CN104185357A - 一种电路板 - Google Patents

一种电路板 Download PDF

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CN104185357A
CN104185357A CN201410195473.1A CN201410195473A CN104185357A CN 104185357 A CN104185357 A CN 104185357A CN 201410195473 A CN201410195473 A CN 201410195473A CN 104185357 A CN104185357 A CN 104185357A
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circuit
insulator
circuit board
exposed
welding resisting
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CN104185357B (zh
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王忠宝
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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Abstract

一种线路埋在绝缘体内的电路板，令线路下表面的一部分以及线路上表面裸露于绝缘体外，并令线路下表面的一部分受绝缘体包覆，使线路下表面不需设置防焊层，使电路板可达到降少成本及厚度的功效。

Description

一种电路板
技术领域
本发明涉及一种电路板及其应用，尤其是指线路被绝缘体包覆，并令线路下表面的一部分裸露于绝缘体外的结构。
背景技术
如图9所示，为现有技术的电路板52的剖面图，该电路板52具有：一绝缘体40，该绝缘体40由FR-4或BT(Bismaleimide Triazine)等不同的环氧树脂(epoxy)制成，并具有盲孔(blind via)44、上表面41及下表面42，该盲孔44是供设置线路(7A)用；一球垫(ball land)7B，球垫7B由铜金属制成且供对外电连接用，并具有侧边7B3、上表面7B1及下表面7B2，其中，下表面7B2的一部分及侧边7B3被绝缘体40包覆，并令下表面7B2的一部分裸露于绝缘体40盲孔44中，而上表面7B1裸露于绝缘体40下表面42外的大气中；一线路7A，线路7A由铜金属制成且实施为传输电性的管道，并具有侧边7A3、上表面7A1及下表面7A2，其中，下表面7A2与绝缘体40的上表面41接合，且线路7A的一部分设位在绝缘体40盲孔44中，据此，令线路7A与裸露于绝缘体40盲孔44中的球垫7B接合，使线路7A与球垫7B得以电连通；一防焊层(solder mask)80，防焊层80设置在绝缘体40上表面41并覆盖线路7A的一部分，而未被防焊层80覆盖的线路7A是裸露于大气中；导电层90，导电层90通常实施为镍或金或银等贵重金属，该导电层90设置在裸露大气中的线路7A上表面7A1、侧边7A3，以及球垫7B上表面7B1；由上述说明得知以下四特征，首先是自绝缘体40上表面41到下表面42的电性传输路径，该路径是自线路7A上表面7A1经过绝缘体40盲孔44，然后传输到球垫7B的上表面7B1，其次是防焊层80的厚度Ta，该厚度Ta是由厚度T81及厚度T82组成，其中，厚度T81是覆盖线路7A侧边7A3的厚度，而厚度T82是覆盖在线路7A上表面7A1上的厚度，上述二特征均使电路板52厚度T52无法有效的被降低，再其次是导电层90的面积，该面积是包含设置在线路7A侧边7A3的导电层，最后是绝缘体40下表面42无防焊层，令球垫7B仅能供对外电连通的端点用，如供锡球的接合用，而不适于供传输电性的管道用，使球垫7B无法在绝缘体40下表面42自由的布置，因为，无防焊层易使裸露在大气中的球垫7B造成氧化及短路的损坏，同时，球垫7B与绝缘体40结合后，球垫7B的宽度W就已被固定而不易被改变，使电路板52不易弹性的被使用，如：当锡球体积不变，且需缩小锡球的高度时，可藉加大球垫7B宽度W就能达到缩小锡球高度的需求，但球垫7B的宽度W无法再加大，令锡球与球垫7B接合后，无法达到缩小锡球高度的要求而无法被使用。
发明内容
