JP2010507085A5 - - Google Patents

Download PDF

Info

Publication number
JP2010507085A5
JP2010507085A5 JP2009532800A JP2009532800A JP2010507085A5 JP 2010507085 A5 JP2010507085 A5 JP 2010507085A5 JP 2009532800 A JP2009532800 A JP 2009532800A JP 2009532800 A JP2009532800 A JP 2009532800A JP 2010507085 A5 JP2010507085 A5 JP 2010507085A5
Authority
JP
Japan
Prior art keywords
radiation
substrate
sensing element
cap
sensor array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009532800A
Other languages
English (en)
Japanese (ja)
Other versions
JP5358446B2 (ja
JP2010507085A (ja
Filing date
Publication date
Priority claimed from US11/584,121 external-priority patent/US7718967B2/en
Application filed filed Critical
Publication of JP2010507085A publication Critical patent/JP2010507085A/ja
Publication of JP2010507085A5 publication Critical patent/JP2010507085A5/ja
Application granted granted Critical
Publication of JP5358446B2 publication Critical patent/JP5358446B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009532800A 2006-10-20 2007-10-17 ダイ温度センサ Expired - Fee Related JP5358446B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/584,121 2006-10-20
US11/584,121 US7718967B2 (en) 2005-01-26 2006-10-20 Die temperature sensors
PCT/EP2007/061099 WO2008046866A1 (en) 2006-10-20 2007-10-17 Die temperature sensors

Publications (3)

Publication Number Publication Date
JP2010507085A JP2010507085A (ja) 2010-03-04
JP2010507085A5 true JP2010507085A5 (enExample) 2010-12-02
JP5358446B2 JP5358446B2 (ja) 2013-12-04

Family

ID=38973621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009532800A Expired - Fee Related JP5358446B2 (ja) 2006-10-20 2007-10-17 ダイ温度センサ

Country Status (5)

