JP5426246B2 - 配線板、およびその製造方法 - Google Patents

配線板、およびその製造方法 Download PDF

Info

Publication number
JP5426246B2
JP5426246B2 JP2009151841A JP2009151841A JP5426246B2 JP 5426246 B2 JP5426246 B2 JP 5426246B2 JP 2009151841 A JP2009151841 A JP 2009151841A JP 2009151841 A JP2009151841 A JP 2009151841A JP 5426246 B2 JP5426246 B2 JP 5426246B2
Authority
JP
Japan
Prior art keywords
conductor particles
porous film
particles
wiring board
porous membrane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009151841A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010272835A (ja
JP2010272835A5 (zh
Inventor
貴之 広瀬
法人 塚原
智博 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2009151841A priority Critical patent/JP5426246B2/ja
Publication of JP2010272835A publication Critical patent/JP2010272835A/ja
Publication of JP2010272835A5 publication Critical patent/JP2010272835A5/ja
Application granted granted Critical
Publication of JP5426246B2 publication Critical patent/JP5426246B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2009151841A 2009-04-23 2009-06-26 配線板、およびその製造方法 Expired - Fee Related JP5426246B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009151841A JP5426246B2 (ja) 2009-04-23 2009-06-26 配線板、およびその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009105273 2009-04-23
JP2009105273 2009-04-23
JP2009151841A JP5426246B2 (ja) 2009-04-23 2009-06-26 配線板、およびその製造方法

Publications (3)

Publication Number Publication Date
JP2010272835A JP2010272835A (ja) 2010-12-02
JP2010272835A5 JP2010272835A5 (zh) 2012-07-12
JP5426246B2 true JP5426246B2 (ja) 2014-02-26

Family

ID=43420592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009151841A Expired - Fee Related JP5426246B2 (ja) 2009-04-23 2009-06-26 配線板、およびその製造方法

Country Status (1)

Country Link
JP (1) JP5426246B2 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5367914B2 (ja) * 2011-08-11 2013-12-11 古河電気工業株式会社 配線基板およびその製造方法ならびに半導体装置
US10446412B2 (en) 2015-04-13 2019-10-15 Printcb Ltd. Printing of multi-layer circuits

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4042497B2 (ja) * 2002-04-15 2008-02-06 セイコーエプソン株式会社 導電膜パターンの形成方法、配線基板、電子デバイス、電子機器、並びに非接触型カード媒体
JP2005229106A (ja) * 2004-01-15 2005-08-25 Ｎｅｘｔ Ｉ＆Ｄ株式会社 回路描画用の導電性材料
KR100633846B1 (ko) * 2005-03-23 2006-10-13 삼성전기주식회사 도전성 배선재료, 배선기판의 제조방법 및 배선기판
KR100768341B1 (ko) * 2005-11-09 2007-10-17 주식회사 나노신소재 금속성 잉크, 그리고 이를 이용한 전극형성방법 및 기판

Also Published As

Publication number Publication date
JP2010272835A (ja) 2010-12-02

Similar Documents

Publication Publication Date Title
US7329458B2 (en) Wiring member and method of manufacturing the same
KR101697055B1 (ko) 금속 구리막 및 그 제조 방법, 금속 구리 패턴 및 그것을 이용한 도체 배선, 금속 구리 범프, 열전도로, 접합재, 및 액상(液狀) 조성물
CN109786352B (zh) 微器件在系统基板中的粘合结构与粘合工艺
US9258903B2 (en) Wiring circuit board and manufacturing method thereof
JP5497347B2 (ja) 配線基板
WO2009014391A2 (en) Preparation method of electroconductive copper patterning layer by laser irradiation
CN101553084B (zh) 线路基板及线路基板的制作方法
KR20070017096A (ko) 기판 및 그 제조방법
TWI383950B (zh) 奈米點狀材料的形成方法
KR101489206B1 (ko) 도금층을 포함하는 양면 연성 인쇄회로기판 및 이의 제조방법
WO2016039314A1 (ja) プリント配線板用基材、プリント配線板及びプリント配線板用基材の製造方法
JP5426246B2 (ja) 配線板、およびその製造方法
KR101520412B1 (ko) 레이저와 인쇄방식이 하이브리드된 플렉서블 기판 및 이의 제조 방법
CN102918937B (zh) 印刷电路板以及该印刷电路板的制造方法
JP5495044B2 (ja) 緻密な金属銅膜の製造方法及びそれに用いる液状組成物、それから得られる緻密な金属銅膜、導体配線、熱伝導路、接合体
CN111512710B (zh) 印刷线路板用基材和印刷线路板
JP2005057139A (ja) 多層配線基板とその製造方法
JP2005203484A (ja) 導電回路装置および導電回路装置の製造方法
US20140083753A1 (en) Method of forming copper wiring, method of manufacturing wiring board, and wiring board
KR20090009709A (ko) 측면 배선의 형성 방법
US10905013B2 (en) Printed wiring board and method for manufacturing the same
JP5316227B2 (ja) コンデンサ、配線基板およびそれらの製造方法
JP2010251446A (ja) 配線板、およびその製造方法
WO2023047671A1 (ja) 印刷回路基板の製造方法および導電下地層形成方法
EP2690938A1 (en) Method for forming copper wiring, method for manufacturing wiring substrate, and wiring substrate

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120523

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120523

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130410

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130418

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130617

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20131107

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20131128

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees