JP2010277996A - 異方導電粒子 - Google Patents
異方導電粒子 Download PDFInfo
- Publication number
- JP2010277996A JP2010277996A JP2010099002A JP2010099002A JP2010277996A JP 2010277996 A JP2010277996 A JP 2010277996A JP 2010099002 A JP2010099002 A JP 2010099002A JP 2010099002 A JP2010099002 A JP 2010099002A JP 2010277996 A JP2010277996 A JP 2010277996A
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- Prior art keywords
- anisotropic conductive
- particles
- conductive particles
- resistance
- fine particles
- Prior art date
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- 239000002245 particle Substances 0.000 title claims abstract description 257
- 239000011810 insulating material Substances 0.000 claims abstract description 31
- 239000010419 fine particle Substances 0.000 claims description 79
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 239000003575 carbonaceous material Substances 0.000 claims description 7
- 239000010439 graphite Substances 0.000 claims description 7
- 229910002804 graphite Inorganic materials 0.000 claims description 7
- 239000007769 metal material Substances 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 239000002041 carbon nanotube Substances 0.000 claims description 5
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 5
- 230000002209 hydrophobic effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 26
- 238000009413 insulation Methods 0.000 abstract description 19
- 238000003825 pressing Methods 0.000 abstract description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 29
- 238000000034 method Methods 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 13
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- 238000000576 coating method Methods 0.000 description 5
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- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 3
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- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
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- SWEICGMKXPNXNU-UHFFFAOYSA-N 1,2-dihydroindazol-3-one Chemical compound C1=CC=C2C(O)=NNC2=C1 SWEICGMKXPNXNU-UHFFFAOYSA-N 0.000 description 2
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- QWENRTYMTSOGBR-UHFFFAOYSA-N 1H-1,2,3-Triazole Chemical compound C=1C=NNN=1 QWENRTYMTSOGBR-UHFFFAOYSA-N 0.000 description 2
