JP2011006683A5 - - Google Patents

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Publication number
JP2011006683A5
JP2011006683A5 JP2010142846A JP2010142846A JP2011006683A5 JP 2011006683 A5 JP2011006683 A5 JP 2011006683A5 JP 2010142846 A JP2010142846 A JP 2010142846A JP 2010142846 A JP2010142846 A JP 2010142846A JP 2011006683 A5 JP2011006683 A5 JP 2011006683A5
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JP
Japan
Prior art keywords
group
component
resin composition
thermosetting resin
general formula
Prior art date
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Pending
Application number
JP2010142846A
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English (en)
Japanese (ja)
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JP2011006683A (ja
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Publication date
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Priority to JP2010142846A priority Critical patent/JP2011006683A/ja
Priority claimed from JP2010142846A external-priority patent/JP2011006683A/ja
Publication of JP2011006683A publication Critical patent/JP2011006683A/ja
Publication of JP2011006683A5 publication Critical patent/JP2011006683A5/ja
Pending legal-status Critical Current

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JP2010142846A 2004-02-04 2010-06-23 熱硬化性樹脂組成物及びそれを用いたプリプレグ、金属張積層板、印刷配線板 Pending JP2011006683A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010142846A JP2011006683A (ja) 2004-02-04 2010-06-23 熱硬化性樹脂組成物及びそれを用いたプリプレグ、金属張積層板、印刷配線板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004028433 2004-02-04
JP2010142846A JP2011006683A (ja) 2004-02-04 2010-06-23 熱硬化性樹脂組成物及びそれを用いたプリプレグ、金属張積層板、印刷配線板

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004207060A Division JP2005248147A (ja) 2004-02-04 2004-07-14 熱硬化性樹脂組成物及びそれを用いたプリプレグ、金属張積層板、印刷配線板

Publications (2)

Publication Number Publication Date
JP2011006683A JP2011006683A (ja) 2011-01-13
JP2011006683A5 true JP2011006683A5 (OSRAM) 2012-12-20

Family

ID=43563681

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010142846A Pending JP2011006683A (ja) 2004-02-04 2010-06-23 熱硬化性樹脂組成物及びそれを用いたプリプレグ、金属張積層板、印刷配線板

Country Status (1)

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JP (1) JP2011006683A (OSRAM)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140043762A (ko) * 2011-06-30 2014-04-10 다우 글로벌 테크놀로지스 엘엘씨 경화성 조성물
EP2726547B1 (en) * 2011-06-30 2016-06-29 Blue Cube IP LLC Curable compositions
CN102276837B (zh) * 2011-08-19 2013-01-02 慧智科技(中国)有限公司 无卤含磷的阻燃聚酰亚胺树脂组合物及其制备方法
US9914803B2 (en) * 2013-06-28 2018-03-13 Saint-Gobain Performance Plastics Corporation Cyanate resin blends and radomes including them
KR20170023809A (ko) * 2014-06-26 2017-03-06 블루 큐브 아이피 엘엘씨 경화성 조성물
JP6231067B2 (ja) * 2015-12-24 2017-11-15 ブルー キューブ アイピー エルエルシー 硬化性組成物
CN110982267B (zh) * 2016-12-07 2024-03-08 株式会社力森诺科 热固化性树脂组合物及其制造方法、预浸渍体、层叠板以及印制线路板
HK1258949B (zh) * 2016-12-07 2020-07-17 Resonac Corporation 树脂清漆、预浸渍体、层叠板及印制线路板
WO2022052106A1 (zh) * 2020-09-14 2022-03-17 穗晔实业股份有限公司 无卤热固性树脂组成物及其用途

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09324108A (ja) * 1996-06-07 1997-12-16 Sumitomo Bakelite Co Ltd 難燃性樹脂組成物およびこれを用いた積層板
JP2001181388A (ja) * 1999-12-27 2001-07-03 Hitachi Chem Co Ltd フェノール変性シアネートオリゴマー組成物の製造方法、この方法によって得られるフェノール変性シアネートオリゴマー組成物並びにこれを用いたプリプレグ及び金属張積層板
JP4055424B2 (ja) * 2001-01-30 2008-03-05 日立化成工業株式会社 熱硬化性樹脂組成物及びその使用
JP4738622B2 (ja) * 2001-04-13 2011-08-03 住友ベークライト株式会社 耐熱性樹脂組成物、これを用いたプリプレグ及び積層板
TWI278481B (en) * 2002-04-16 2007-04-11 Hitachi Chemical Co Ltd Thermosetting resin composition, prepreg and laminate using the same

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