JP2010520934A - 黒色導電性ペースト組成物、これを含む妨害電磁波遮蔽フィルター、及び表示装置 - Google Patents
黒色導電性ペースト組成物、これを含む妨害電磁波遮蔽フィルター、及び表示装置 Download PDFInfo
- Publication number
- JP2010520934A JP2010520934A JP2009552590A JP2009552590A JP2010520934A JP 2010520934 A JP2010520934 A JP 2010520934A JP 2009552590 A JP2009552590 A JP 2009552590A JP 2009552590 A JP2009552590 A JP 2009552590A JP 2010520934 A JP2010520934 A JP 2010520934A
- Authority
- JP
- Japan
- Prior art keywords
- shielding
- paste composition
- black
- conductive paste
- filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 132
- 230000002452 interceptive effect Effects 0.000 title description 4
- 239000011521 glass Substances 0.000 claims abstract description 103
- 239000002904 solvent Substances 0.000 claims abstract description 41
- 239000000843 powder Substances 0.000 claims abstract description 40
- 239000000049 pigment Substances 0.000 claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 238000007645 offset printing Methods 0.000 claims abstract description 31
- 229920001400 block copolymer Polymers 0.000 claims abstract description 21
- 239000002270 dispersing agent Substances 0.000 claims abstract description 21
- 239000002952 polymeric resin Substances 0.000 claims abstract description 18
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 16
- 229920000642 polymer Polymers 0.000 claims abstract description 15
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 14
- 150000003863 ammonium salts Chemical class 0.000 claims abstract description 7
- 229920002635 polyurethane Polymers 0.000 claims abstract description 7
- 239000004814 polyurethane Substances 0.000 claims abstract description 7
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 6
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims abstract description 6
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 6
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 102
- 238000007639 printing Methods 0.000 claims description 27
- 238000009835 boiling Methods 0.000 claims description 25
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 claims description 3
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- -1 carbitol Chemical compound 0.000 claims description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical group COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 2
- DOVZUKKPYKRVIK-UHFFFAOYSA-N 1-methoxypropan-2-yl propanoate Chemical compound CCC(=O)OC(C)COC DOVZUKKPYKRVIK-UHFFFAOYSA-N 0.000 claims description 2
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 claims description 2
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 claims description 2
- RHFOYRRUVLOOJP-UHFFFAOYSA-N ethoxyethane;propanoic acid Chemical compound CCOCC.CCC(O)=O RHFOYRRUVLOOJP-UHFFFAOYSA-N 0.000 claims description 2
- ICFLIAFVFNQANV-UHFFFAOYSA-N methoxy(methoxymethoxy)methane;propanoic acid Chemical compound CCC(O)=O.COCOCOC ICFLIAFVFNQANV-UHFFFAOYSA-N 0.000 claims description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 2
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 claims description 2
- 239000005749 Copper compound Substances 0.000 claims 2
- 150000001845 chromium compounds Chemical class 0.000 claims 2
- 150000001880 copper compounds Chemical class 0.000 claims 2