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- LRFVTYWOQMYALW-UHFFFAOYSA-N 9H-xanthine Chemical compound O=C1NC(=O)NC2=C1NC=N2 LRFVTYWOQMYALW-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
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- QNAYBMKLOCPYGJ-UHFFFAOYSA-N Alanine Chemical compound CC([NH3+])C([O-])=O QNAYBMKLOCPYGJ-UHFFFAOYSA-N 0.000 description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- HNDVDQJCIGZPNO-YFKPBYRVSA-N L-histidine Chemical compound OC(=O)[C@@H](N)CC1=CN=CN1 HNDVDQJCIGZPNO-YFKPBYRVSA-N 0.000 description 2
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- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
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- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- RYYVLZVUVIJVGH-UHFFFAOYSA-N caffeine Chemical compound CN1C(=O)N(C)C(=O)C2=C1N=CN2C RYYVLZVUVIJVGH-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- PKWIYNIDEDLDCJ-UHFFFAOYSA-N guanazole Chemical compound NC1=NNC(N)=N1 PKWIYNIDEDLDCJ-UHFFFAOYSA-N 0.000 description 2
- UYTPUPDQBNUYGX-UHFFFAOYSA-N guanine Chemical compound O=C1NC(N)=NC2=C1N=CN2 UYTPUPDQBNUYGX-UHFFFAOYSA-N 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- HNDVDQJCIGZPNO-UHFFFAOYSA-N histidine Natural products OC(=O)C(N)CC1=CN=CN1 HNDVDQJCIGZPNO-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
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- YAPQBXQYLJRXSA-UHFFFAOYSA-N theobromine Chemical compound CN1C(=O)NC(=O)C2=C1N=CN2C YAPQBXQYLJRXSA-UHFFFAOYSA-N 0.000 description 2
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Images
Classifications
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- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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Abstract
【解決手段】 有機絶縁物質3中に導電性微粒子2を分散させた異方導電粒子。
【選択図】 図1
Description
HS−(CH2)n−R ・・・(I)
(式中、nは1〜23の整数であり、Rは一価の有機基、水素原子又はハロゲン原子を示す。)
で表される構造を有する脂肪族チオール、チアゾール誘導体(チアゾール、2−アミノチアゾール、2−アミノチアゾール−4−カルボン酸、アミノチオフェン、ベンゾチアゾール、2−メルカプトベンゾチアゾール、2−アミノベンゾチアゾール、2−アミノ−4−メチルベンゾチアゾール、2−ベンゾチアゾロール、2,3−ジヒドロイミダゾ〔2,1−b〕ベンゾチアゾール−6−アミン、2−(2−アミノチアゾール−4−イル)−2−ヒドロキシイミノ酢酸エチル、2−メチルベンゾチアゾール、2−フェニルベンゾチアゾール、2−アミノ−4−メチルチアゾール等)、チアジアゾール誘導体(1,2,3−チアジアゾール、1,2,4−チアジアゾール、1,2,5−チアジアゾール、1,3,4−チアジアゾール、2−アミノ−5−エチル−1,3,4−チアジアゾール、5−アミノ−1,3,4−チアジアゾール−2−チオール、2,5−メルカプト−1,3,4−チアジアゾール、3−メチルメルカプト−