JP2010538479A5 - - Google Patents
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- JP2010538479A5 JP2010538479A5 JP2010523271A JP2010523271A JP2010538479A5 JP 2010538479 A5 JP2010538479 A5 JP 2010538479A5 JP 2010523271 A JP2010523271 A JP 2010523271A JP 2010523271 A JP2010523271 A JP 2010523271A JP 2010538479 A5 JP2010538479 A5 JP 2010538479A5
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007041896A DE102007041896A1 (de) | 2007-09-04 | 2007-09-04 | Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements |
| DE102007041896.7 | 2007-09-04 | ||
| PCT/DE2008/001449 WO2009030204A2 (de) | 2007-09-04 | 2008-08-29 | Halbleiterbauelement und verfahren zur herstellung eines halbleiterbauelements |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010538479A JP2010538479A (ja) | 2010-12-09 |
| JP2010538479A5 true JP2010538479A5 (enrdf_load_stackoverflow) | 2011-07-14 |
| JP5431329B2 JP5431329B2 (ja) | 2014-03-05 |
Family
ID=40139376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010523271A Expired - Fee Related JP5431329B2 (ja) | 2007-09-04 | 2008-08-29 | 半導体構成素子および半導体構成素子の製造方法 |
Country Status (7)
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009015307A1 (de) | 2009-03-27 | 2010-09-30 | Osram Opto Semiconductors Gmbh | Anordnung optoelektronischer Bauelemente |
| DE102009015224A1 (de) * | 2009-03-31 | 2010-12-02 | Siemens Aktiengesellschaft | LED-Lichtquelle mit einer Vielzahl von LED-Chips und LED-Chip zur Verwendung in selbiger |
| US8337030B2 (en) | 2009-05-13 | 2012-12-25 | Cree, Inc. | Solid state lighting devices having remote luminescent material-containing element, and lighting methods |
| DE102010006396A1 (de) * | 2010-02-01 | 2011-08-04 | Giesecke & Devrient GmbH, 81677 | Beleuchtungseinrichtung und Sensor zur Prüfung von Wertdokumenten |
| EP2407706A1 (en) * | 2010-07-14 | 2012-01-18 | Civilight Shenzhen Semiconductor Lighting Co., Ltd | Warm white light LED lamp with high luminance and high color rendering index and led module |
| TWI446578B (zh) * | 2010-09-23 | 2014-07-21 | Epistar Corp | 發光元件及其製法 |
| CN102446907A (zh) * | 2010-10-13 | 2012-05-09 | 环旭电子股份有限公司 | 立体封装结构及其制作方法 |
| US9648673B2 (en) * | 2010-11-05 | 2017-05-09 | Cree, Inc. | Lighting device with spatially segregated primary and secondary emitters |
| DE102011087887A1 (de) * | 2011-12-07 | 2013-06-13 | Osram Gmbh | Leuchtdiodenanordnung |
| DE102013201327A1 (de) * | 2013-01-28 | 2014-07-31 | Osram Gmbh | Leiterplatte, optoelektronisches Bauteil und Anordnung optoelektronischer Bauteile |
| JP6083253B2 (ja) * | 2013-02-21 | 2017-02-22 | 日亜化学工業株式会社 | 発光装置の積層体 |
| KR101998765B1 (ko) * | 2013-03-25 | 2019-07-10 | 엘지이노텍 주식회사 | 발광소자 패키지 |
| JP6318510B2 (ja) * | 2013-09-12 | 2018-05-09 | 日亜化学工業株式会社 | フレキシブル基板及び発光装置 |
| JP6793111B2 (ja) * | 2014-07-18 | 2020-12-02 | ルミレッズ ホールディング ベーフェー | 自動車アプリケーションのためのｌｅｄ光源 |
| KR102244435B1 (ko) | 2014-09-03 | 2021-04-26 | 삼성디스플레이 주식회사 | 회로판 및 이를 포함하는 전자 장치 |
