KR20090117827A - 금속성 나노입자 조성물에 기초한 차폐 및 그의 장치 및 방법 - Google Patents

금속성 나노입자 조성물에 기초한 차폐 및 그의 장치 및 방법 Download PDF

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Publication number
KR20090117827A
KR20090117827A KR1020097020479A KR20097020479A KR20090117827A KR 20090117827 A KR20090117827 A KR 20090117827A KR 1020097020479 A KR1020097020479 A KR 1020097020479A KR 20097020479 A KR20097020479 A KR 20097020479A KR 20090117827 A KR20090117827 A KR 20090117827A
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South Korea
Prior art keywords
oxide
metallic
less
shielding structure
nanoparticles
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Ceased
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KR1020097020479A
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English (en)
Korean (ko)
Inventor
그레고리 에이. 야블론스키
마이클 에이. 마스트로피에트로
크리스토퍼 제이. 와고
Original Assignee
피켐 어소시에이츠, 인코퍼레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20090117827A publication Critical patent/KR20090117827A/ko
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
    • B05D7/04—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/22—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2601/00—Inorganic fillers
    • B05D2601/20—Inorganic fillers used for non-pigmentation effect
    • B05D2601/28—Metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12153—Interconnected void structure [e.g., permeable, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12542—More than one such component
    • Y10T428/12549—Adjacent to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Laminated Bodies (AREA)
  • Powder Metallurgy (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
KR1020097020479A 2007-03-01 2008-02-29 금속성 나노입자 조성물에 기초한 차폐 및 그의 장치 및 방법 Ceased KR20090117827A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US89240707P 2007-03-01 2007-03-01
US60/892,407 2007-03-01

Publications (1)

Publication Number Publication Date
KR20090117827A true KR20090117827A (ko) 2009-11-12

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KR1020097020479A Ceased KR20090117827A (ko) 2007-03-01 2008-02-29 금속성 나노입자 조성물에 기초한 차폐 및 그의 장치 및 방법

Country Status (8)

Country Link
US (1) US7763362B2 (cg-RX-API-DMAC7.html)
EP (1) EP2131979A4 (cg-RX-API-DMAC7.html)
JP (1) JP2010520626A (cg-RX-API-DMAC7.html)
KR (1) KR20090117827A (cg-RX-API-DMAC7.html)
CN (1) CN101641210A (cg-RX-API-DMAC7.html)
AU (1) AU2008229178B2 (cg-RX-API-DMAC7.html)
CA (1) CA2680201A1 (cg-RX-API-DMAC7.html)
WO (1) WO2008115681A2 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101464322B1 (ko) * 2012-11-21 2014-11-21 인더스트리얼 테크놀로지 리서치 인스티튜트 전자파 차단 구조 및 이를 제조하는 방법

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7927948B2 (en) 2005-07-20 2011-04-19 Micron Technology, Inc. Devices with nanocrystals and methods of formation
US7989290B2 (en) 2005-08-04 2011-08-02 Micron Technology, Inc. Methods for forming rhodium-based charge traps and apparatus including rhodium-based charge traps
US20070144305A1 (en) * 2005-12-20 2007-06-28 Jablonski Gregory A Synthesis of Metallic Nanoparticle Dispersions
US20100015462A1 (en) * 2008-02-29 2010-01-21 Gregory Jablonski Metallic nanoparticle shielding structure and methods thereof
WO2010064285A1 (ja) * 2008-12-01 2010-06-10 トヨタ自動車株式会社 装飾皮膜とその形成方法
JP2013513220A (ja) * 2009-12-07 2013-04-18 デューク ユニバーシティ 銅ナノワイヤを成長させるための組成および方法
JP6302249B2 (ja) * 2010-11-09 2018-03-28 コーネル・ユニバーシティーＣｏｒｎｅｌｌ Ｕｎｉｖｅｒｓｉｔｙ 硫黄含有ナノポーラス材料、ナノ粒子、方法およびアプリケーション
TWI540111B (zh) 2011-03-28 2016-07-01 康寧公司 Ｃｕ、ＣｕＯ與ＣｕＯ奈米顆粒在玻璃表面與耐久塗層上的抗微生物作用
CN102984929B (zh) * 2011-09-07 2015-07-08 港易有限公司 用于电子装置的防辐射叠层板及将该叠层板嵌入外壳的方法
US10364181B2 (en) 2014-04-23 2019-07-30 Corning Incorporated Antimicrobial articles with silver-containing alkali silicate coating and methods of making thereof
US9803065B2 (en) * 2015-03-12 2017-10-31 King Abdulaziz University Microwave shielding effectiveness based on polyvinyl alcohol/silver hybrid nanocomposites
US10354773B2 (en) 2016-04-08 2019-07-16 Duke University Noble metal-coated nanostructures and related methods
CN107507823B (zh) 2016-06-14 2022-12-20 三星电子株式会社 半导体封装和用于制造半导体封装的方法
EP3658289A4 (en) 2017-07-25 2021-04-07 Magnomer LLC PROCESSES AND COMPOSITIONS FOR MAGNETISABLE PLASTICS
CN107864604A (zh) * 2017-11-10 2018-03-30 中国科学院西安光学精密机械研究所 一种电磁辐射屏蔽结构
JP7494192B2 (ja) 2019-01-30 2024-06-03 マグノマー， インコーポレイテッド 磁化可能なプラスチックのための方法および組成物
CN114650721B (zh) * 2021-02-09 2025-06-03 广州方邦电子股份有限公司 电磁屏蔽膜及线路板