- 150000002506 iron compounds Chemical class 0.000 claims 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims 2
- 150000002697 manganese compounds Chemical class 0.000 claims 2
- 150000002816 nickel compounds Chemical class 0.000 claims 2
- 150000003304 ruthenium compounds Chemical class 0.000 claims 2
- 150000001869 cobalt compounds Chemical class 0.000 claims 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims 1
- 239000004310 lactic acid Substances 0.000 claims 1
- 235000014655 lactic acid Nutrition 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 39
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 239000010410 layer Substances 0.000 description 36
- 230000008569 process Effects 0.000 description 15
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 12
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 12
- 230000003287 optical effect Effects 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 238000005192 partition Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 5
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 5
- 239000005416 organic matter Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 238000001879 gelation Methods 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000010835 comparative analysis Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- OELQSSWXRGADDE-UHFFFAOYSA-N 2-methylprop-2-eneperoxoic acid Chemical compound CC(=C)C(=O)OO OELQSSWXRGADDE-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- VKEQBMCRQDSRET-UHFFFAOYSA-N Methylone Chemical compound CNC(C)C(=O)C1=CC=C2OCOC2=C1 VKEQBMCRQDSRET-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 125000005211 alkyl trimethyl ammonium group Chemical group 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- MDYPDLBFDATSCF-UHFFFAOYSA-N nonyl prop-2-enoate Chemical compound CCCCCCCCCOC(=O)C=C MDYPDLBFDATSCF-UHFFFAOYSA-N 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/20—Diluents or solvents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/34—Vessels, containers or parts thereof, e.g. substrates
- H01J11/44—Optical arrangements or shielding arrangements, e.g. filters, black matrices, light reflecting means or electromagnetic shielding means
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Polymers & Plastics (AREA)
- Dispersion Chemistry (AREA)
- Geochemistry & Mineralogy (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Electromagnetism (AREA)
- Plasma & Fusion (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Paints Or Removers (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20070023508 | 2007-03-09 | ||
| PCT/KR2008/001255 WO2008111757A1 (en) | 2007-03-09 | 2008-03-05 | Black paste composition having conductivity property, filter for shielding electromagnetic interference and display device comprising the same} |
| KR1020080020295A KR100905970B1 (ko) | 2007-03-09 | 2008-03-05 | 흑색 도전성 페이스트 조성물, 이를 포함하는 전자파차폐용 필터 및 표시 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010520934A true JP2010520934A (ja) | 2010-06-17 |
| JP2010520934A5 JP2010520934A5 (enExample) | 2011-04-14 |
Family
ID=40022028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009552590A Pending JP2010520934A (ja) | 2007-03-09 | 2008-03-05 | 黒色導電性ペースト組成物、これを含む妨害電磁波遮蔽フィルター、及び表示装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2010520934A (enExample) |