鉴于现有技术的电路板的厚度不易减薄，可由新的电路板结构达到减薄的需求，该新的结构是：提供一具有球垫及传输电性管道功效的线路，该线路埋在绝缘体内，其中，线路下表面的一部分及上表面未被绝缘体包覆，而裸露于绝缘体的上表面或下表面，同时，令线路上表面裸露于绝缘体上表面，且被绝缘体包覆的线路下表面及相对应线路上表面的部分，则实施为传输电性的管道，并令裸露于绝缘体下表面的线路实施为球垫，据此，藉线路埋在绝缘体内，且绝缘体不需设置盲孔，以及不需设置另一球垫的特征，使该新结构的电路板具有降低成本及厚度的功效。
本发明第一方面提供一种电路板，该电路板至少包含有：
一绝缘体，绝缘体具有开孔、上表面及下表面；一线路，线路具有侧边、上表面及下表面，且下表面是由第一下表面及第二下表面组成，该线路埋在绝缘体内，其中，线路上表面裸露于绝缘体上表面外的大气中，以供与外界物质电连接用，而线路侧边的至少一部分及第一下表面被绝缘体包覆，并令线路第二下表面设位在绝缘体开孔内，且裸露于绝缘体下表面外的大气中，以供与外界物质电连接用。
优选地，所述线路的第二下表面与第一下表面不是位于相同的平面，据此，线路更是包含有第二侧边，该第二侧边设位于第一下表面与第二下表面二者间并裸露于绝缘体开孔内。
优选地，所述线路第二下表面呈非平面的形状。
优选地，还包含一另一线路，该另一线路贴附在绝缘体的下表面。
优选地，所述线路上表面是凹设并裸露于绝缘体上表面外。
优选地，所述线路侧边是由第一侧边及第三侧边组成，且第三侧边未被绝缘体包覆而裸露于绝缘体上表面，并令线路上表面至少一部分是凸出于绝缘体上表面。
优选地，所述线路还包含一延伸部，该延伸部具有上表面及下表面，且延伸部下表面与绝缘体上表面接合。
优选地，还包含一防焊层，该防焊层与绝缘体的上表面或下表面接合，并令线路的至少一部分裸露于大气中。
优选地，还包含一塑料结构，该塑料结构至少与防焊层的一部分接合。
优选地，还至少包含一导电层，该导电层设置在线路上表面或第二下表面，并令导电层上表面是裸露在大气中。
优选地，该外界物质实施为导电凸块或导线或锡球或电阻或电容。
本发明第二方面提供一种电路板，该电路板至少包含有：
一绝缘体，绝缘体具有上表面及下表面；一线路，线路具有侧边、上表面及下表面，该线路埋在绝缘体内，其中，线路侧边是由第一侧边及第三侧边组成，且第一侧边及下表面均被绝缘体包覆，并令未被绝缘体包覆的线路上表面，以及第三侧边裸露并凸出于绝缘体上表面外的大气中，以供与外界物质电连接用；一防焊层，该防焊层与绝缘体的上表面接合，并令线路的至少一部分裸露于大气中。
优选地，线路的第一侧边及第三侧边不是位于相同的水平面。
附图说明
图1：电路板具一线路的剖面图。
图2：电路板线路具有第二侧边的剖面图。
图3：电路板绝缘体下表面具有线路的剖面图。
图4：电路板线路下表面具有防焊层的剖面图。
图5～6：电路板线路上表面凸出于绝缘体表面的剖面图。
图7：电路板线路具有延伸部的剖面图。
图8：电路板与芯片结合的剖面图。
图9：现有技术的电路板具二线路的剖面图。
20              芯片                 30                构装体
40              绝缘体               41、71、741       上表面
42、72、742     下表面               44                盲孔
48              开孔                 50、52、55        电路板
60              塑料结构             70、7A、75        线路
711             第一上表面           712               第二上表面
721             第一下表面           722               第二下表面
724             浅坑                 73、7A3、7B3      侧边
731             第一侧边             732               第二侧边
733             第三侧边             74                延伸部
7A1、7B1        上表面               7A2、7B2          下表面
7B              球垫                 80                防焊层
90              导电层               95                导线
96              锡球                 W                 宽度