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692387A (en) * 1984-10-02 1987-09-08 E. I. Du Pont De Nemours And Company Sintering of metal interlayers within organic polymeric films
US4599277A (en) 1984-10-09 1986-07-08 International Business Machines Corp. Control of the sintering of powdered metals
US5338507A (en) 1987-03-30 1994-08-16 Hewlett-Packard Company Silver additives for ceramic superconductors
US5071826A (en) 1987-03-30 1991-12-10 Hewlett-Packard Company Organometallic silver additives for ceramic superconductors
US5332646A (en) 1992-10-21 1994-07-26 Minnesota Mining And Manufacturing Company Method of making a colloidal palladium and/or platinum metal dispersion
US5455749A (en) 1993-05-28 1995-10-03 Ferber; Andrew R. Light, audio and current related assemblies, attachments and devices with conductive compositions
US20060034731A1 (en) * 1995-03-27 2006-02-16 California Institute Of Technology Sensor arrays for detecting analytes in fluids
US5882722A (en) 1995-07-12 1999-03-16 Partnerships Limited, Inc. Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
US5973420A (en) 1996-10-03 1999-10-26 Colortronics Technologies L.L.C. Electrical system having a clear conductive composition
US6103868A (en) 1996-12-27 2000-08-15 The Regents Of The University Of California Organically-functionalized monodisperse nanocrystals of metals
US6379745B1 (en) 1997-02-20 2002-04-30 Parelec, Inc. Low temperature method and compositions for producing electrical conductors
KR20010072835A (ko) 1998-08-21 2001-07-31 추후제출 전기 회로 및 구성요소의 프린팅
EP2096427A3 (en) * 1998-11-16 2009-11-18 California Institute of Technology Simultaneous determination of equilibrium and kinetic properties
AU2000225122A1 (en) 2000-01-21 2001-07-31 Midwest Research Institute Method for forming thin-film conductors through the decomposition of metal-chelates in association with metal particles
US6773926B1 (en) 2000-09-25 2004-08-10 California Institute Of Technology Nanoparticle-based sensors for detecting analytes in fluids
ATE525730T1 (de) * 2000-10-25 2011-10-15 Harima Chemicals Inc Elektroleitfähige metallpaste und verfahren zu ihrer herstellung
ATE502296T1 (de) * 2000-12-12 2011-04-15 Sony Deutschland Gmbh Selektive chemische sensoren, basierend auf verketteten nanopartikel-ansammlungen
US7115218B2 (en) 2001-06-28 2006-10-03 Parelec, Inc. Low temperature method and composition for producing electrical conductors
US6645444B2 (en) 2001-06-29 2003-11-11 Nanospin Solutions Metal nanocrystals and synthesis thereof
US6951666B2 (en) 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features
US20060001726A1 (en) 2001-10-05 2006-01-05 Cabot Corporation Printable conductive features and processes for making same
WO2003038002A1 (en) 2001-11-01 2003-05-08 Yissum Research Development Company Of The Hebrew University Of Jerusalem Ink-jet inks containing metal nanoparticles
US6872645B2 (en) 2002-04-02 2005-03-29 Nanosys, Inc. Methods of positioning and/or orienting nanostructures
JP2003309352A (ja) 2002-04-16 2003-10-31 Fujikura Ltd 導電性接着剤およびこれを用いた電子部品実装構造
JP2003309337A (ja) 2002-04-16 2003-10-31 Fujikura Ltd プリント回路基板
JP3961334B2 (ja) 2002-04-17 2007-08-22 株式会社フジクラ Ｉｃカードおよびその製造方法
JP4636496B2 (ja) * 2002-06-13 2011-02-23 シーマ ナノテック イスラエル リミテッド 導電性及び透明性を有するナノ被覆物及びナノインクの製造方法、並びにこの製造方法により製造されるナノ粉末被覆物及びインク
US6878184B1 (en) 2002-08-09 2005-04-12 Kovio, Inc. Nanoparticle synthesis and the formation of inks therefrom
US8071168B2 (en) * 2002-08-26 2011-12-06 Nanoink, Inc. Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair
US20050126338A1 (en) * 2003-02-24 2005-06-16 Nanoproducts Corporation Zinc comprising nanoparticles and related nanotechnology
US7645397B2 (en) * 2004-01-15 2010-01-12 Nanosys, Inc. Nanocrystal doped matrixes
US20060044382A1 (en) 2004-08-24 2006-03-02 Yimin Guan Metal colloid dispersions and their aqueous metal inks
US20060163744A1 (en) 2005-01-14 2006-07-27 Cabot Corporation Printable electrical conductors
WO2006076613A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Metal nanoparticle compositions
KR101300442B1 (ko) * 2005-06-10 2013-08-27 시마 나노 테크 이스라엘 리미티드 강화 투명 전도성 코팅 및 이의 제조 방법
US20070154634A1 (en) * 2005-12-15 2007-07-05 Optomec Design Company Method and Apparatus for Low-Temperature Plasma Sintering
JP5082357B2 (ja) * 2006-09-22 2012-11-28 東レ株式会社 網目状金属微粒子積層基板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101464322B1 (ko) * 2012-11-21 2014-11-21 인더스트리얼 테크놀로지 리서치 인스티튜트 전자파 차단 구조 및 이를 제조하는 방법
US9236169B2 (en) 2012-11-21 2016-01-12 Industrial Technology Research Institute Electromagnetic wave shielding structure and method for fabricating the same

Also Published As

Publication number Publication date
WO2008115681A3 (en) 2008-11-20
WO2008115681A2 (en) 2008-09-25
AU2008229178B2 (en) 2012-02-23
EP2131979A2 (en) 2009-12-16
CA2680201A1 (en) 2008-09-25
AU2008229178A1 (en) 2008-09-25
JP2010520626A (ja) 2010-06-10
US7763362B2 (en) 2010-07-27
CN101641210A (zh) 2010-02-03
US20080213609A1 (en) 2008-09-04
EP2131979A4 (en) 2013-03-06

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