JP2010513722A5 - - Google Patents

Download PDF

Info

Publication number
JP2010513722A5
JP2010513722A5 JP2009543091A JP2009543091A JP2010513722A5 JP 2010513722 A5 JP2010513722 A5 JP 2010513722A5 JP 2009543091 A JP2009543091 A JP 2009543091A JP 2009543091 A JP2009543091 A JP 2009543091A JP 2010513722 A5 JP2010513722 A5 JP 2010513722A5
Authority
JP
Japan
Prior art keywords
processing kit
main body
ring
kit according
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009543091A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010513722A (ja
JP5666133B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2007/087466 external-priority patent/WO2008079722A2/en
Publication of JP2010513722A publication Critical patent/JP2010513722A/ja
Publication of JP2010513722A5 publication Critical patent/JP2010513722A5/ja
Application granted granted Critical
Publication of JP5666133B2 publication Critical patent/JP5666133B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009543091A 2006-12-19 2007-12-13 非接触型処理キット Active JP5666133B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US87075206P 2006-12-19 2006-12-19
US60/870,752 2006-12-19
PCT/US2007/087466 WO2008079722A2 (en) 2006-12-19 2007-12-13 Non-contact process kit

Publications (3)

Publication Number Publication Date
JP2010513722A JP2010513722A (ja) 2010-04-30
JP2010513722A5 true JP2010513722A5 (OSRAM) 2010-12-09
JP5666133B2 JP5666133B2 (ja) 2015-02-12

Family

ID=39563165

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009543091A Active JP5666133B2 (ja) 2006-12-19 2007-12-13 非接触型処理キット

Country Status (5)

