JP2010537444A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2010537444A5 JP2010537444A5 JP2010522406A JP2010522406A JP2010537444A5 JP 2010537444 A5 JP2010537444 A5 JP 2010537444A5 JP 2010522406 A JP2010522406 A JP 2010522406A JP 2010522406 A JP2010522406 A JP 2010522406A JP 2010537444 A5 JP2010537444 A5 JP 2010537444A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- acid
- etching
- composition according
- etchant composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 claims 21
- 238000005530 etching Methods 0.000 claims 10
- 238000000034 method Methods 0.000 claims 7
- 239000003795 chemical substances by application Substances 0.000 claims 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 4
- 239000002253 acid Substances 0.000 claims 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims 3
- 230000002378 acidificating effect Effects 0.000 claims 3
- 235000001014 amino acid Nutrition 0.000 claims 3
- 150000001413 amino acids Chemical class 0.000 claims 3
- 239000012736 aqueous medium Substances 0.000 claims 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims 3
- 229910052731 fluorine Inorganic materials 0.000 claims 3
- 239000011737 fluorine Substances 0.000 claims 3
- 239000003002 pH adjusting agent Substances 0.000 claims 3
- 239000003381 stabilizer Substances 0.000 claims 3
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims 2
- 238000005229 chemical vapour deposition Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 238000005240 physical vapour deposition Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical group S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims 1
- BDDLHHRCDSJVKV-UHFFFAOYSA-N 7028-40-2 Chemical compound CC(O)=O.CC(O)=O.CC(O)=O.CC(O)=O BDDLHHRCDSJVKV-UHFFFAOYSA-N 0.000 claims 1
- 239000004254 Ammonium phosphate Substances 0.000 claims 1
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- -1 EDTA salt Chemical class 0.000 claims 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims 1
- 239000004471 Glycine Substances 0.000 claims 1
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 claims 1
- 229910001182 Mo alloy Inorganic materials 0.000 claims 1
- 229910017855 NH 4 F Inorganic materials 0.000 claims 1
- 235000004279 alanine Nutrition 0.000 claims 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims 1
- 229910000148 ammonium phosphate Inorganic materials 0.000 claims 1
- 235000019289 ammonium phosphates Nutrition 0.000 claims 1
- KVBCYCWRDBDGBG-UHFFFAOYSA-N azane;dihydrofluoride Chemical compound [NH4+].F.[F-] KVBCYCWRDBDGBG-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000008367 deionised water Substances 0.000 claims 1
- 229910021641 deionized water Inorganic materials 0.000 claims 1
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 claims 1
- 238000007772 electroless plating Methods 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 claims 1
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 claims 1
- 235000006408 oxalic acid Nutrition 0.000 claims 1
- 229920002120 photoresistant polymer Polymers 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical group O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96137710A TW200916605A (en) | 2007-10-08 | 2007-10-08 | Etchant compositions and etching method for metals Cu/Mo |
| CNA2007101673174A CN101418449A (zh) | 2007-10-22 | 2007-10-22 | 用于铜/钼金属的蚀刻液组成物及蚀刻方法 |
| PCT/EP2008/063221 WO2009047203A1 (en) | 2007-10-08 | 2008-10-02 | ETCHANT COMPOSITIONS AND ETCHING METHOD FOR METALS Cu/Mo |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010537444A JP2010537444A (ja) | 2010-12-02 |
| JP2010537444A5 true JP2010537444A5 (https=) | 2012-02-02 |
Family
ID=40219299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010522406A Pending JP2010537444A (ja) | 2007-10-08 | 2008-10-02 | エッチング剤組成物及び金属Ｃｕ／Ｍｏのためのエッチング方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20100301010A1 (https=) |
