JP2010272835A5 - - Google Patents

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Publication number
JP2010272835A5
JP2010272835A5 JP2009151841A JP2009151841A JP2010272835A5 JP 2010272835 A5 JP2010272835 A5 JP 2010272835A5 JP 2009151841 A JP2009151841 A JP 2009151841A JP 2009151841 A JP2009151841 A JP 2009151841A JP 2010272835 A5 JP2010272835 A5 JP 2010272835A5
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JP
Japan
Prior art keywords
conductor particles
porous film
wiring board
particle diameter
average particle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2009151841A
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English (en)
Japanese (ja)
Other versions
JP5426246B2 (ja
JP2010272835A (ja
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Publication date
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Priority to JP2009151841A priority Critical patent/JP5426246B2/ja
Priority claimed from JP2009151841A external-priority patent/JP5426246B2/ja
Publication of JP2010272835A publication Critical patent/JP2010272835A/ja
Publication of JP2010272835A5 publication Critical patent/JP2010272835A5/ja
Application granted granted Critical
Publication of JP5426246B2 publication Critical patent/JP5426246B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009151841A 2009-04-23 2009-06-26 配線板、およびその製造方法 Expired - Fee Related JP5426246B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009151841A JP5426246B2 (ja) 2009-04-23 2009-06-26 配線板、およびその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009105273 2009-04-23
JP2009105273 2009-04-23
JP2009151841A JP5426246B2 (ja) 2009-04-23 2009-06-26 配線板、およびその製造方法

Publications (3)

Publication Number Publication Date
JP2010272835A JP2010272835A (ja) 2010-12-02
JP2010272835A5 true JP2010272835A5 (zh) 2012-07-12
JP5426246B2 JP5426246B2 (ja) 2014-02-26

Family

ID=43420592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009151841A Expired - Fee Related JP5426246B2 (ja) 2009-04-23 2009-06-26 配線板、およびその製造方法

Country Status (1)

Country Link
JP (1) JP5426246B2 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013021750A1 (ja) * 2011-08-11 2013-02-14 古河電気工業株式会社 配線基板およびその製造方法ならびに半導体装置
US10446412B2 (en) 2015-04-13 2019-10-15 Printcb Ltd. Printing of multi-layer circuits

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4042497B2 (ja) * 2002-04-15 2008-02-06 セイコーエプソン株式会社 導電膜パターンの形成方法、配線基板、電子デバイス、電子機器、並びに非接触型カード媒体
JP2005229106A (ja) * 2004-01-15 2005-08-25 Ｎｅｘｔ Ｉ＆Ｄ株式会社 回路描画用の導電性材料
KR100633846B1 (ko) * 2005-03-23 2006-10-13 삼성전기주식회사 도전성 배선재료, 배선기판의 제조방법 및 배선기판
KR100768341B1 (ko) * 2005-11-09 2007-10-17 주식회사 나노신소재 금속성 잉크, 그리고 이를 이용한 전극형성방법 및 기판

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