Country Link
JP (1) JP5666133B2 (OSRAM)
KR (1) KR101504085B1 (OSRAM)
CN (1) CN101563560B (OSRAM)
SG (1) SG177902A1 (OSRAM)
WO (1) WO2008079722A2 (OSRAM)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8617672B2 (en) 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
US9127362B2 (en) 2005-10-31 2015-09-08 Applied Materials, Inc. Process kit and target for substrate processing chamber
US7942969B2 (en) 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
JP5194315B2 (ja) * 2008-07-04 2013-05-08 株式会社昭和真空 スパッタリング装置
US8900471B2 (en) * 2009-02-27 2014-12-02 Applied Materials, Inc. In situ plasma clean for removal of residue from pedestal surface without breaking vacuum
WO2011117916A1 (ja) * 2010-03-24 2011-09-29 キヤノンアネルバ株式会社 電子デバイスの製造方法およびスパッタリング方法
CN103069542A (zh) * 2010-08-20 2013-04-24 应用材料公司 延长寿命的沉积环
CN103140913B (zh) * 2010-10-29 2016-09-28 应用材料公司 用于物理气相沉积腔室的沉积环及静电夹盘
CN102676997A (zh) * 2012-06-11 2012-09-19 上海宏力半导体制造有限公司 一种物理气相沉积设备
JP5934427B2 (ja) * 2013-02-28 2016-06-15 キヤノンアネルバ株式会社 スパッタリング装置
CN104746019B (zh) * 2013-12-26 2018-01-19 北京北方华创微电子装备有限公司 反应腔室及等离子体加工设备
CN105097604B (zh) * 2014-05-05 2018-11-06 北京北方华创微电子装备有限公司 工艺腔室
WO2015188879A1 (en) * 2014-06-13 2015-12-17 Applied Materials, Inc. Flat edge design for better uniformity and increased edge lifetime
US10115573B2 (en) * 2014-10-14 2018-10-30 Applied Materials, Inc. Apparatus for high compressive stress film deposition to improve kit life
US10546733B2 (en) * 2014-12-31 2020-01-28 Applied Materials, Inc. One-piece process kit shield
KR20170128585A (ko) * 2015-03-20 2017-11-22 어플라이드 머티어리얼스, 인코포레이티드 고온 폴리머 본드를 이용하여 금속 베이스에 본딩 결합된 세라믹 정전 척
TWM534436U (en) * 2015-07-03 2016-12-21 Applied Materials Inc Frame, multi-piece under substrate cover frame and processing chamber
SG10202108705SA (en) * 2015-07-03 2021-09-29 Applied Materials Inc Process kit having tall deposition ring and deposition ring clamp
US10103012B2 (en) * 2015-09-11 2018-10-16 Applied Materials, Inc. One-piece process kit shield for reducing the impact of an electric field near the substrate
JP7225599B2 (ja) * 2018-08-10 2023-02-21 東京エレクトロン株式会社 成膜装置
US11961723B2 (en) * 2018-12-17 2024-04-16 Applied Materials, Inc. Process kit having tall deposition ring for PVD chamber
CN110670049A (zh) * 2019-11-19 2020-01-10 武汉新芯集成电路制造有限公司 一种气相沉积方法及装置
TW202129045A (zh) * 2019-12-05 2021-08-01 美商應用材料股份有限公司 多陰極沉積系統與方法
US11339466B2 (en) * 2020-03-20 2022-05-24 Applied Materials, Inc. Heated shield for physical vapor deposition chamber
CN111471976A (zh) * 2020-05-21 2020-07-31 中国科学院半导体研究所 衬底托
US11492697B2 (en) * 2020-06-22 2022-11-08 Applied Materials, Inc. Apparatus for improved anode-cathode ratio for rf chambers
US11600477B2 (en) * 2020-12-14 2023-03-07 Applied Materials, Inc. Gas injection process kit to eliminate arcing and improve uniform gas distribution for a PVD process
CN114717514B (zh) * 2021-01-06 2023-12-15 鑫天虹(厦门)科技有限公司 薄膜沉积设备
US20240186176A1 (en) * 2022-12-02 2024-06-06 Onto Innovation Inc. Stage actuator particle shield
CN117305814A (zh) * 2023-09-22 2023-12-29 上海中欣晶圆半导体科技有限公司 一种常压化学气相沉积用治具及其使用方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6174377B1 (en) * 1997-03-03 2001-01-16 Genus, Inc. Processing chamber for atomic layer deposition processes
US20030049372A1 (en) * 1997-08-11 2003-03-13 Cook Robert C. High rate deposition at low pressures in a small batch reactor
US6051122A (en) * 1997-08-21 2000-04-18 Applied Materials, Inc. Deposition shield assembly for a semiconductor wafer processing system
JPH11229132A (ja) * 1998-02-19 1999-08-24 Toshiba Corp スパッタ成膜装置およびスパッタ成膜方法
CN1172022C (zh) * 2001-10-11 2004-10-20 矽统科技股份有限公司 沉积过程的工作平台
JP2005517809A (ja) * 2002-02-14 2005-06-16 トリコン テクノロジーズ リミテッド プラズマ処理装置
US7670436B2 (en) * 2004-11-03 2010-03-02 Applied Materials, Inc. Support ring assembly
US7579067B2 (en) * 2004-11-24 2009-08-25 Applied Materials, Inc. Process chamber component with layered coating and method

Similar Documents

Publication Publication Date Title
JP2010513722A5 (OSRAM)
USD682609S1 (en) Lid assembly with utensils
USD784076S1 (en) Cooking utensil interior bottom with pattern
USD581721S1 (en) Covered sauce pan
USD651865S1 (en) Bowl
USD629246S1 (en) Cookware vessel
USD586612S1 (en) Pedestal base for cookware
USD618513S1 (en) Bowl
USD907213S1 (en) Patch with electrode array
USD921414S1 (en) Cookware vessel body
USD576446S1 (en) Side handle for cookware
WO2008079722A3 (en) Non-contact process kit
USD696074S1 (en) Collapsible bowl with tilt mechanism
USD631301S1 (en) Bowl or basket for food
USD617139S1 (en) Cookware side handle
JP2016530705A5 (OSRAM)
USD900981S1 (en) Urinal cake
USD604559S1 (en) Saucepan support
JP2004503224A (ja) 動物の餌入れ容器
EP2423072A3 (en) Bakery dolly
CA114341S (en) Salad spinner
USD637389S1 (en) Umbrella vent
USD658358S1 (en) Foot support
USD891181S1 (en) Taco carousel
USD891179S1 (en) Cooking grid support ring for kamado-style grill