JP2010258301A5 - - Google Patents

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Publication number
JP2010258301A5
JP2010258301A5 JP2009108269A JP2009108269A JP2010258301A5 JP 2010258301 A5 JP2010258301 A5 JP 2010258301A5 JP 2009108269 A JP2009108269 A JP 2009108269A JP 2009108269 A JP2009108269 A JP 2009108269A JP 2010258301 A5 JP2010258301 A5 JP 2010258301A5
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JP
Japan
Prior art keywords
interposer
main body
chip
body portion
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009108269A
Other languages
English (en)
Japanese (ja)
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JP2010258301A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009108269A priority Critical patent/JP2010258301A/ja
Priority claimed from JP2009108269A external-priority patent/JP2010258301A/ja
Publication of JP2010258301A publication Critical patent/JP2010258301A/ja
Publication of JP2010258301A5 publication Critical patent/JP2010258301A5/ja
Pending legal-status Critical Current

Links

JP2009108269A 2009-04-27 2009-04-27 インターポーザ及び半導体装置 Pending JP2010258301A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009108269A JP2010258301A (ja) 2009-04-27 2009-04-27 インターポーザ及び半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009108269A JP2010258301A (ja) 2009-04-27 2009-04-27 インターポーザ及び半導体装置

Publications (2)

Publication Number Publication Date
JP2010258301A JP2010258301A (ja) 2010-11-11
JP2010258301A5 true JP2010258301A5 (enExample) 2012-04-12

Family

ID=43318855

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009108269A Pending JP2010258301A (ja) 2009-04-27 2009-04-27 インターポーザ及び半導体装置

Country Status (1)

Country Link
JP (1) JP2010258301A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6263859B2 (ja) * 2013-04-18 2018-01-24 大日本印刷株式会社 貫通電極基板の製造方法、貫通電極基板、および半導体装置
CN211606926U (zh) 2017-10-03 2020-09-29 株式会社村田制作所 内插器以及电子设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4908258A (en) * 1988-08-01 1990-03-13 Rogers Corporation High dielectric constant flexible sheet material
JP3696341B2 (ja) * 1996-08-30 2005-09-14 ローム株式会社 アレイ型固体電解コンデンサの構造及びその製造方法
JP4545889B2 (ja) * 2000-06-09 2010-09-15 富士通株式会社 回路基板及びその製造方法並びに半導体装置
JP2005150490A (ja) * 2003-11-18 2005-06-09 Canon Inc Ｉｃとプリント配線基板間のシート部品
JP4338545B2 (ja) * 2004-02-19 2009-10-07 富士通株式会社 コンデンサシート
JP2009049087A (ja) * 2007-08-16 2009-03-05 Panasonic Corp 電子部品と電子部品の製造方法

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