| KR (2) | KR100905970B1 (enExample) |
| CN (1) | CN101617001B (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013111456A1 (ja) * | 2012-01-26 | 2013-08-01 | 株式会社 日立産機システム | インク、被印字基材、印字装置、印字方法、被印字基材の製造方法 |
| JP2013241507A (ja) * | 2012-05-18 | 2013-12-05 | Mitsubishi Paper Mills Ltd | 導電性インク組成物および導電性部材 |
| JP2014125635A (ja) * | 2012-12-26 | 2014-07-07 | Industrial Technology Research Institute | グラビアオフセット印刷用組成物およびグラビアオフセット印刷方法 |
| JP2017115084A (ja) * | 2015-12-25 | 2017-06-29 | 株式会社パイロットコーポレーション | 筆記具用水性インキ組成物 |
| JP2017226775A (ja) * | 2016-06-23 | 2017-12-28 | 株式会社パイロットコーポレーション | 筆記具用水性インキ組成物 |
| JP2019156935A (ja) * | 2018-03-09 | 2019-09-19 | 御国色素株式会社 | インク及び被印字体の製造方法 |
| JP2020041116A (ja) * | 2018-09-12 | 2020-03-19 | 御国色素株式会社 | 印刷用インク及びその製造方法並びにプリンタ |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8198810B2 (en) | 2008-12-31 | 2012-06-12 | Samsung Sdi Co., Ltd. | Method of manufacturing electromagnetic interference (EMI) shielding filter for plasma display panel and EMI shielding filter for plasma display panel using the same |
| KR20130044847A (ko) | 2011-10-25 | 2013-05-03 | 엘지이노텍 주식회사 | 인쇄용 페이스트 조성물 및 터치패널 |
| CN102558965B (zh) * | 2011-12-27 | 2014-03-26 | 彩虹集团公司 | 一种汽车侧挡风玻璃用油墨及其制备方法 |
| CN109423182B (zh) * | 2017-06-27 | 2022-05-06 | 洛阳尖端技术研究院 | 一种涂料及其制备方法 |
| CN107841177A (zh) * | 2017-10-30 | 2018-03-27 | 汪涛 | 一种导电涂料组合物 |
| CN107793864A (zh) * | 2017-10-30 | 2018-03-13 | 汪涛 | 一种导电涂料组合物的制备方法 |
Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0448507A (ja) * | 1990-06-15 | 1992-02-18 | Nissha Printing Co Ltd | 電磁波シールド板およびその製造方法 |
| JPH04213373A (ja) * | 1990-04-12 | 1992-08-04 | Matsushita Electric Ind Co Ltd | 導電性インキならびに導電性厚膜パターンの形成方法 |
| JPH11158426A (ja) * | 1997-11-28 | 1999-06-15 | Nissha Printing Co Ltd | 透明導電膜形成用インキ |
| JP2000040462A (ja) * | 1998-07-23 | 2000-02-08 | Toray Ind Inc | ディスプレイ用基板の製造方法 |
| JP2002057490A (ja) * | 2000-08-09 | 2002-02-22 | Sumitomo Rubber Ind Ltd | 透光性電磁波シールド部材とその製造方法 |
| JP2002097215A (ja) * | 2000-09-26 | 2002-04-02 | Soken Chem & Eng Co Ltd | ペースト状導電性樹脂組成物及びその焼結体の形成方法 |
| JP2002271086A (ja) * | 2001-03-08 | 2002-09-20 | Sumitomo Chem Co Ltd | 電磁波シールド板及びその製造方法 |
| JP2003059336A (ja) * | 2001-08-09 | 2003-02-28 | Sumitomo Rubber Ind Ltd | 導電性ペーストとそれを用いた導電性パターンの形成方法 |
| JP2003064293A (ja) * | 2001-08-29 | 2003-03-05 | Dainippon Ink & Chem Inc | カラーフィルター用顔料分散組成物、顔料分散レジスト、およびカラーフィルター |
| JP2005158295A (ja) * | 2003-11-20 | 2005-06-16 | Sumitomo Rubber Ind Ltd | プラズマディスプレイパネルの電極形成用インキおよびそれを用いたプラズマディスプレイパネルの電極基板の製造方法 |
| JP2006215160A (ja) * | 2005-02-02 | 2006-08-17 | Toyo Ink Mfg Co Ltd | 着色組成物、それを用いたカラーフィルタおよびその製造方法 |
| JP2006257517A (ja) * | 2005-03-18 | 2006-09-28 | Toyo Ink Mfg Co Ltd | 金属微粒子分散体の製造方法、該方法で製造された金属微粒子分散体を用いた導電性インキ、および非接触型メディア |
| JP2006257484A (ja) * | 2005-03-16 | 2006-09-28 | Nippon Paint Co Ltd | 金属ナノ粒子の非水系有機溶媒溶液及びその製造方法 |
| JP2006349981A (ja) * | 2005-06-16 | 2006-12-28 | Jsr Corp | 着色層形成用感放射線性組成物およびカラーフィルタ |
| WO2007010919A1 (ja) * | 2005-07-20 | 2007-01-25 | Adeka Corporation | 含フッ素共重合体、アルカリ現像性樹脂組成物及びアルカリ現像性感光性樹脂組成物 |
| JP2010509768A (ja) * | 2006-11-13 | 2010-03-25 | ドウジン セミケム カンパニー リミテッド | ディスプレイパネル用光学フィルター及びその製造方法 |