Country Link
US (1) US7718967B2 (enExample)
EP (1) EP2084502B1 (enExample)
JP (1) JP5358446B2 (enExample)
CN (1) CN101568813B (enExample)
WO (1) WO2008046866A1 (enExample)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7807972B2 (en) * 2005-01-26 2010-10-05 Analog Devices, Inc. Radiation sensor with cap and optical elements
US8487260B2 (en) * 2005-01-26 2013-07-16 Analog Devices, Inc. Sensor
CN101326639B (zh) * 2005-12-06 2014-01-22 意法半导体有限公司 集成电路中的电阻器
US7432729B2 (en) * 2006-01-10 2008-10-07 Freescale Semiconductor, Inc. Methods of testing electronic devices
DE102007024902B8 (de) * 2007-05-29 2010-12-30 Pyreos Ltd. Vorrichtung mit Membranstruktur zur Detektion von Wärmestrahlung, Verfahren zum Herstellen und Verwendung der Vorrichtung
US8523427B2 (en) * 2008-02-27 2013-09-03 Analog Devices, Inc. Sensor device with improved sensitivity to temperature variation in a semiconductor substrate
FR2934679B1 (fr) * 2008-07-29 2010-09-24 Ulis Dispositif et procede de detection d'un rayonnement infrarouge au moyen d'une matrice de bolometres resistifs.
JP2011027652A (ja) * 2009-07-28 2011-02-10 Panasonic Electric Works Co Ltd 赤外線センサ
US8304850B2 (en) * 2009-12-22 2012-11-06 Texas Instruments Incorporated Integrated infrared sensors with optical elements, and methods
EP2363887A1 (en) * 2010-03-02 2011-09-07 SensoNor Technologies AS Focal plane array and method for manufacturing the same
US8848374B2 (en) * 2010-06-30 2014-09-30 Taiwan Semiconductor Manufacturing Company, Ltd. Method and structure for dissipating heat away from a resistor having neighboring devices and interconnects
CN102384790B (zh) * 2010-08-30 2013-04-24 中国科学院微电子研究所 热电堆红外传感器及其制作方法
FR2966595B1 (fr) * 2010-10-26 2013-01-25 Commissariat Energie Atomique Dispositif de detection d'un rayonnement electromagnetique.
EP2677288A4 (en) * 2011-02-18 2017-12-13 Nec Corporation Infrared detection sensor array and infrared detection device
JP6152377B2 (ja) * 2011-05-03 2017-06-21 ヴィシェイ デール エレクトロニクス エルエルシー 電気部品用ヒートスプレッダ
JP5853476B2 (ja) * 2011-08-04 2016-02-09 セイコーエプソン株式会社 赤外線検出素子及び電子機器
FR2983297B1 (fr) * 2011-11-29 2015-07-17 Commissariat Energie Atomique Detecteur infrarouge a base de micro-planches bolometriques suspendues
US8975329B2 (en) 2011-12-02 2015-03-10 Sabic Global Technologies B.V. Poly(phenylene ether) articles and compositions
DE102012200384B4 (de) * 2011-12-29 2018-03-15 Continental Automotive Gmbh Auf einem Träger angeordnete Schaltungsanordnung mit Temperaturüberwachung und Verfahren zum Erkennen einer Übertemperatur
US8816280B2 (en) 2012-03-21 2014-08-26 Analog Devices, Inc. Infrared sensor
US9559162B2 (en) 2013-06-19 2017-01-31 Globalfoundries Inc. Thermoresistance sensor structure for integrated circuits and method of making
JP6167926B2 (ja) * 2014-02-11 2017-07-26 株式会社デンソー 赤外線検出装置
US9227839B2 (en) * 2014-05-06 2016-01-05 Raytheon Company Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling
EP3035015B1 (en) * 2014-12-15 2017-04-12 Melexis Technologies NV Ir sensor for ir sensing based on power control
HUE066244T2 (hu) 2015-08-07 2024-07-28 Vishay Dale Electronics Llc Formázott testtel rendelkezõ villamos eszköz nagyfeszültségû alkalmazásokhoz és annak gyártási eljárása
CN105509896A (zh) * 2015-12-31 2016-04-20 中国科学院光电研究院 一种大气下行长波辐射测量人工靶标及其制作方法
US10128302B2 (en) * 2016-01-28 2018-11-13 Ams Sensors Uk Limited IR detector array device
CN107024294B (zh) * 2016-01-29 2020-01-03 苏州普源精电科技有限公司 一种多通道芯片温度测量电路及方法
US11211305B2 (en) 2016-04-01 2021-12-28 Texas Instruments Incorporated Apparatus and method to support thermal management of semiconductor-based components
CN105784126A (zh) * 2016-04-15 2016-07-20 中国科学院上海技术物理研究所 一种基于二极管测温的红外探测器组件多路温度监测系统
US10861796B2 (en) 2016-05-10 2020-12-08 Texas Instruments Incorporated Floating die package
US10179730B2 (en) * 2016-12-08 2019-01-15 Texas Instruments Incorporated Electronic sensors with sensor die in package structure cavity
US10074639B2 (en) 2016-12-30 2018-09-11 Texas Instruments Incorporated Isolator integrated circuits with package structure cavity and fabrication methods
DE102017206388A1 (de) * 2017-04-13 2018-10-18 Robert Bosch Gmbh Verfahren zum Schutz einer MEMS-Einheit vor Infrarot-Untersuchungen sowie MEMS-Einheit
DE102017206386A1 (de) * 2017-04-13 2018-10-18 Robert Bosch Gmbh Verfahren zum Schutz einer MEMS-Einheit vor Infrarot-Untersuchungen sowie MEMS-Einheit
WO2019053759A1 (ja) * 2017-09-12 2019-03-21 株式会社芝浦電子 赤外線温度センサ
CN109140785B (zh) * 2018-07-10 2019-07-12 江苏省精创电气股份有限公司 一种自动识别空气源热水器中温度传感器位置的方法
DE102019118545B3 (de) * 2019-07-09 2020-10-29 Infineon Technologies Ag Sensorvorrichtung mit Hilfsstruktur zum Kalibrieren der Sensorvorrichtung
CN110536085B (zh) * 2019-08-20 2022-03-11 北京安酷智芯科技有限公司 一种读出电路及图像校正方法
KR20220133214A (ko) * 2020-02-06 2022-10-04 트리나미엑스 게엠베하 차동 이중 검출기를 통한 온도 검출
CN113432737A (zh) * 2020-03-19 2021-09-24 长鑫存储技术有限公司 晶圆卡盘温度量测及温度校准的方法和温度量测系统
CN113720474B (zh) * 2021-03-26 2022-11-15 北京北方高业科技有限公司 基于cmos工艺的红外探测器镜像像元和红外探测器