| DE102015215301A1 (de) * | 2015-08-11 | 2017-02-16 | Osram Gmbh | Leuchtdiodenanordnung und Verfahren zum Herstellen einer Leuchtdiodenanordnung |
| CN105527770B (zh) * | 2016-02-03 | 2019-03-05 | 京东方科技集团股份有限公司 | 一种显示装置 |
| KR102006188B1 (ko) * | 2017-12-29 | 2019-08-01 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 차량용 램프 및 그 제어방법 |
| TWI692865B (zh) * | 2018-11-21 | 2020-05-01 | 友達光電股份有限公司 | 顯示裝置 |
| US11637219B2 (en) | 2019-04-12 | 2023-04-25 | Google Llc | Monolithic integration of different light emitting structures on a same substrate |
| CN110931614B (zh) * | 2019-05-08 | 2021-08-13 | 深圳第三代半导体研究院 | 一种正装集成单元二极管芯片 |
| DE102019216924A1 (de) | 2019-11-04 | 2021-05-06 | Robert Bosch Gmbh | Laseremitteranordnung sowie LiDAR-System |
| CN111081730B (zh) * | 2019-12-13 | 2022-12-27 | 深圳第三代半导体研究院 | Micro-LED芯片及其制造方法 |
| US12113091B2 (en) * | 2020-05-05 | 2024-10-08 | Raysolve Optoelectronics (Suzhou) Company Limited | Full color light emitting diode structure and method for manufacturing the same |
| DE102021120915A1 (de) | 2021-08-11 | 2023-02-16 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Anordnung für eine Heckleuchte für ein Kraftfahrzeug und Verfahren zum Betreiben einer Anordnung für eine Heckleuchte für ein Kraftfahrzeug |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4331938A (en) * | 1980-08-25 | 1982-05-25 | Rca Corporation | Injection laser diode array having high conductivity regions in the substrate |
| US4960660A (en) * | 1989-03-31 | 1990-10-02 | E. I. Du Pont De Nemours And Company | High resolution superimposed images from photopolymer electrographic master |
| JPH0668977B2 (ja) * | 1989-08-03 | 1994-08-31 | 矢崎総業株式会社 | 圧接端子および圧接端子のハウジングへの誤挿入検出装置 |
| JPH05128588A (ja) * | 1991-05-16 | 1993-05-25 | Canon Inc | 光記録媒体、光記録方法及び再生方法、情報書込み装置及び情報レコードの再生装置 |
| JP2877611B2 (ja) * | 1991-06-07 | 1999-03-31 | 株式会社東芝 | 光半導体装置 |
| US5386139A (en) * | 1992-04-16 | 1995-01-31 | Kabushiki Kaisha Toshiba | Semiconductor light emitting element with improved structure of groove therein |
| JPH0668977A (ja) | 1992-08-13 | 1994-03-11 | Konica Corp | 多色電界発光表示装置 |
| FR2714956B1 (fr) | 1994-01-12 | 1996-04-05 | 3Sa | Dispositif lumineux de signalisation, notamment destiné à assurer un balisage de sécurité. |
| US6273589B1 (en) * | 1999-01-29 | 2001-08-14 | Agilent Technologies, Inc. | Solid state illumination source utilizing dichroic reflectors |
| US7202506B1 (en) * | 1999-11-19 | 2007-04-10 | Cree, Inc. | Multi element, multi color solid state LED/laser |
| US6250775B1 (en) | 1999-12-09 | 2001-06-26 | Marpole International, Inc. | Light-emitting diode display systems and methods with enhanced light intensity |
| JP3486900B2 (ja) * | 2000-02-15 | 2004-01-13 | ソニー株式会社 | 発光装置およびそれを用いた光装置 |
| JP3659407B2 (ja) * | 2001-08-03 | 2005-06-15 | ソニー株式会社 | 発光装置 |
| JP4054631B2 (ja) * | 2001-09-13 | 2008-02-27 | シャープ株式会社 | 半導体発光素子およびその製造方法、ｌｅｄランプ並びにｌｅｄ表示装置 |
