JP2010539485A5 - - Google Patents

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Publication number
JP2010539485A5
JP2010539485A5 JP2010524958A JP2010524958A JP2010539485A5 JP 2010539485 A5 JP2010539485 A5 JP 2010539485A5 JP 2010524958 A JP2010524958 A JP 2010524958A JP 2010524958 A JP2010524958 A JP 2010524958A JP 2010539485 A5 JP2010539485 A5 JP 2010539485A5
Authority
JP
Japan
Prior art keywords
displaying
user
wafer
different
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010524958A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010539485A (ja
Filing date
Publication date
Priority claimed from US11/855,581 external-priority patent/US20110304527A1/en
Application filed filed Critical
Publication of JP2010539485A publication Critical patent/JP2010539485A/ja
Publication of JP2010539485A5 publication Critical patent/JP2010539485A5/ja
Pending legal-status Critical Current

Links

JP2010524958A 2007-09-14 2008-09-10 少なくともウェハの一部の画像を表示するコンピュータ実行方法、キャリア媒体およびシステム Pending JP2010539485A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/855,581 US20110304527A1 (en) 2007-09-14 2007-09-14 Computer-implemented methods, carrier media, and systems for displaying an image of at least a portion of a wafer
PCT/US2008/075867 WO2009036072A1 (en) 2007-09-14 2008-09-10 Computer-implemented methods, carrier media, and systems for displaying an image of at least a portion of a wafer

Publications (2)

Publication Number Publication Date
JP2010539485A JP2010539485A (ja) 2010-12-16
JP2010539485A5 true JP2010539485A5 (enExample) 2011-10-06

Family

ID=40452456

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010524958A Pending JP2010539485A (ja) 2007-09-14 2008-09-10 少なくともウェハの一部の画像を表示するコンピュータ実行方法、キャリア媒体およびシステム

Country Status (3)

Country Link
US (1) US20110304527A1 (enExample)
JP (1) JP2010539485A (enExample)
WO (1) WO2009036072A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1982160A4 (en) 2006-02-09 2016-02-17 Kla Tencor Tech Corp METHOD AND SYSTEMS FOR DETERMINING A WAFER FEATURE
US8030119B2 (en) * 2008-03-08 2011-10-04 Crystal Solar, Inc. Integrated method and system for manufacturing monolithic panels of crystalline solar cells
WO2009155502A2 (en) 2008-06-19 2009-12-23 Kla-Tencor Corporation Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a wafer
US9222895B2 (en) 2013-02-25 2015-12-29 Kla-Tencor Corp. Generalized virtual inspector
US9816939B2 (en) 2014-07-22 2017-11-14 Kla-Tencor Corp. Virtual inspection systems with multiple modes
WO2016149817A1 (en) * 2015-03-23 2016-09-29 Techinsights Inc. Methods, systems and devices relating to distortion correction in imaging devices
US11216932B1 (en) * 2021-03-26 2022-01-04 Minds AI Technologies Ltd Electronic substrate defect detection

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0713993B2 (ja) * 1989-08-16 1995-02-15 株式会社東芝 表面検査装置
JP2577651B2 (ja) * 1990-06-22 1997-02-05 富士写真フイルム株式会社 欠陥検査装置
KR20010001224A (ko) * 1999-06-02 2001-01-05 윤종용 웨이퍼 불량검사 방법 및 장치
JP2001099788A (ja) * 1999-09-28 2001-04-13 Sharp Corp 自動マクロ外観検査装置
JP3654501B2 (ja) * 2000-01-27 2005-06-02 シャープ株式会社 半導体ウェハのマクロ検査装置
TW571089B (en) * 2000-04-21 2004-01-11 Nikon Corp Defect testing apparatus and defect testing method
US7155052B2 (en) * 2002-06-10 2006-12-26 Tokyo Seimitsu (Israel) Ltd Method for pattern inspection
KR100492158B1 (ko) * 2002-11-19 2005-06-02 삼성전자주식회사 웨이퍼 검사 장치
JP4642362B2 (ja) * 2003-06-06 2011-03-02 株式会社荏原製作所 基板位置合わせ方法、基板表面検査方法、基板位置決め方法、半導体デバイス製造方法、基板位置合わせ装置及び基板表面検査装置

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