5−メルカプト−1,2,4−チアジアゾール、2−アミノ−1,3,4−チアジアゾール、2−(エチルアミノ)−1,3,4−チアジアゾール、2−アミノ−5−エチルチオ−1,3,4−チアジアゾール等)、メルカプト安息香酸、メルカプトナフトール、メルカプトフェノール、4−メルカプトビフェニル、メルカプト酢酸、メルカプトコハク酸、3−メルカプトプロピオン酸、チオウラシル、3−チオウラゾール、2−チオウラミル、4−チオウラミル、2−メルカプトキノリン、チオギ酸、1−チオクマリン、チオクモチアゾン、チオクレゾール、チオサリチル酸、チオチアヌル酸、チオナフトール、チオトレン、チオナフテン、チオナフテンカルボン酸、チオナフテンキノン、チオバルビツール酸、チオヒドロキノン、チオフェノール、チオフェン、チオフタリド、チオフテン、チオールチオン炭酸、チオルチドン、チオールヒスチジン、3−カルボキシプロピルジスルフィド、2−ヒドロキシエチルジスルフィド、2−アミノプロピオン酸、ジチオジグリコール酸、D−システイン、ジ−t−ブチルジスルフィド、チオシアン、チオシアン酸などが挙げられる。これらは単独で又は2種類以上を組み合わせて使用される。
<導電性微粒子の作製>
化学還元法にて、粒径分布0.005〜10μmの燐片状銀粉末1を得た。得られた銀粉末1を分級し、平均粒径0.25μm、最大粒径0.4μmの燐片状銀粉末2を得た。
テトラメチロールメタントリアクリレート60質量部、ジビニルベンゼン20質量部及びアクリロニトリル20質量部を混合し、有機絶縁物質の原料モノマーとした。更に、この有機絶縁物質の原料モノマー100体積部に対して、銀粉末2を120体積部添加し、ビーズミルを用いて48時間かけて銀粉末を分散させた。この銀粉末が分散された組成物に、過酸化ベンゾイル2質量部を混合し、これを3質量%濃度のポリビニルアルコール水溶液850質量部に投入し、よく攪拌した後、ホモジナイザーでこの重合性単量体の液滴が粒径約0.4〜33μmの微粒子状となるように懸濁させ、懸濁液を得た。得られた懸濁液を、温度計と攪拌機と還流冷却器とを備えた2リットルのセパラブルフラスコに移し、窒素雰囲気中で攪拌しながら85℃に加熱昇温し、7時間重合反応を行い、更に90℃に昇温して3時間保ち、重合反応を完結させた。その後、重合反応液を冷却し、生成した粒子を濾過し、充分に水洗し乾燥させて、粒径が0.4〜33μmの異方導電粒子を得た。得られた異方導電粒子を分級して、平均粒径5.55μmの、銀微粒子を含有した異方導電粒子1を得た。
微小圧縮試験機(PCT−200型、島津製作所社製)を用い、微小圧縮試験機の圧子とステンレステーブルのそれぞれに金線を接合して圧子とステンレステーブル間の抵抗を測定できるようにして、異方導電粒子1の圧力を加える前の抵抗と50%扁平させた時の抵抗を測定(測定数100個)し、結果を表1に示した。表1に示した結果は、100個の異方導電粒子1についてそれぞれ測定した抵抗値の平均値である。
実施例1で作製した銀粉末2を、メチルエチルケトン100質量部にN−(2−アミノエチル)−3−アミノプロピルトリメトキシシランを3質量部溶解させた溶液に浸し、1昼夜攪拌することで銀粉末表面を疎水化した。この表面を疎水化した銀粉末を用いたこと以外は実施例1と同様にして異方導電粒子2を得た。実施例1と同様の方法で異方導電粒子2の圧力を加える前の抵抗と50%扁平させた時の抵抗を測定し、結果を表1に示した。
実施例1で作製した異方導電粒子を分級して、平均粒径0.5μmの異方導電粒子3を得た。実施例1と同様の方法で異方導電粒子3の圧力を加える前の抵抗と50%扁平させた時の抵抗を測定し、結果を表1に示した。
実施例1で作製した異方導電粒子を分級して、平均粒径30μmの異方導電粒子4を得た。実施例1と同様の方法で異方導電粒子4の圧力を加える前の抵抗と50%扁平させた時の抵抗を測定し、結果を表1に示した。
実施例1にて使用した銀粉末2の配合量を20体積部にした以外は実施例1と同様にして異方導電粒子5を得た。実施例1と同様の方法で異方導電粒子5の圧力を加える前の抵抗と50%扁平させた時の抵抗を測定し、結果を表1に示した。
実施例1にて使用した銀粉末2の配合量を300体積部にした以外は実施例1と同様にして異方導電粒子6を得た。実施例1と同様の方法で異方導電粒子6の圧力を加える前の抵抗と50%扁平させた時の抵抗を測定し、結果を表1に示した。
実施例1にて使用した銀粉末1を分級し、平均粒径0.01μm、最大粒径0.03μmの燐片状銀粉末3を得た。この銀粉末3を使用した以外は実施例1と同様にして異方導電粒子7を得た。実施例1と同様の方法で異方導電粒子7の圧力を加える前の抵抗と50%扁平させた時の抵抗を測定し、結果を表1に示した。
実施例1にて使用した銀粉末1を分級し、平均粒径3.3μm、最大粒径4.95μmの燐片状銀粉末4を得た。この銀粉末4を使用した以外は実施例1と同様にして異方導電粒子8を得た。実施例1と同様の方法で異方導電粒子8の圧力を加える前の抵抗と50%扁平させた時の抵抗を測定し、結果を表1に示した。
導電性微粒子に平均粒径3μm、最大粒径4μmで不定形の黒鉛を使用した以外は実施例1と同様にして異方導電粒子9を得た。実施例1と同様の方法で異方導電粒子9の圧力を加える前の抵抗と50%扁平させた時の抵抗を測定し、結果を表1に示した。