T4、T50、T52、T8、T81、T82、Ta       厚度
具体实施方式
以下结合具体实施例对上述方案做进一步说明。应理解，这些实施例是用于说明本发明而不限于限制本发明的范围。实施例中采用的实施条件可以根据具体厂家的条件做进一步调整，未注明的实施条件通常为常规实验中的条件。
如图1所示，是电路板50的剖面图，该电路板50具有：一绝缘体40，绝缘体40由FR-4或BT等不同的环氧树脂制成，或由其他适用的绝缘体制成，并具有开孔48、上表面41及下表面42；一线路70，线路70由铜或镍或铝或其他适用的导体制成，并具有侧边73、上表面71及下表面72，且下表面72是由第一下表面721及第二下表面722组成，并令第二下表面722与第一下表面721位于相同的水平面(co-planar)，该线路70埋在绝缘体40内，其中，线路70上表面71裸露于绝缘体40上表面41外的大气中，以供与外界物质电(性)连接用，而第一下表面721及侧边73均被绝缘体40包覆，并令第二下表面722设位在绝缘体40开孔48内，且裸露于绝缘体40下表面42外的大气中，以供与外界物质电连接用，同时，线路70第一下表面721与相对应的上表面71的部分，是可实施为传输电性的管道用，而第二下表面722是可实施为对外电连接的球垫，据此，一线路70同时具备传输电性及球垫的功效；一防焊层80，该防焊层80设位在绝缘体40上表面41，并覆盖线路70上表面71的一部分，用以防止线路70氧化或短路的损坏，同时，令线路70未被防焊层80覆盖的部分裸露于大气中，以供与外界物质电连接用，其中，上述的外界物质是依需求实施为：锡球、导线、导电层、电阻、电容或另一线路(参阅图3说明)等，另外，可依需求令电路板50不设置防焊层80；二导电层90，该二导电层90个别接合于线路70上表面71及第二下表面722，以供与导线、导电凸块、锡球、电阻或电容等电连接用，其中，该二导电层90可依需求，是由多金属介质层或仅由一金属介质层组成，兹举接合于线路70第二下表面722的导电层90为例，说明如下：1)由多金属介质层组成时：若导电层90是由二金属介质层组成，可令导电层90是由镍及金(或银)二金属介质层组成，该镍及金是堆栈设置在一起，并令镍的下表面是实施为导电层90下表面(未标示)，及金的上表面是实施为导电层90的上表面(未标示)，该导电层90下表面接合于线路70第二下表面722，据此，令导电层90上表面是裸露在大气中，若导电层90是由三金属介质层组成，可令导电层90是由镍、钯及金三金属介质层组成，该镍、钯及金是堆栈设置在一起，据此，令钯是位于镍与金二者间，并令镍的下表面实施为导电层90下表面(未标示)，及金的上表面实施为导电层90的上表面(未标示)，该导电层90下表面接合于线路70第二下表面722，据此，令导电层90上表面是裸露在大气中，另外，金、银及钯均为贵重金属，因此，导电层90的面积是越小越好，用以降低成本；2).由单一金属介质层组成时：若导电层90是由一锡介质层组成，该锡的下表面是实施导电层90下表面(未标示)，及锡的上表面是实施为导电层90的上表面(未标示)，导电层90下表面接合于线路70第二下表面722，据此，令导电层90上表面是裸露在大气中；由上述说明得知电路板50的四特征，并分别与现有技术电路板52比较，用以说明本发明的优点，首先是自绝缘体40上表面41到下表面42的电性传输路径，该路径是自线路70上表面71直接传输到第二下表面722，不需经过如现有技术电路板52所示的盲孔44及球垫7B，使该传输路径更短，且因为无盲孔及另一球垫的部件，使电路板50厚度T50得以比现有技术电路板52的厚度T52更薄，其次是防焊层80的厚度T8，由于线路70埋在绝缘体40内，使防焊层80不需覆盖线路70的侧边73，令防焊层80的厚度T8比现有技术电路板52的防焊层80厚度Ta更薄，使电路板50具更低的材料成本及厚度，再其次是导电层90的面积，因为线路70侧边73埋在绝缘体40内，使线路70侧边73不需设置导电层，并使电路板50的导电层90的面积，得以比现有技术电路板52的导电层90面积更小，进而达到降低成本的功效，最后是防焊层，虽然电路板50绝缘体40下表面42亦无防焊层，但是，依据不同锡球高度的要求，可藉改变线路70第二下表面722的宽度W，用以满足锡球高度的要求，使电路板50比现有技术电路板52更弹性的被使用，如：当锡球体积不变，但要缩小锡球的高度时，则可于线路70与绝缘体40结合后，依据锡球的高度开设一较大的绝缘体40开孔48，使电路板50具有一较大的线路70第二下表面722，用以达到降低锡球高度的需求。
