
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009154579A Expired - Fee Related JP5667347B2 (en) | 2009-06-30 | 2009-06-30 | Glass substrate processing equipment using laser light |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5667347B2 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013146780A (en) * | 2012-01-23 | 2013-08-01 | Mitsuboshi Diamond Industrial Co Ltd | Method for laser processing brittle material substrate |
JP2013180298A (en) | 2012-02-29 | 2013-09-12 | Mitsuboshi Diamond Industrial Co Ltd | Laser beam machining apparatus |
JP2014042916A (en) * | 2012-08-24 | 2014-03-13 | Mitsuboshi Diamond Industrial Co Ltd | Laser processing apparatus |
JP6035096B2 (en) * | 2012-09-27 | 2016-11-30 | 三星ダイヤモンド工業株式会社 | Laser processing equipment |
JP2015047621A (en) * | 2013-09-02 | 2015-03-16 | 三菱重工業株式会社 | Composite processing device and composite processing method |
JP6813168B2 (en) * | 2016-07-29 | 2021-01-13 | 三星ダイヤモンド工業株式会社 | Laser processing method and laser processing equipment for brittle material substrates |
JP6810951B2 (en) * | 2016-07-29 | 2021-01-13 | 三星ダイヤモンド工業株式会社 | Laser processing method and laser processing equipment for brittle material substrates |
CN106271118B (en) * | 2016-09-29 | 2018-10-30 | 常州英诺激光科技有限公司 | A kind of device and method improving multiple aperture micropore laser processing quality |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05305467A (en) * | 1992-04-27 | 1993-11-19 | Central Glass Co Ltd | Method for cutting optical transmission material by laser beam |
DE19983939B4 (en) * | 1999-03-05 | 2005-02-17 | Mitsubishi Denki K.K. | laser beam machine |
JP2003305585A (en) * | 2001-09-11 | 2003-10-28 | Seiko Epson Corp | Laser beam machining method and machining device |
JP2004268144A (en) * | 2003-02-21 | 2004-09-30 | Seishin Shoji Kk | Laser beam machining device |
JP2004262686A (en) * | 2003-02-28 | 2004-09-24 | Central Glass Co Ltd | Method for cutting glass plate and cut glass plate |
US7820941B2 (en) * | 2004-07-30 | 2010-10-26 | Corning Incorporated | Process and apparatus for scoring a brittle material |
JP2007015169A (en) * | 2005-07-06 | 2007-01-25 | Seiko Epson Corp | Scribing formation method, scribing formation apparatus, and multilayer substrate |
JP2007118054A (en) * | 2005-10-28 | 2007-05-17 | Aisin Seiki Co Ltd | Method and apparatus for laser beam machining |
JP2006173651A (en) * | 2006-02-17 | 2006-06-29 | Matsushita Electric Ind Co Ltd | Component-mounting equipment, component-mounting facility, and method for component-mounting |
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2009
- 2009-06-30 JP JP2009154579A patent/JP5667347B2/en not_active Expired - Fee Related
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