| JP2010519730A (ja) * | 2007-02-16 | 2010-06-03 | ドウジン セミケム カンパニー リミテッド | 電磁波遮蔽用フィルターの製造方法及び電磁波遮蔽用フィルターを備えた表示装置の製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990056608A (ko) * | 1997-12-29 | 1999-07-15 | 조희재 | 후막 도체 페이스트 조성물 |
| WO2003040246A1 (en) * | 2001-11-08 | 2003-05-15 | Toray Industries, Inc. | Black paste and plasma display panel and method for preparation thereof |
-
2008
- 2008-03-05 JP JP2009552590A patent/JP2010520934A/ja active Pending
- 2008-03-05 CN CN2008800056118A patent/CN101617001B/zh not_active Expired - Fee Related
- 2008-03-05 KR KR1020080020295A patent/KR100905970B1/ko not_active Expired - Fee Related
-
2009
- 2009-03-12 KR KR1020090021039A patent/KR20090030294A/ko not_active Withdrawn
Patent Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04213373A (ja) * | 1990-04-12 | 1992-08-04 | Matsushita Electric Ind Co Ltd | 導電性インキならびに導電性厚膜パターンの形成方法 |
| JPH0448507A (ja) * | 1990-06-15 | 1992-02-18 | Nissha Printing Co Ltd | 電磁波シールド板およびその製造方法 |
| JPH11158426A (ja) * | 1997-11-28 | 1999-06-15 | Nissha Printing Co Ltd | 透明導電膜形成用インキ |
| JP2000040462A (ja) * | 1998-07-23 | 2000-02-08 | Toray Ind Inc | ディスプレイ用基板の製造方法 |
| JP2002057490A (ja) * | 2000-08-09 | 2002-02-22 | Sumitomo Rubber Ind Ltd | 透光性電磁波シールド部材とその製造方法 |
| JP2002097215A (ja) * | 2000-09-26 | 2002-04-02 | Soken Chem & Eng Co Ltd | ペースト状導電性樹脂組成物及びその焼結体の形成方法 |
| JP2002271086A (ja) * | 2001-03-08 | 2002-09-20 | Sumitomo Chem Co Ltd | 電磁波シールド板及びその製造方法 |
| JP2003059336A (ja) * | 2001-08-09 | 2003-02-28 | Sumitomo Rubber Ind Ltd | 導電性ペーストとそれを用いた導電性パターンの形成方法 |
| JP2003064293A (ja) * | 2001-08-29 | 2003-03-05 | Dainippon Ink & Chem Inc | カラーフィルター用顔料分散組成物、顔料分散レジスト、およびカラーフィルター |
| JP2005158295A (ja) * | 2003-11-20 | 2005-06-16 | Sumitomo Rubber Ind Ltd | プラズマディスプレイパネルの電極形成用インキおよびそれを用いたプラズマディスプレイパネルの電極基板の製造方法 |
| JP2006215160A (ja) * | 2005-02-02 | 2006-08-17 | Toyo Ink Mfg Co Ltd | 着色組成物、それを用いたカラーフィルタおよびその製造方法 |
| JP2006257484A (ja) * | 2005-03-16 | 2006-09-28 | Nippon Paint Co Ltd | 金属ナノ粒子の非水系有機溶媒溶液及びその製造方法 |
| JP2006257517A (ja) * | 2005-03-18 | 2006-09-28 | Toyo Ink Mfg Co Ltd | 金属微粒子分散体の製造方法、該方法で製造された金属微粒子分散体を用いた導電性インキ、および非接触型メディア |
| JP2006349981A (ja) * | 2005-06-16 | 2006-12-28 | Jsr Corp | 着色層形成用感放射線性組成物およびカラーフィルタ |
| WO2007010919A1 (ja) * | 2005-07-20 | 2007-01-25 | Adeka Corporation | 含フッ素共重合体、アルカリ現像性樹脂組成物及びアルカリ現像性感光性樹脂組成物 |
| JP2010509768A (ja) * | 2006-11-13 | 2010-03-25 | ドウジン セミケム カンパニー リミテッド | ディスプレイパネル用光学フィルター及びその製造方法 |
| JP2010519730A (ja) * | 2007-02-16 | 2010-06-03 | ドウジン セミケム カンパニー リミテッド | 電磁波遮蔽用フィルターの製造方法及び電磁波遮蔽用フィルターを備えた表示装置の製造方法 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013111456A1 (ja) * | 2012-01-26 | 2013-08-01 | 株式会社 日立産機システム | インク、被印字基材、印字装置、印字方法、被印字基材の製造方法 |
| US9334415B2 (en) | 2012-01-26 | 2016-05-10 | Hitachi Industrial Equipment Systems Co., Ltd. | Ink, base to be printed, printing device, printing method, and method for producing base to be printed |
| JP2013241507A (ja) * | 2012-05-18 | 2013-12-05 | Mitsubishi Paper Mills Ltd | 導電性インク組成物および導電性部材 |
| JP2014125635A (ja) * | 2012-12-26 | 2014-07-07 | Industrial Technology Research Institute | グラビアオフセット印刷用組成物およびグラビアオフセット印刷方法 |
| JP2017115084A (ja) * | 2015-12-25 | 2017-06-29 | 株式会社パイロットコーポレーション | 筆記具用水性インキ組成物 |
