JP2010539485A - 少なくともウェハの一部の画像を表示するコンピュータ実行方法、キャリア媒体およびシステム - Google Patents
少なくともウェハの一部の画像を表示するコンピュータ実行方法、キャリア媒体およびシステム Download PDFInfo
- Publication number
- JP2010539485A JP2010539485A JP2010524958A JP2010524958A JP2010539485A JP 2010539485 A JP2010539485 A JP 2010539485A JP 2010524958 A JP2010524958 A JP 2010524958A JP 2010524958 A JP2010524958 A JP 2010524958A JP 2010539485 A JP2010539485 A JP 2010539485A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- image
- displaying
- different
- user
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2200/00—Indexing scheme for image data processing or generation, in general
- G06T2200/24—Indexing scheme for image data processing or generation, in general involving graphical user interfaces [GUIs]
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10056—Microscopic image
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Landscapes
- Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Image Processing (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/855,581 US20110304527A1 (en) | 2007-09-14 | 2007-09-14 | Computer-implemented methods, carrier media, and systems for displaying an image of at least a portion of a wafer |
| PCT/US2008/075867 WO2009036072A1 (en) | 2007-09-14 | 2008-09-10 | Computer-implemented methods, carrier media, and systems for displaying an image of at least a portion of a wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010539485A true JP2010539485A (ja) | 2010-12-16 |
| JP2010539485A5 JP2010539485A5 (enExample) | 2011-10-06 |
Family
ID=40452456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010524958A Pending JP2010539485A (ja) | 2007-09-14 | 2008-09-10 | 少なくともウェハの一部の画像を表示するコンピュータ実行方法、キャリア媒体およびシステム |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20110304527A1 (enExample) |
| JP (1) | JP2010539485A (enExample) |
| WO (1) | WO2009036072A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018517146A (ja) * | 2015-03-23 | 2018-06-28 | テックインサイツ インコーポレイテッド | イメージング装置における歪み補正に関する方法、システム及び装置 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1982160A4 (en) | 2006-02-09 | 2016-02-17 | Kla Tencor Tech Corp | METHOD AND SYSTEMS FOR DETERMINING A WAFER FEATURE |
| US8030119B2 (en) * | 2008-03-08 | 2011-10-04 | Crystal Solar, Inc. | Integrated method and system for manufacturing monolithic panels of crystalline solar cells |
| WO2009155502A2 (en) | 2008-06-19 | 2009-12-23 | Kla-Tencor Corporation | Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a wafer |
| US9222895B2 (en) | 2013-02-25 | 2015-12-29 | Kla-Tencor Corp. | Generalized virtual inspector |
| US9816939B2 (en) | 2014-07-22 | 2017-11-14 | Kla-Tencor Corp. | Virtual inspection systems with multiple modes |
| US11216932B1 (en) * | 2021-03-26 | 2022-01-04 | Minds AI Technologies Ltd | Electronic substrate defect detection |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0374854A (ja) * | 1989-08-16 | 1991-03-29 | Toshiba Corp | 表面検査装置 |
| JPH0454443A (ja) * | 1990-06-22 | 1992-02-21 | Fuji Photo Film Co Ltd | 欠陥検査装置 |
| JP2001099788A (ja) * | 1999-09-28 | 2001-04-13 | Sharp Corp | 自動マクロ外観検査装置 |
| JP2001210690A (ja) * | 2000-01-27 | 2001-08-03 | Sharp Corp | 半導体ウェハのマクロ検査装置 |
| JP2005017270A (ja) * | 2003-06-06 | 2005-01-20 | Ebara Corp | 欠陥検査方法及びデバイス製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010001224A (ko) * | 1999-06-02 | 2001-01-05 | 윤종용 | 웨이퍼 불량검사 방법 및 장치 |
| TW571089B (en) * | 2000-04-21 | 2004-01-11 | Nikon Corp | Defect testing apparatus and defect testing method |
| US7155052B2 (en) * | 2002-06-10 | 2006-12-26 | Tokyo Seimitsu (Israel) Ltd | Method for pattern inspection |
| KR100492158B1 (ko) * | 2002-11-19 | 2005-06-02 | 삼성전자주식회사 | 웨이퍼 검사 장치 |
-
2007
- 2007-09-14 US US11/855,581 patent/US20110304527A1/en not_active Abandoned
-
2008
- 2008-09-10 JP JP2010524958A patent/JP2010539485A/ja active Pending
- 2008-09-10 WO PCT/US2008/075867 patent/WO2009036072A1/en not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0374854A (ja) * | 1989-08-16 | 1991-03-29 | Toshiba Corp | 表面検査装置 |
| JPH0454443A (ja) * | 1990-06-22 | 1992-02-21 | Fuji Photo Film Co Ltd | 欠陥検査装置 |
| JP2001099788A (ja) * | 1999-09-28 | 2001-04-13 | Sharp Corp | 自動マクロ外観検査装置 |
| JP2001210690A (ja) * | 2000-01-27 | 2001-08-03 | Sharp Corp | 半導体ウェハのマクロ検査装置 |
| JP2005017270A (ja) * | 2003-06-06 | 2005-01-20 | Ebara Corp | 欠陥検査方法及びデバイス製造方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018517146A (ja) * | 2015-03-23 | 2018-06-28 | テックインサイツ インコーポレイテッド | イメージング装置における歪み補正に関する方法、システム及び装置 |
| JP7294806B2 (ja) | 2015-03-23 | 2023-06-20 | テックインサイツ インコーポレイテッド | イメージング装置における歪み補正に関する方法、システム及び装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009036072A1 (en) | 2009-03-19 |
| US20110304527A1 (en) | 2011-12-15 |
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