JP2010520626A5 - - Google Patents
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- JP2010520626A5 JP2010520626A5 JP2009552014A JP2009552014A JP2010520626A5 JP 2010520626 A5 JP2010520626 A5 JP 2010520626A5 JP 2009552014 A JP2009552014 A JP 2009552014A JP 2009552014 A JP2009552014 A JP 2009552014A JP 2010520626 A5 JP2010520626 A5 JP 2010520626A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- substrate
- less
- shielding structure
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 229910052751 metal Inorganic materials 0.000 description 37
- 239000002184 metal Substances 0.000 description 37
- 239000000758 substrate Substances 0.000 description 28
- 239000000853 adhesive Substances 0.000 description 22
- 230000001070 adhesive effect Effects 0.000 description 22
- 238000000034 method Methods 0.000 description 18
- 239000000203 mixture Substances 0.000 description 16
- 239000002082 metal nanoparticle Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 238000000151 deposition Methods 0.000 description 8
- 239000002105 nanoparticle Substances 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 238000005245 sintering Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000003125 aqueous solvent Substances 0.000 description 4
- 239000003446 ligand Substances 0.000 description 4
- 230000002776 aggregation Effects 0.000 description 3
- 125000005842 heteroatom Chemical group 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- KZNMRPQBBZBTSW-UHFFFAOYSA-N [Au]=O Chemical compound [Au]=O KZNMRPQBBZBTSW-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 description 1
- CFEAAQFZALKQPA-UHFFFAOYSA-N cadmium(2+);oxygen(2-) Chemical compound [O-2].[Cd+2] CFEAAQFZALKQPA-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910000428 cobalt oxide Inorganic materials 0.000 description 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 229910001922 gold oxide Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910000457 iridium oxide Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 229910000487 osmium oxide Inorganic materials 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- JIWAALDUIFCBLV-UHFFFAOYSA-N oxoosmium Chemical compound [Os]=O JIWAALDUIFCBLV-UHFFFAOYSA-N 0.000 description 1
- MUMZUERVLWJKNR-UHFFFAOYSA-N oxoplatinum Chemical compound [Pt]=O MUMZUERVLWJKNR-UHFFFAOYSA-N 0.000 description 1
- SJLOMQIUPFZJAN-UHFFFAOYSA-N oxorhodium Chemical compound [Rh]=O SJLOMQIUPFZJAN-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910003445 palladium oxide Inorganic materials 0.000 description 1
- JQPTYAILLJKUCY-UHFFFAOYSA-N palladium(ii) oxide Chemical compound [O-2].[Pd+2] JQPTYAILLJKUCY-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910003446 platinum oxide Inorganic materials 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910003450 rhodium oxide Inorganic materials 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US89240707P | 2007-03-01 | 2007-03-01 | |
| PCT/US2008/055446 WO2008115681A2 (en) | 2007-03-01 | 2008-02-29 | Shielding based on metallic nanoparticle compositions and devices and methods thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010520626A JP2010520626A (ja) | 2010-06-10 |
| JP2010520626A5 true JP2010520626A5 (cg-RX-API-DMAC7.html) | 2013-05-23 |
Family
ID=39733293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009552014A Pending JP2010520626A (ja) | 2007-03-01 | 2008-02-29 | 金属性ナノ粒子組成物による遮蔽およびそれに関連する装置および方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7763362B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2131979A4 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2010520626A (cg-RX-API-DMAC7.html) |
| KR (1) | KR20090117827A (cg-RX-API-DMAC7.html) |
| CN (1) | CN101641210A (cg-RX-API-DMAC7.html) |
| AU (1) | AU2008229178B2 (cg-RX-API-DMAC7.html) |
| CA (1) | CA2680201A1 (cg-RX-API-DMAC7.html) |
| WO (1) | WO2008115681A2 (cg-RX-API-DMAC7.html) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7927948B2 (en) | 2005-07-20 | 2011-04-19 | Micron Technology, Inc. | Devices with nanocrystals and methods of formation |
| US7989290B2 (en) | 2005-08-04 | 2011-08-02 | Micron Technology, Inc. | Methods for forming rhodium-based charge traps and apparatus including rhodium-based charge traps |
| US20070144305A1 (en) * | 2005-12-20 | 2007-06-28 | Jablonski Gregory A | Synthesis of Metallic Nanoparticle Dispersions |
| US20100015462A1 (en) * | 2008-02-29 | 2010-01-21 | Gregory Jablonski | Metallic nanoparticle shielding structure and methods thereof |
| WO2010064285A1 (ja) * | 2008-12-01 | 2010-06-10 | トヨタ自動車株式会社 | 装飾皮膜とその形成方法 |