Family Cites Families (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4286225A (en) 1979-12-31 1981-08-25 Analog Devices, Incorporated Isolation amplifier
US4360784A (en) 1980-08-13 1982-11-23 Automation Systems, Inc. Transformer coupled isolation amplifier
US7415126B2 (en) 1992-05-05 2008-08-19 Automotive Technologies International Inc. Occupant sensing system
GB2165639B (en) 1984-08-24 1988-01-27 Philips Electronic Associated Pyroelectric infra-red detector
JPH02143558A (ja) * 1988-11-25 1990-06-01 Fujitsu Ltd 赤外線撮像装置
US4994664A (en) 1989-03-27 1991-02-19 Massachusetts Institute Of Technology Optically coupled focal plane arrays using lenslets and multiplexers
US5034608A (en) * 1989-09-08 1991-07-23 Massachusetts Institute Of Technology Infrared sensor operable without cooling
JPH0821703B2 (ja) 1990-07-17 1996-03-04 株式会社東芝 固体撮像素子
JPH04158586A (ja) * 1990-10-22 1992-06-01 Matsushita Electric Works Ltd 赤外線検出素子
US5528038A (en) 1991-05-07 1996-06-18 Matsushita Electric Industrial Co., Ltd. Temperature distribution measurement apparatus and its application to a human body detecting system
JPH0743215A (ja) * 1993-05-24 1995-02-14 Mitsubishi Electric Corp 赤外線検知素子
JPH0792026A (ja) 1993-09-22 1995-04-07 Matsushita Electric Ind Co Ltd 焦電型赤外線センサ
US5434413A (en) 1993-10-01 1995-07-18 Texas Instruments Incorporated Virtual cold shield and cold filter for infrared detector arrays
KR970010976B1 (ko) 1993-12-31 1997-07-05 엘지전자 주식회사 적외선 어레이센서 장치
JP3311869B2 (ja) * 1994-09-16 2002-08-05 株式会社東芝 半導体光電変換素子およびこれを用いた撮像装置
US5754088A (en) 1994-11-17 1998-05-19 International Business Machines Corporation Planar transformer and method of manufacture
JPH08145787A (ja) 1994-11-28 1996-06-07 Matsushita Electric Ind Co Ltd 焦電型赤外線センサ
US5550373A (en) * 1994-12-30 1996-08-27 Honeywell Inc. Fabry-Perot micro filter-detector
JPH08261835A (ja) 1995-03-27 1996-10-11 Matsushita Electric Ind Co Ltd 焦電型赤外線センサ
US5650624A (en) 1995-04-13 1997-07-22 Engelhard Sensor Technologies, Inc. Passive infrared analysis gas sensor
US5721430A (en) * 1995-04-13 1998-02-24 Engelhard Sensor Technologies Inc. Passive and active infrared analysis gas sensors and applicable multichannel detector assembles
JP3613838B2 (ja) 1995-05-18 2005-01-26 株式会社デンソー 半導体装置の製造方法
US6392232B1 (en) 1995-07-21 2002-05-21 Pharmarcopeia, Inc. High fill factor bolometer array
US5914488A (en) 1996-03-05 1999-06-22 Mitsubishi Denki Kabushiki Kaisha Infrared detector
JPH09257587A (ja) 1996-03-26 1997-10-03 Terumo Corp 非接触型温度計
CN1183587C (zh) 1996-04-08 2005-01-05 德克萨斯仪器股份有限公司 用于把两个集成电路直流上相互隔离的方法和设备
JPH09280957A (ja) * 1996-04-15 1997-10-31 Mitsuteru Kimura 熱型温度センサ
US5962854A (en) * 1996-06-12 1999-10-05 Ishizuka Electronics Corporation Infrared sensor and infrared detector
US5701008A (en) 1996-11-29 1997-12-23 He Holdings, Inc. Integrated infrared microlens and gas molecule getter grating in a vacuum package
WO1998036247A1 (de) * 1997-02-14 1998-08-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Strömungssensorkomponente
EP0863640A3 (en) 1997-03-04 2005-09-21 Texas Instruments Incorporated Improved physical layer interface device
US6038065A (en) 1997-06-06 2000-03-14 Raytheon Company Infrared-transparent window structure
US6252229B1 (en) 1998-07-10 2001-06-26 Boeing North American, Inc. Sealed-cavity microstructure and microbolometer and associated fabrication methods
CN1118103C (zh) 1998-10-21 2003-08-13 李韫言 微细加工热辐射红外传感器
CA2300400A1 (en) 1999-03-22 2000-09-22 Michael George Taranowski Electronic optical target ranging and imaging
JP3573040B2 (ja) 1999-05-07 2004-10-06 三菱電機株式会社 赤外線カメラ及び赤外線カメラシステム
US6222454B1 (en) * 1999-07-01 2001-04-24 Goal Electronics Inc. Non-contacting temperature sensing device
US6566725B1 (en) 1999-07-30 2003-05-20 Xactix, Inc. Thermal isolation using vertical structures
US6953932B2 (en) * 1999-10-07 2005-10-11 Infrared Solutions, Inc. Microbolometer focal plane array with temperature compensated bias
JP2001296184A (ja) * 2000-04-17 2001-10-26 Denso Corp 赤外線検出装置
JP2001304973A (ja) 2000-04-26 2001-10-31 Denso Corp 赤外線イメージセンサ
WO2002056251A1 (en) 2000-12-27 2002-07-18 Mitsubishi Denki Kabushiki Kaisha Image processing device and elevator mounting it thereon
FR2822541B1 (fr) 2001-03-21 2003-10-03 Commissariat Energie Atomique Procedes et dispositifs de fabrication de detecteurs de rayonnement
US6890834B2 (en) 2001-06-11 2005-05-10 Matsushita Electric Industrial Co., Ltd. Electronic device and method for manufacturing the same
US6893574B2 (en) 2001-10-23 2005-05-17 Analog Devices Inc MEMS capping method and apparatus
JP3655232B2 (ja) * 2001-11-15 2005-06-02 株式会社東芝 赤外線センサ
US7064442B1 (en) 2003-07-02 2006-06-20 Analog Devices, Inc. Integrated circuit package device
DE102004031315A1 (de) 2004-06-29 2006-01-19 Robert Bosch Gmbh Mikrostrukturierter Infrarot-Sensor
DE102004034066B4 (de) 2004-07-15 2012-10-31 Bayerische Motoren Werke Aktiengesellschaft Vorrichtung zur Steuerung der Kühlung einer Brennkraftmaschine für Kraftfahrzeuge
US20060091300A1 (en) 2004-10-29 2006-05-04 Nishimura Ken A Optical color sensor using diffractive elements
JP2006170945A (ja) * 2004-12-20 2006-06-29 Canon Inc 半導体装置およびその製造方法
US7326932B2 (en) 2005-01-26 2008-02-05 Analog Devices, Inc. Sensor and cap arrangement
US7435964B2 (en) 2005-01-26 2008-10-14 Analog Devices, Inc. Thermal sensor with increased sensitivity
US7692148B2 (en) 2005-01-26 2010-04-06 Analog Devices, Inc. Thermal sensor with thermal barrier
US8487260B2 (en) 2005-01-26 2013-07-16 Analog Devices, Inc. Sensor
WO2008085437A2 (en) 2006-12-27 2008-07-17 Analog Devices, Inc. Control aperture for an ir sensor
JP2009079946A (ja) * 2007-09-26 2009-04-16 Seiko Npc Corp サーモパイル型赤外線センサ