導電性微粒子に平均粒径3μm、最大粒径4μmで針状の黒鉛を使用した以外は実施例1と同様にして異方導電粒子10を得た。実施例1と同様の方法で異方導電粒子10の圧力を加える前の抵抗と50%扁平させた時の抵抗を測定し、結果を表1に示した。
導電性微粒子に平均粒径1μm、最大粒径2μmで球状の金を使用した以外は実施例1と同様にして異方導電粒子11を得た。実施例1と同様の方法で異方導電粒子11の圧力を加える前の抵抗と50%扁平させた時の抵抗を測定し、結果を表1に示した。
シリコーンレジン(KR−242A:信越化学工業株式会社製)100体積部に対し、銀粉末2を120体積部添加し、ビーズミルを用いて48時間かけて銀粉末を分散させた。そこにさらに重合触媒CAT−AC(信越化学工業株式会社製)をシリコーンレジン100質量部に対して1質量部加えて10分間攪拌した。得られた導電性微粒子分散シリコーンレジンを、PETフィルムに塗工装置を用いて塗布し、120℃で1時間熱風乾燥することにより、厚み50μmのフィルム状導電性微粒子分散シリコーンレジンを得た。得られたフィルム状導電性微粒子分散シリコーンレジンを粉砕、次いで分級することで平均粒径5μmの異方導電粒子12を得た。実施例1と同様の方法で異方導電粒子12の圧力を加える前の抵抗と50%扁平させた時の抵抗を測定し、結果を表1に示した。
実施例1にて使用した銀粉末2の配合量を10体積部にした以外は実施例1と同様にして異方導電粒子13を得た。実施例1と同様の方法で異方導電粒子13の圧力を加える前の抵抗と50%扁平させた時の抵抗を測定し、結果を表1に示した。
実施例1にて使用した銀粉末2の配合量を400体積部にした以外は実施例1と同様にして異方導電粒子14を得た。実施例1と同様の方法で異方導電粒子14の圧力を加える前の抵抗と50%扁平させた時の抵抗を測定し、結果を表1に示した。
実施例1にて使用した銀粉末1を分級し、平均粒径3.9μm、最大粒径5.5μmの燐片状銀粉末5を得た。この銀粉末5を使用した以外は実施例1と同様にして異方導電粒子15を得た。実施例1と同様の方法で異方導電粒子15の圧力を加える前の抵抗と50%扁平させた時の抵抗を測定し、結果を表1に示した。
樹脂粒子にニッケル及び金をコーティングした導電性粒子(積水化学株式会社、製品名:ミクロパールAU)を比較例1の導電性粒子とした。実施例1と同様の方法で、この導電性粒子の圧力を加える前の抵抗と50%扁平させた時の抵抗を測定し、結果を表1に示した。
<絶縁粒子の作製>
4ツ口セパラブルカバー、攪拌翼、三方コック、冷却管及び温度プローブを取り付けた1000mL容セパラブルフラスコ中で、メタクリル酸メチル100mmol、N,N,N−トリメチル−N−2−メタクリロイルオキシエチルアンモニウムクロライド1mmol、2,2’−アゾビス(2−アミジノプロパン)二塩酸塩1mmolからなるモノマー組成物を固形分率が5質量%となるように蒸留水に加え、200rpmで攪拌し、窒素雰囲気下、70℃で24時間重合を行った。反応終了後、凍結乾燥して、表面にアンモニウム基を有する平均粒径220nmの絶縁粒子を得た。
平均粒径5μmのテトラメチロールメタンテトラアクリレート/ジビニルベンゼン共重合体からなるコア粒子に、脱脂、センシタイジング、アクチベイチングを行い樹脂表面にPd核を生成させ、無電解メッキの触媒核とした。次に、この触媒核を有する粒子を、所定の方法に従って建浴、加温した無電解Niメッキ浴に浸漬し、Niメッキ層を形成した。次に、ニッケル層の表面に無電解置換金メッキを行い、金属表面粒子を得た。得られた金属表面粒子のNiメッキの厚みは90nmであり、金メッキの厚みは30nmであった。
上記絶縁粒子を超音波照射下で蒸留水に分散させ、絶縁粒子の10質量%水分散液を得た。上記金属表面粒子10gを蒸留水500mLに分散させ、そこに絶縁粒子の水分散液4gを添加し、室温(25℃)で6時間攪拌した。3μmのメッシュフィルターで濾過後、更にメタノールで洗浄、乾燥し、絶縁粒子被覆導電性粒子を得た。実施例1と同様の方法で、得られた絶縁粒子被覆導電性粒子の圧力を加える前の抵抗と50%扁平させた時の抵抗を測定し、結果を表1に示した。
パラプレンP−25M(熱可塑性ポリウレタン樹脂、軟化点130℃、日本エラストラン株式会社製、商品名)の1質量%ジメチルホルムアミド(DMF)溶液に、比較例2で得られた金属表面粒子を添加して撹拌した。その後、得られた分散液をスプレードライヤ(ヤマト科学株式会社製、GA−32型)により100℃で10分間噴霧乾燥を行ない、絶縁樹脂被覆導電性粒子を得た。この時の絶縁樹脂からなる被覆層の平均厚みは、電子顕微鏡(SEM)による断面観察の結果、約1μmであった。実施例1と同様の方法で、得られた絶縁樹脂被覆導電性粒子の圧力を加える前の抵抗と50%扁平させた時の抵抗を測定し、結果を表1に示した。
Claims (16)
- 有機絶縁物質中に導電性微粒子を分散させた異方導電粒子。
- 異方導電粒子に圧力を加え、粒子直径から50%扁平させたときの抵抗が、前記圧力を加える前の異方導電粒子の抵抗の1/100以下である異方導電粒子。
- 有機絶縁物質中に導電性微粒子を分散させたものである、請求項2記載の異方導電粒子。
- 前記有機絶縁物質100体積部に前記導電性微粒子を20〜300体積部分散させたものである、請求項1又は3記載の異方導電粒子。