| JP (1) | JP2010537444A (https=) |
| KR (1) | KR20100064361A (https=) |
| WO (1) | WO2009047203A1 (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102690605B (zh) | 2009-02-16 | 2015-01-21 | 日立化成株式会社 | 铜研磨用研磨剂和使用了其的研磨方法 |
| WO2010092865A1 (ja) | 2009-02-16 | 2010-08-19 | 日立化成工業株式会社 | 研磨剤及び研磨方法 |
| JP5051323B2 (ja) * | 2010-02-15 | 2012-10-17 | 三菱瓦斯化学株式会社 | 銅層及びモリブデン層を含む多層薄膜用エッチング液 |
| KR20120066950A (ko) | 2010-12-15 | 2012-06-25 | 삼성전자주식회사 | 식각액, 이를 이용한 표시 장치 및 그 제조 방법 |
| JP2013060634A (ja) * | 2011-09-14 | 2013-04-04 | Tosoh Corp | エッチング液 |
| KR20140013310A (ko) | 2012-07-23 | 2014-02-05 | 삼성디스플레이 주식회사 | 식각액 조성물, 및 이를 이용한 금속 배선과 박막 트랜지스터 표시판 제조 방법 |
| KR20150124540A (ko) | 2014-04-28 | 2015-11-06 | 삼성디스플레이 주식회사 | 식각액 및 이를 이용한 표시 장치의 제조 방법 |
| KR102218353B1 (ko) * | 2014-06-26 | 2021-02-22 | 동우 화인켐 주식회사 | 금속막의 식각액 조성물 및 이를 이용한 액정표시장치용 어레이 기판의 제조방법 |
| KR102209680B1 (ko) * | 2014-06-27 | 2021-01-29 | 동우 화인켐 주식회사 | 금속막의 식각액 조성물 및 이를 이용한 액정 표시 장치용 어레이 기판의 제조방법 |
| TWI618817B (zh) * | 2015-12-29 | 2018-03-21 | Daxin Materials Corporation | 蝕刻液組成物及應用其之蝕刻方法 |
| EP3684148B1 (en) * | 2017-09-12 | 2023-11-29 | Kabushiki Kaisha Toshiba | Method for manufacturing ceramic circuit board |
| US11492709B2 (en) * | 2020-04-14 | 2022-11-08 | Entegris, Inc. | Method and composition for etching molybdenum |
| KR102889639B1 (ko) * | 2020-07-01 | 2025-11-21 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100505328B1 (ko) * | 2002-12-12 | 2005-07-29 | 엘지.필립스 엘시디 주식회사 | 구리 몰리브덴막에서 몰리브덴 잔사를 제거할 수 있는식각용액 및 그 식각 방법 |
| KR101190907B1 (ko) * | 2004-12-07 | 2012-10-12 | 가오 가부시키가이샤 | 박리제 조성물 |
| CN101233601A (zh) * | 2005-06-13 | 2008-07-30 | 高级技术材料公司 | 在金属硅化物形成后用于选择性除去金属或金属合金的组合物及方法 |
| KR101199533B1 (ko) * | 2005-06-22 | 2012-11-09 | 삼성디스플레이 주식회사 | 식각액, 이를 이용하는 배선 형성 방법 및 박막 트랜지스터기판의 제조 방법 |
| TWI378989B (en) * | 2006-09-01 | 2012-12-11 | Taiwan Tft Lcd Ass | Etchant for patterning composite layer and method of fabricating thin film transistor using the same |
| KR101326128B1 (ko) * | 2006-09-29 | 2013-11-06 | 삼성디스플레이 주식회사 | 표시 장치용 배선, 식각액, 박막 트랜지스터 표시판 및 그제조 방법 |
| WO2008121952A1 (en) * | 2007-03-31 | 2008-10-09 | Advanced Technology Materials, Inc. | Methods for stripping material for wafer reclamation |
-
2008
- 2008-10-02 US US12/675,131 patent/US20100301010A1/en not_active Abandoned
- 2008-10-02 KR KR1020107004302A patent/KR20100064361A/ko not_active Withdrawn
- 2008-10-02 WO PCT/EP2008/063221 patent/WO2009047203A1/en not_active Ceased
- 2008-10-02 JP JP2010522406A patent/JP2010537444A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2010537444A5 (https=) | ||
| JP2010537444A (ja) | エッチング剤組成物及び金属Ｃｕ／Ｍｏのためのエッチング方法 | |
| KR102080646B1 (ko) | 구리 및 티탄을 포함하는 다층막의 에칭에 사용되는 액체조성물, 및 이 조성물을 이용한 에칭방법, 다층막 배선의 제조방법, 기판 | |
| WO2011093445A1 (ja) | 銅／チタン系多層薄膜用エッチング液 | |
| CN103814432B (zh) | 增大蚀刻液蚀刻用量的铜/钼合金膜的蚀刻方法 | |
| CN103282549A (zh) | 用于刻蚀金属层的组合物 | |
| KR101475954B1 (ko) | 액정표시장치용 어레이 기판의 제조 방법 | |
| TW201842233A (zh) | 鈦層或含鈦層的蝕刻液組成物以及蝕刻方法 | |
| CN105970223A (zh) | 蚀刻剂组合物和制作用于液晶显示器的阵列基板的方法 | |
| WO2011052989A2 (ko) | 식각액 조성물 | |
| CN104911593A (zh) | 包含亚磷酸的金属膜用蚀刻液组合物 | |
| CN103911615B (zh) | 用于含铜金属的蚀刻剂组合物 | |
| JP2015504247A (ja) | エッチング液組成物およびこれを用いたウェットエッチング方法 | |
| CN106010541A (zh) | 蚀刻剂组合物和制造用于液晶显示器的阵列基板的方法 | |
| CN107604360A (zh) | 一种选择性铜腐蚀液及应用 | |
| CN101418449A (zh) | 用于铜/钼金属的蚀刻液组成物及蚀刻方法 | |
| TWI614550B (zh) | 液晶顯示裝置用陣列基板的製備方法及其多層膜用蝕刻液組合物 | |
| CN109594079B (zh) | 一种钼铝共用蚀刻液及蚀刻方法 | |
| CN106835138B (zh) | 蚀刻液组合物、显示装置用阵列基板及其制造方法 | |
| KR20060045996A (ko) | 티탄 또는 티탄 합금용 에칭액 | |
| TWI632254B (zh) | 用於金屬層的蝕刻劑組合物，用於使用該組合物蝕刻銅基金屬層的方法，用於製作用於液晶顯示裝置的陣列基板的方法及使用該方法製作的用於液晶顯示裝置的陣列基板 | |
| JP7650265B2 (ja) | チタンおよび／またはチタン合金のエッチング液、該エッチング液を用いたチタンおよび／またはチタン合金のエッチング方法、および該エッチング液を用いた基板の製造方法 | |
| TW201809355A (zh) | 用於銅基金屬層的蝕刻劑組合物及用其製造顯示設備的陣列基板的方法 | |
| CN111755461B (zh) | 液晶显示装置用阵列基板的制造方法及用于其的铜系金属膜蚀刻液组合物 | |
| JP4655542B2 (ja) | エッチング用組成物を用いたエッチング方法 |