JP2010267695A5 - - Google Patents
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- Publication number
- JP2010267695A5 JP2010267695A5 JP2009116316A JP2009116316A JP2010267695A5 JP 2010267695 A5 JP2010267695 A5 JP 2010267695A5 JP 2009116316 A JP2009116316 A JP 2009116316A JP 2009116316 A JP2009116316 A JP 2009116316A JP 2010267695 A5 JP2010267695 A5 JP 2010267695A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- semiconductor device
- insulating film
- via hole
- silicide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 19
- 229910021332 silicide Inorganic materials 0.000 claims 8
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims 8
- 230000004888 barrier function Effects 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 3
- 239000003870 refractory metal Substances 0.000 claims 3
- 229910052715 tantalum Inorganic materials 0.000 claims 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 3
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims 3
- 239000010936 titanium Substances 0.000 claims 3
- 229910052719 titanium Inorganic materials 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 claims 2
- 229910021417 amorphous silicon Inorganic materials 0.000 claims 1
- 239000010941 cobalt Substances 0.000 claims 1
- 229910017052 cobalt Inorganic materials 0.000 claims 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- RUFLMLWJRZAWLJ-UHFFFAOYSA-N nickel silicide Chemical compound [Ni]=[Si]=[Ni] RUFLMLWJRZAWLJ-UHFFFAOYSA-N 0.000 claims 1
- 229910021334 nickel silicide Inorganic materials 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 1
- 229920005591 polysilicon Polymers 0.000 claims 1
- 229910021341 titanium silicide Inorganic materials 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
- WQJQOUPTWCFRMM-UHFFFAOYSA-N tungsten disilicide Chemical compound [Si]#[W]#[Si] WQJQOUPTWCFRMM-UHFFFAOYSA-N 0.000 claims 1
- 229910021342 tungsten silicide Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009116316A JP5462524B2 (ja) | 2009-05-13 | 2009-05-13 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009116316A JP5462524B2 (ja) | 2009-05-13 | 2009-05-13 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010267695A JP2010267695A (ja) | 2010-11-25 |
| JP2010267695A5 true JP2010267695A5 (enrdf_load_stackoverflow) | 2012-04-12 |
| JP5462524B2 JP5462524B2 (ja) | 2014-04-02 |
Family
ID=43364445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009116316A Expired - Fee Related JP5462524B2 (ja) | 2009-05-13 | 2009-05-13 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5462524B2 (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5810693B2 (ja) * | 2011-07-08 | 2015-11-11 | 富士通株式会社 | 電子デバイス及びその製造方法 |
| JP2014011438A (ja) | 2012-07-03 | 2014-01-20 | Toshiba Corp | 半導体装置およびその製造方法 |
| JP5917321B2 (ja) * | 2012-07-12 | 2016-05-11 | 株式会社東芝 | 半導体装置及びその製造方法 |
| JP6468071B2 (ja) * | 2015-05-25 | 2019-02-13 | 富士通株式会社 | 半導体装置及び電子装置並びに半導体装置の製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005109347A (ja) * | 2003-10-01 | 2005-04-21 | Seiko Epson Corp | 半導体装置および半導体装置の製造方法 |
| JP2005276877A (ja) * | 2004-03-23 | 2005-10-06 | Sanyo Electric Co Ltd | 半導体装置およびその製造方法 |
| JP4373866B2 (ja) * | 2004-07-16 | 2009-11-25 | 三洋電機株式会社 | 半導体装置の製造方法 |
-
2009
- 2009-05-13 JP JP2009116316A patent/JP5462524B2/ja not_active Expired - Fee Related
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