| JP2017226775A (ja) * | 2016-06-23 | 2017-12-28 | 株式会社パイロットコーポレーション | 筆記具用水性インキ組成物 |
| JP2019156935A (ja) * | 2018-03-09 | 2019-09-19 | 御国色素株式会社 | インク及び被印字体の製造方法 |
| JP2020041116A (ja) * | 2018-09-12 | 2020-03-19 | 御国色素株式会社 | 印刷用インク及びその製造方法並びにプリンタ |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101617001B (zh) | 2012-07-25 |
| KR20090030294A (ko) | 2009-03-24 |
| KR100905970B1 (ko) | 2009-07-06 |
| CN101617001A (zh) | 2009-12-30 |
| KR20080082912A (ko) | 2008-09-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2010520934A (ja) | 黒色導電性ペースト組成物、これを含む妨害電磁波遮蔽フィルター、及び表示装置 | |
| JP4887442B2 (ja) | 電磁波シールド材、及びその製造方法 | |
| JP2009259826A (ja) | 黒色導電性ペースト組成物、これを含む電磁波遮蔽用フィルター、および表示装置 | |
| KR20150004355A (ko) | 투명 도전성 잉크 및 투명 도전 패턴형성방법 | |
| JP2010153366A (ja) | 磁性黒色顔料を含む電極形成用ペースト組成物、これを用いた電極形成方法、及びこれにより製造された電極を含むプラズマディスプレイパネル | |
| JP2009295583A (ja) | 黒色導電性ペースト組成物、これを含む電磁波遮蔽用フィルターおよび表示装置 | |
| TW200952619A (en) | Filter for shielding electromagnetic interference and preparing method thereof, and display device comprising the same | |
| JP2009295980A (ja) | 電磁波遮蔽用フィルターとその製造方法、および表示装置 | |
| WO2008111757A1 (en) | Black paste composition having conductivity property, filter for shielding electromagnetic interference and display device comprising the same} | |
| KR100869935B1 (ko) | 전자파 차폐용 필터 및 이를 구비한 표시 장치 | |
| KR100923741B1 (ko) | 실리콘계 계면활성제를 포함하는 전극 형성용 페이스트조성물 | |
| JP4459016B2 (ja) | 電磁波シールド材及びその製造方法 | |
| JP2011222853A (ja) | 電磁波遮蔽フィルタの製造方法、及び電磁波遮蔽フィルタ | |
| JP5460348B2 (ja) | 導電性ペースト、および透光性導電フィルムとその製造方法 | |
| KR20100117978A (ko) | 전자파 차폐용 필터, 그 제조 방법, 및 전자파 차페용 필터를 구비한 표시 장치 | |
| CN101606214B (zh) | 制备用于屏蔽电磁干扰的过滤器的方法和制备配置该用于屏蔽电磁干扰的过滤器的显示器的方法 | |
| JP2011054671A (ja) | 複合フィルタ | |
| JP2009076827A (ja) | 近赤外線・電磁波遮蔽用積層体及びその製造方法 | |
| JP2011071375A (ja) | 電磁波シールド材 | |
| JP4971104B2 (ja) | 導電性ペーストとそれを用いた透光性電磁波シールド板の製造方法 | |
| WO2008100105A1 (en) | Method for manufacturing a filter for shielding electromagnetic interference and method for manufacturing a display device provided with the filter for shielding electromagnetic interference | |
| KR20080111845A (ko) | 전자파 차폐 필터용 미세패턴 형성방법 | |
| WO2008100104A1 (en) | Filter for shielding electromagnetic interference and display device provided with the same | |
| KR20100045299A (ko) | 전자파 차폐필터, 이를 포함하는 플라즈마 디스플레이 패널필터 및 플라즈마 디스플레이 패널 | |
| KR20090116463A (ko) | 도전성 메쉬층을 이용한 디스플레이 광학 필터 및 이의제조 방법 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110225 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110225 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20121213 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130108 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20130408 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20130415 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20130507 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20130514 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130606 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20130607 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140204 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140507 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140514 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140529 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20140620 |