JP2010539485A - 少なくともウェハの一部の画像を表示するコンピュータ実行方法、キャリア媒体およびシステム - Google Patents

少なくともウェハの一部の画像を表示するコンピュータ実行方法、キャリア媒体およびシステム Download PDF

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Publication number
JP2010539485A
JP2010539485A JP2010524958A JP2010524958A JP2010539485A JP 2010539485 A JP2010539485 A JP 2010539485A JP 2010524958 A JP2010524958 A JP 2010524958A JP 2010524958 A JP2010524958 A JP 2010524958A JP 2010539485 A JP2010539485 A JP 2010539485A
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JP
Japan
Prior art keywords
wafer
image
displaying
different
user
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Pending
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JP2010524958A
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English (en)
Japanese (ja)
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JP2010539485A5 (enExample
Inventor
ウー・ショーン
リチャーズ・チャールズ
ラマチャンドラン・ラジャゴパラン
オウヤン・ミン
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KLA Corp
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KLA Tencor Corp
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Application filed by KLA Tencor Corp filed Critical KLA Tencor Corp
Publication of JP2010539485A publication Critical patent/JP2010539485A/ja
Publication of JP2010539485A5 publication Critical patent/JP2010539485A5/ja
Pending legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2200/00Indexing scheme for image data processing or generation, in general
    • G06T2200/24Indexing scheme for image data processing or generation, in general involving graphical user interfaces [GUIs]
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/10Image acquisition modality
    • G06T2207/10056Microscopic image
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30148Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2010524958A 2007-09-14 2008-09-10 少なくともウェハの一部の画像を表示するコンピュータ実行方法、キャリア媒体およびシステム Pending JP2010539485A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/855,581 US20110304527A1 (en) 2007-09-14 2007-09-14 Computer-implemented methods, carrier media, and systems for displaying an image of at least a portion of a wafer
PCT/US2008/075867 WO2009036072A1 (en) 2007-09-14 2008-09-10 Computer-implemented methods, carrier media, and systems for displaying an image of at least a portion of a wafer

Publications (2)

Publication Number Publication Date
JP2010539485A true JP2010539485A (ja) 2010-12-16
JP2010539485A5 JP2010539485A5 (enExample) 2011-10-06

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JP2010524958A Pending JP2010539485A (ja) 2007-09-14 2008-09-10 少なくともウェハの一部の画像を表示するコンピュータ実行方法、キャリア媒体およびシステム

Country Status (3)

Country Link
US (1) US20110304527A1 (enExample)
JP (1) JP2010539485A (enExample)
WO (1) WO2009036072A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018517146A (ja) * 2015-03-23 2018-06-28 テックインサイツ インコーポレイテッド イメージング装置における歪み補正に関する方法、システム及び装置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1982160A4 (en) 2006-02-09 2016-02-17 Kla Tencor Tech Corp METHOD AND SYSTEMS FOR DETERMINING A WAFER FEATURE
US8030119B2 (en) * 2008-03-08 2011-10-04 Crystal Solar, Inc. Integrated method and system for manufacturing monolithic panels of crystalline solar cells
WO2009155502A2 (en) 2008-06-19 2009-12-23 Kla-Tencor Corporation Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a wafer
US9222895B2 (en) 2013-02-25 2015-12-29 Kla-Tencor Corp. Generalized virtual inspector
US9816939B2 (en) 2014-07-22 2017-11-14 Kla-Tencor Corp. Virtual inspection systems with multiple modes
US11216932B1 (en) * 2021-03-26 2022-01-04 Minds AI Technologies Ltd Electronic substrate defect detection

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0374854A (ja) * 1989-08-16 1991-03-29 Toshiba Corp 表面検査装置
JPH0454443A (ja) * 1990-06-22 1992-02-21 Fuji Photo Film Co Ltd 欠陥検査装置
JP2001099788A (ja) * 1999-09-28 2001-04-13 Sharp Corp 自動マクロ外観検査装置
JP2001210690A (ja) * 2000-01-27 2001-08-03 Sharp Corp 半導体ウェハのマクロ検査装置
JP2005017270A (ja) * 2003-06-06 2005-01-20 Ebara Corp 欠陥検査方法及びデバイス製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010001224A (ko) * 1999-06-02 2001-01-05 윤종용 웨이퍼 불량검사 방법 및 장치
TW571089B (en) * 2000-04-21 2004-01-11 Nikon Corp Defect testing apparatus and defect testing method
US7155052B2 (en) * 2002-06-10 2006-12-26 Tokyo Seimitsu (Israel) Ltd Method for pattern inspection
KR100492158B1 (ko) * 2002-11-19 2005-06-02 삼성전자주식회사 웨이퍼 검사 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0374854A (ja) * 1989-08-16 1991-03-29 Toshiba Corp 表面検査装置
JPH0454443A (ja) * 1990-06-22 1992-02-21 Fuji Photo Film Co Ltd 欠陥検査装置
JP2001099788A (ja) * 1999-09-28 2001-04-13 Sharp Corp 自動マクロ外観検査装置
JP2001210690A (ja) * 2000-01-27 2001-08-03 Sharp Corp 半導体ウェハのマクロ検査装置
JP2005017270A (ja) * 2003-06-06 2005-01-20 Ebara Corp 欠陥検査方法及びデバイス製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018517146A (ja) * 2015-03-23 2018-06-28 テックインサイツ インコーポレイテッド イメージング装置における歪み補正に関する方法、システム及び装置
JP7294806B2 (ja) 2015-03-23 2023-06-20 テックインサイツ インコーポレイテッド イメージング装置における歪み補正に関する方法、システム及び装置

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WO2009036072A1 (en) 2009-03-19
US20110304527A1 (en) 2011-12-15

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