- 前記導電性微粒子の平均粒径が、異方導電粒子の平均粒径の0.0002〜0.6倍である、請求項1、3及び4のいずれか一項に記載の異方導電粒子。
- 前記導電性微粒子の最大粒径が、異方導電粒子の平均粒径の0.9倍以下である、請求項1及び3〜5のいずれか一項に記載の異方導電粒子。
- 前記導電性微粒子が、炭素材料からなる粒子である、請求項1及び3〜6のいずれか一項に記載の異方導電粒子。
- 前記炭素材料が、黒鉛である、請求項7記載の異方導電粒子。
- 前記炭素材料が、カーボンナノチューブである、請求項7記載の異方導電粒子。
- 前記導電性微粒子が、金属材料からなる粒子である、請求項1及び3〜6のいずれか一項に記載の異方導電粒子。
- 前記金属材料が、銀である、請求項10記載の異方導電粒子。
- 前記金属材料が、金である、請求項10記載の異方導電粒子。
- 前記導電性微粒子の形状が、燐片状である、請求項1、3〜7及び10のいずれか一項に記載の異方導電粒子。
- 前記導電性微粒子の形状が、針状である、請求項1、3〜7及び10のいずれか一項に記載の異方導電粒子。
- 前記導電性微粒子は、表面が疎水化処理されたものである、請求項1及び3〜14のいずれか一項に記載の異方導電粒子。
- 平均粒径が0.5〜30μmである、請求項1〜15のいずれか一項に記載の異方導電粒子。
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JP2016509087A (ja) * | 2012-12-21 | 2016-03-24 | ナノ−シー インコーポレーティッド | 除去可能な添加剤を用いた溶媒系および水系カーボンナノチューブインク |
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US9340697B2 (en) | 2009-08-14 | 2016-05-17 | Nano-C, Inc. | Solvent-based and water-based carbon nanotube inks with removable additives |
WO2016068127A1 (ja) * | 2014-10-28 | 2016-05-06 | デクセリアルズ株式会社 | 異方導電性フィルム及び接続構造体 |
CN105513673B (zh) * | 2016-02-03 | 2017-07-07 | 郑州职业技术学院 | 一种导电粒子及其制备方法 |
US20190077072A1 (en) * | 2017-09-11 | 2019-03-14 | Duke University | Three-dimensional (3d) printing and injection molding conductive filaments and methods of producing and using the same |
US11976178B2 (en) * | 2017-10-24 | 2024-05-07 | The Boeing Company | Compositions with coated carbon fibers and methods for manufacturing compositions with coated carbon fibers |
CN111100531A (zh) * | 2019-12-13 | 2020-05-05 | 江苏艾德卡建材科技有限公司 | 一种水性环氧防静电地坪底、中涂涂料及其施工工艺 |
CN113990557B (zh) * | 2021-09-09 | 2024-03-29 | 山西聚微天成科技有限公司 | 一种高导电性和高拉伸性弹性体的制备方法及其应用 |
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CN103548207A (zh) * | 2011-05-18 | 2014-01-29 | 日立化成株式会社 | 电路连接材料、电路部件的连接结构以及电路部件的连接结构的制造方法 |
JP2016509087A (ja) * | 2012-12-21 | 2016-03-24 | ナノ−シー インコーポレーティッド | 除去可能な添加剤を用いた溶媒系および水系カーボンナノチューブインク |
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EP2426672A1 (en) | 2012-03-07 |
TWI436375B (zh) | 2014-05-01 |
KR20120005004A (ko) | 2012-01-13 |
WO2010125966A1 (ja) | 2010-11-04 |
KR101457756B1 (ko) | 2014-11-03 |
JP5234048B2 (ja) | 2013-07-10 |
CN102396038A (zh) | 2012-03-28 |
EP2426672A4 (en) | 2012-12-12 |
TW201115595A (en) | 2011-05-01 |
CN102396038B (zh) | 2014-03-12 |
US20120097902A1 (en) | 2012-04-26 |
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