| US6936856B2 (en) * | 2002-01-15 | 2005-08-30 | Osram Opto Semiconductors Gmbh | Multi substrate organic light emitting devices |
| US6853014B2 (en) * | 2002-10-25 | 2005-02-08 | The University Of Connecticut | Optoelectronic circuit employing a heterojunction thyristor device that performs high speed sampling |
| TWI232066B (en) * | 2002-12-25 | 2005-05-01 | Au Optronics Corp | Manufacturing method of organic light emitting diode for reducing reflection of external light |
| EP1754259B1 (en) * | 2004-03-18 | 2019-07-17 | Phoseon Technology, Inc. | Direct and indirect cooling of leds |
| AU2005232074A1 (en) | 2004-03-29 | 2005-10-20 | LumaChip, Inc. | Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices |
| KR101097486B1 (ko) * | 2004-06-28 | 2011-12-22 | 엘지디스플레이 주식회사 | 액정표시장치의 백라이트 유닛 |
| US20060034886A1 (en) | 2004-07-23 | 2006-02-16 | Ward Bennett C | Bonded fiber structures for use in controlling fluid flow |
| KR100649019B1 (ko) * | 2004-08-11 | 2006-11-24 | 동부일렉트로닉스 주식회사 | 씨모스 이미지 센서 및 그의 제조 방법 |
| DE102004039897A1 (de) | 2004-08-17 | 2006-03-02 | Schott Ag | Element mit einer Vielzahl von Leuchtdioden |
| WO2006054236A2 (en) * | 2004-11-19 | 2006-05-26 | Koninklijke Philips Electronics N.V. | Composite led modules |
| TWI269420B (en) * | 2005-05-03 | 2006-12-21 | Megica Corp | Stacked chip package and process thereof |
| DE102005055293A1 (de) | 2005-08-05 | 2007-02-15 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung von Halbleiterchips und Dünnfilm-Halbleiterchip |
| JP2007115928A (ja) * | 2005-10-20 | 2007-05-10 | Citizen Electronics Co Ltd | 半導体発光装置 |
| DE102007004303A1 (de) | 2006-08-04 | 2008-02-07 | Osram Opto Semiconductors Gmbh | Dünnfilm-Halbleiterbauelement und Bauelement-Verbund |
| ES2536919T3 (es) * | 2007-01-18 | 2015-05-29 | Polytron Technologies, Inc. | Estructura plana de un aparato de iluminación con diodos emisores de luz |
| DE102007004304A1 (de) | 2007-01-29 | 2008-07-31 | Osram Opto Semiconductors Gmbh | Dünnfilm-Leuchtdioden-Chip und Verfahren zur Herstellung eines Dünnfilm-Leuchtdioden-Chips |
| DE102007017113A1 (de) | 2007-01-31 | 2008-08-07 | Osram Opto Semiconductors Gmbh | Halbleiterbauelement mit einer optisch aktiven Schicht, Anordnung mit einer Vielzahl von optisch aktiven Schichten und Verfahren zur Herstellung eines Halbleiterbauelements |
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2007
- 2007-09-04 DE DE102007041896A patent/DE102007041896A1/de not_active Withdrawn
-
2008
- 2008-08-29 WO PCT/DE2008/001449 patent/WO2009030204A2/de active Application Filing
- 2008-08-29 US US12/675,050 patent/US8384096B2/en active Active
- 2008-08-29 KR KR1020107007280A patent/KR20100080782A/ko not_active Withdrawn
- 2008-08-29 EP EP08801256.2A patent/EP2183779B1/de active Active
- 2008-08-29 JP JP2010523271A patent/JP5431329B2/ja not_active Expired - Fee Related
- 2008-08-29 CN CN2008801055803A patent/CN101796638B/zh active Active