Similar Documents

Publication Publication Date Title
JP2010507085A5 (enExample)
JP2010507082A5 (enExample)
JP2010507084A5 (enExample)
CN101568813B (zh) 芯片温度传感器
CN101563591B (zh) 包括参考传感器元件的传感器
CN101563592B (zh) 具有热阻挡体的热传感器
CN101563590B (zh) 灵敏度增加的热传感器
US9851258B2 (en) Thermopile temperature sensor with a reference sensor therein
JP2008528987A5 (enExample)
TW440687B (en) Radiation thermometer and radiation sensor with multiple sensor elements and method for determining a temperature
US10444076B2 (en) Infrared device
US20100193706A1 (en) Infrared sensors, focal plane arrays and thermal imaging systems
US8523427B2 (en) Sensor device with improved sensitivity to temperature variation in a semiconductor substrate
TWI456297B (zh) 液晶顯示裝置及彩色濾光片基板
CN104764531B (zh) 集成红外热传感器及其制造方法及成像系统和成像方法
ATE546717T1 (de) Messung des wärmeflusses in einer beheizten kammer
US20130206989A1 (en) Radiation Sensor
CN105806491A (zh) 一种三波长二维温度场测量装置及方法
JP2012073033A (ja) 赤外線アレイセンサを用いた水位検出装置
JP2020501149A (ja) 赤外線画像センサ
JP2011179828A (ja) 多波長赤外線アレイセンサ
CN104089704B (zh) 半导体薄膜反应腔辅助温度校准方法
JPH02205730A (ja) 赤外線センサ
JPH05231932A (ja) 自己校正式日射計
JPWO2023157164A5 (enExample)