JP2010260925A5 - - Google Patents
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- Publication number
- JP2010260925A5 JP2010260925A5 JP2009111508A JP2009111508A JP2010260925A5 JP 2010260925 A5 JP2010260925 A5 JP 2010260925A5 JP 2009111508 A JP2009111508 A JP 2009111508A JP 2009111508 A JP2009111508 A JP 2009111508A JP 2010260925 A5 JP2010260925 A5 JP 2010260925A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- epoxy
- adhesive resin
- adhesive
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004840 adhesive resin Substances 0.000 claims description 13
- 229920006223 adhesive resin Polymers 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 13
- 239000004593 Epoxy Substances 0.000 claims description 11
- 239000000178 monomer Substances 0.000 claims description 8
- 229920001577 copolymer Polymers 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000013034 phenoxy resin Substances 0.000 claims description 4
- 229920006287 phenoxy resin Polymers 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 229920006122 polyamide resin Polymers 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 3
- 229910052698 phosphorus Inorganic materials 0.000 claims 3
- 239000011574 phosphorus Substances 0.000 claims 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical class CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims 1
- -1 acryl glycidyl ester Chemical class 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000003063 flame retardant Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 239000011342 resin composition Substances 0.000 claims 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009111508A JP5792924B2 (ja) | 2009-04-30 | 2009-04-30 | 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板 |
| US13/318,304 US20120048598A1 (en) | 2009-04-30 | 2010-03-26 | Adhesive resin composition, and laminate and flexible printed wiring board using the same |
| KR1020117022379A KR20120022736A (ko) | 2009-04-30 | 2010-03-26 | 접착성 수지 조성물, 및 이것을 이용한 적층체 및 플렉시블 인쇄 배선판 |
| CN201080018879.2A CN102414288B (zh) | 2009-04-30 | 2010-03-26 | 胶粘性树脂组合物、以及使用其的层压体和柔性印刷线路板 |
| PCT/JP2010/055317 WO2010125880A1 (ja) | 2009-04-30 | 2010-03-26 | 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板 |
| TW099113406A TW201043677A (en) | 2009-04-30 | 2010-04-28 | Adhesive resin composition, layered product using the same, and flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009111508A JP5792924B2 (ja) | 2009-04-30 | 2009-04-30 | 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010260925A JP2010260925A (ja) | 2010-11-18 |
| JP2010260925A5 true JP2010260925A5 (enExample) | 2012-04-26 |
| JP5792924B2 JP5792924B2 (ja) | 2015-10-14 |
Family
ID=43032032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009111508A Active JP5792924B2 (ja) | 2009-04-30 | 2009-04-30 | 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20120048598A1 (enExample) |
| JP (1) | JP5792924B2 (enExample) |
| KR (1) | KR20120022736A (enExample) |
| CN (1) | CN102414288B (enExample) |
| TW (1) | TW201043677A (enExample) |
| WO (1) | WO2010125880A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5978782B2 (ja) * | 2012-06-06 | 2016-08-24 | デクセリアルズ株式会社 | 熱硬化性接着組成物、熱硬化性接着シート及び補強フレキシブルプリント配線板 |
| KR102375986B1 (ko) * | 2015-03-13 | 2022-03-17 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 옥사졸리돈 고리 함유 에폭시 수지, 그 제조 방법, 에폭시 수지 조성물, 및 경화물 |
| JP6142961B1 (ja) * | 2016-03-08 | 2017-06-07 | 東洋インキＳｃホールディングス株式会社 | 積層体およびその製造方法、並びに接着層付樹脂フィルム |
| CN105733485B (zh) * | 2016-04-28 | 2018-06-05 | 陕西生益科技有限公司 | 一种树脂组合物及其应用 |
| US10597559B2 (en) | 2016-06-06 | 2020-03-24 | Crane Composites, Inc. | Method of manufacturing a composite panel containing lauan or other moisture-carrying or moisture-absorbing material using adhesion promoter and panel made using the method |
| JP7249837B2 (ja) * | 2019-03-22 | 2023-03-31 | 旭化成株式会社 | 難燃性メタクリル系樹脂組成物及び成形体 |
| WO2020201327A1 (en) * | 2019-04-03 | 2020-10-08 | Solvay Specialty Polymers Usa, Llc | Polyamides and corresponding polymer compositions and articles |
| JP6987824B2 (ja) * | 2019-10-25 | 2022-01-05 | 矢崎総業株式会社 | 通信ケーブル及びワイヤハーネス |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0249087A (ja) * | 1988-08-11 | 1990-02-19 | Toray Ind Inc | 接着剤組成物 |
| US4868244A (en) * | 1988-12-27 | 1989-09-19 | General Electric Company | Low-gloss carbonate polymer blends |
| DE69215147T2 (de) * | 1991-06-12 | 1997-03-06 | Tonen Corp | Thermoplastische Harzzusammensetzung |
| US5965269A (en) * | 1995-04-04 | 1999-10-12 | Hitachi Chemical Company, Ltd. | Adhesive, adhesive film and adhesive-backed metal foil |
| JP4665298B2 (ja) * | 2000-08-25 | 2011-04-06 | 東レ株式会社 | 半導体装置用接着剤付きテープおよびそれを用いた銅張り積層板、半導体接続用基板ならびに半導体装置 |
| JP4109863B2 (ja) * | 2001-12-12 | 2008-07-02 | 東海ゴム工業株式会社 | フレキシブル印刷配線板用難燃性接着剤組成物およびそれを用いたフレキシブル印刷配線板 |
| JP2004115612A (ja) * | 2002-09-25 | 2004-04-15 | Hitachi Chem Co Ltd | 接着剤組成物 |
| JP4238124B2 (ja) * | 2003-01-07 | 2009-03-11 | 積水化学工業株式会社 | 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体 |
| JP2009041019A (ja) * | 2003-01-07 | 2009-02-26 | Sekisui Chem Co Ltd | 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体 |
| JP3685791B2 (ja) * | 2003-08-08 | 2005-08-24 | 日東電工株式会社 | 鋼板用貼着シート |
| JP4991210B2 (ja) * | 2005-08-24 | 2012-08-01 | 東洋インキＳｃホールディングス株式会社 | 樹脂組成物の水性分散体の製造方法及びエマルジョン型接着剤 |
| JP4976380B2 (ja) * | 2006-04-03 | 2012-07-18 | 三井化学株式会社 | 金属積層体 |
| JP2008258429A (ja) * | 2007-04-05 | 2008-10-23 | Sekisui Chem Co Ltd | 絶縁フィルム、電子部品装置の製造方法及び電子部品装置 |
| JP5150361B2 (ja) * | 2007-05-17 | 2013-02-20 | 株式会社フジクラ | エポキシ系接着剤、カバーレイ、プリプレグ、金属張積層板、プリント配線基板 |
| JP2009132879A (ja) * | 2007-11-02 | 2009-06-18 | Toray Ind Inc | 接着剤組成物およびそれを用いたカバーレイフィルム |
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2009
- 2009-04-30 JP JP2009111508A patent/JP5792924B2/ja active Active
-
2010
- 2010-03-26 KR KR1020117022379A patent/KR20120022736A/ko not_active Withdrawn
- 2010-03-26 WO PCT/JP2010/055317 patent/WO2010125880A1/ja not_active Ceased
- 2010-03-26 CN CN201080018879.2A patent/CN102414288B/zh active Active
- 2010-03-26 US US13/318,304 patent/US20120048598A1/en not_active Abandoned
- 2010-04-28 TW TW099113406A patent/TW201043677A/zh unknown