| JP2013513220A (ja) * | 2009-12-07 | 2013-04-18 | デューク ユニバーシティ | 銅ナノワイヤを成長させるための組成および方法 |
| JP6302249B2 (ja) * | 2010-11-09 | 2018-03-28 | コーネル・ユニバーシティーＣｏｒｎｅｌｌ Ｕｎｉｖｅｒｓｉｔｙ | 硫黄含有ナノポーラス材料、ナノ粒子、方法およびアプリケーション |
| TWI540111B (zh) | 2011-03-28 | 2016-07-01 | 康寧公司 | Ｃｕ、ＣｕＯ與ＣｕＯ奈米顆粒在玻璃表面與耐久塗層上的抗微生物作用 |
| CN102984929B (zh) * | 2011-09-07 | 2015-07-08 | 港易有限公司 | 用于电子装置的防辐射叠层板及将该叠层板嵌入外壳的方法 |
| TWI488280B (zh) * | 2012-11-21 | 2015-06-11 | Ind Tech Res Inst | 電磁波屏蔽結構及其製造方法 |
| US10364181B2 (en) | 2014-04-23 | 2019-07-30 | Corning Incorporated | Antimicrobial articles with silver-containing alkali silicate coating and methods of making thereof |
| US9803065B2 (en) * | 2015-03-12 | 2017-10-31 | King Abdulaziz University | Microwave shielding effectiveness based on polyvinyl alcohol/silver hybrid nanocomposites |
| US10354773B2 (en) | 2016-04-08 | 2019-07-16 | Duke University | Noble metal-coated nanostructures and related methods |
| CN107507823B (zh) | 2016-06-14 | 2022-12-20 | 三星电子株式会社 | 半导体封装和用于制造半导体封装的方法 |
| EP3658289A4 (en) | 2017-07-25 | 2021-04-07 | Magnomer LLC | PROCESSES AND COMPOSITIONS FOR MAGNETISABLE PLASTICS |
| CN107864604A (zh) * | 2017-11-10 | 2018-03-30 | 中国科学院西安光学精密机械研究所 | 一种电磁辐射屏蔽结构 |
| JP7494192B2 (ja) | 2019-01-30 | 2024-06-03 | マグノマー， インコーポレイテッド | 磁化可能なプラスチックのための方法および組成物 |
| CN114650721B (zh) * | 2021-02-09 | 2025-06-03 | 广州方邦电子股份有限公司 | 电磁屏蔽膜及线路板 |
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| US4599277A (en) | 1984-10-09 | 1986-07-08 | International Business Machines Corp. | Control of the sintering of powdered metals |
| US5338507A (en) | 1987-03-30 | 1994-08-16 | Hewlett-Packard Company | Silver additives for ceramic superconductors |
| US5071826A (en) | 1987-03-30 | 1991-12-10 | Hewlett-Packard Company | Organometallic silver additives for ceramic superconductors |
| US5332646A (en) | 1992-10-21 | 1994-07-26 | Minnesota Mining And Manufacturing Company | Method of making a colloidal palladium and/or platinum metal dispersion |
| US5455749A (en) | 1993-05-28 | 1995-10-03 | Ferber; Andrew R. | Light, audio and current related assemblies, attachments and devices with conductive compositions |
| US20060034731A1 (en) * | 1995-03-27 | 2006-02-16 | California Institute Of Technology | Sensor arrays for detecting analytes in fluids |
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| EP2096427A3 (en) * | 1998-11-16 | 2009-11-18 | California Institute of Technology | Simultaneous determination of equilibrium and kinetic properties |
| AU2000225122A1 (en) | 2000-01-21 | 2001-07-31 | Midwest Research Institute | Method for forming thin-film conductors through the decomposition of metal-chelates in association with metal particles |
| US6773926B1 (en) | 2000-09-25 | 2004-08-10 | California Institute Of Technology | Nanoparticle-based sensors for detecting analytes in fluids |
| ATE525730T1 (de) * | 2000-10-25 | 2011-10-15 | Harima Chemicals Inc | Elektroleitfähige metallpaste und verfahren zu ihrer herstellung |
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| WO2003038002A1 (en) | 2001-11-01 | 2003-05-08 | Yissum Research Development Company Of The Hebrew University Of Jerusalem | Ink-jet inks containing metal nanoparticles |
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| JP2003309352A (ja) | 2002-04-16 | 2003-10-31 | Fujikura Ltd | 導電性接着剤およびこれを用いた電子部品実装構造 |
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| JP3961334B2 (ja) | 2002-04-17 | 2007-08-22 | 株式会社フジクラ | Ｉｃカードおよびその製造方法 |
| JP4636496B2 (ja) * | 2002-06-13 | 2011-02-23 | シーマ ナノテック イスラエル リミテッド | 導電性及び透明性を有するナノ被覆物及びナノインクの製造方法、並びにこの製造方法により製造されるナノ粉末被覆物及びインク |
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| KR101300442B1 (ko) * | 2005-06-10 | 2013-08-27 | 시마 나노 테크 이스라엘 리미티드 | 강화 투명 전도성 코팅 및 이의 제조 방법 |
| US20070154634A1 (en) * | 2005-12-15 | 2007-07-05 | Optomec Design Company | Method and Apparatus for Low-Temperature Plasma Sintering |
| JP5082357B2 (ja) * | 2006-09-22 | 2012-11-28 | 東レ株式会社 | 網目状金属微粒子積層基板の製造方法 |
-
2008
- 2008-02-29 WO PCT/US2008/055446 patent/WO2008115681A2/en not_active Ceased
- 2008-02-29 CN CN200880006867A patent/CN101641210A/zh active Pending
- 2008-02-29 KR KR1020097020479A patent/KR20090117827A/ko not_active Ceased
- 2008-02-29 EP EP08799605A patent/EP2131979A4/en not_active Withdrawn
- 2008-02-29 CA CA002680201A patent/CA2680201A1/en not_active Abandoned
- 2008-02-29 US US12/039,896 patent/US7763362B2/en not_active Expired - Fee Related
- 2008-02-29 JP JP2009552014A patent/JP2010520626A/ja active Pending
- 2008-02-29 AU AU2008229178A patent/AU2008229178B2/en not_active Ceased
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