如图2所示，是电路板55的剖面图，且该电路板55与图1电路板50所示的绝缘体40、线路70、导电层90及防焊层80的特征及符号均相同，相同处请参阅图1的说明，其二不同处是：线路70的上表面71，藉移除上表面71的一部分，使绝缘体40的上表面41与线路70上表面71不是位于相同的平面，且线路70上表面71是凹设于绝缘体40上表面41；线路70的第二下表面722，藉移除第二下表面722的一部分，使第二下表面722与第一下表面721不是位于相同的平面，令线路70具有第二侧边732，该第二侧边732设位于第一下表面721与第二下表面722之间，并裸露于设位在绝缘体40下表面42的开孔48内；由上述说明可知，当线路70第二下表面722与导电层90或另一线路(参阅图3)等导电的物质，或与防焊层(参阅图4)等非导电的物质接合时，能藉线路70第二侧边732而提升与该物质的接合面积，进而提升与该物质的接合强度及质量，另外，导电层90可依绝缘体40开孔48深度(未标示)的不同，令导电层90是凹设或凸出于绝缘体40的上表面41或下表面42，以供对外界物质电连通用。
如图3所示，是电路板50的剖面图，且该电路板50与图2电路板55所示的绝缘体40、线路70及防焊层80的特征及符号均相同，相同处请参阅图2的说明，其不同处是：增设另一线路75，该另一线路75贴附在绝缘体40下表面42，并能在下表面42自由的延伸，且另一线路75的一部分设置在绝缘体40开孔48内，与线路70第二下表面722及第二侧边732接合，藉由第二侧边732而增加了线路70与另一线路75的接合面积及强度，令线路70与另一线路75之间可避免剥离的损坏问题，另外，可再接合一(或一以上)绝缘体及线路于绝缘体40下表面42，使电路板50成为多层线路的电路板。
如图4所示，是电路板50的剖面图，且该电路板50与图2电路板55所示的绝缘体40及线路70的特征及符号均相同，相同处请参阅图2的说明，其二不同处是：防焊层80，该防焊层80设置在绝缘体40下表面42，且防焊层80的一部分设置在绝缘体40下表面42的开孔48内，并与线路70第二下表面722的一部分及第二侧边732接合，据此，藉第二侧边732就可增加防焊层80与线路70的接合面积及强度，而提升电路板50的质量；导电层90，导电层90依需求仅与线路70第二下表面722接合；其中，藉防焊层80的一部分与线路70第二下表面722接合的技术特征，令第二下表面722的宽度W得以更缩小，用以减少导电层90的用量，进而达到降低成本的功效。
由于部分产品有需要传输更大的电流，因此，需加大线路的截面积用以满足上述的需求，而增加线路的厚度是加大线路截面积的方法之一，如图5所示，是电路板55的剖面图，该电路板55具有：一绝缘体40，绝缘体40具有上表面41及下表面42；一线路70，线路70具有侧边73、上表面71及下表面72，该线路70埋在绝缘体40内，其中，线路70侧边73是由第一侧边731及第三侧边733组成，且第一侧边731及下表面72均被绝缘体40包覆，并令未被绝缘体40包覆的线路70上表面71，以及第三侧边733裸露并凸出于绝缘体40上表面41外的大气中，其中，第一侧边731与第三侧边733是位于相同的水平面，亦可依需求设置为不是位于相同水平面，另外，该线路70可同时具有球垫及传输电性的功效；一防焊层80，防焊层80设位在绝缘体40的上表面41，并包覆线路70上表面71的一部分，且令线路70上表面71未被防焊层80包覆的部分裸露于大气中，用以供对外界物质的电连接，另外，也可依需求令电路板55不具有防焊层80；由图5说明得知，藉线路70侧边73的一部分凸出于绝缘体40上表面41的特征，可增加线路70的厚度及截面积，以达上述传输更大电流的功效，另外，亦可令绝缘体40下表面42具有一开孔48，并令线路70下表面72的一部分裸露于绝缘体40的开孔内。
如图6所示，是电路板55的剖面图，且该电路板55及图1电路板50所示的绝缘体40及防焊层80的特征及符号均相同，相同处请参阅图1的说明，其不同处是：线路70，线路70侧边73是由第一侧边731及第三侧边733组成，且第三侧边733未被绝缘体40包覆而裸露于绝缘体40上表面41，令线路70上表面71是裸露并凸出于绝缘体40上表面41，据此，可藉由线路70上表面71凸出绝缘体40上表面41的特征，使线路70得以具有延伸部(参阅图7说明)而延伸至绝缘体40上表面41，并可加大线路70的厚度及截面积，令电路板55更具实用性，同时，线路70具有浅坑(dimple)724，该浅坑724设位在第二下表面722并裸露于大气中，令第二下表面722实施为非平面的形状，藉浅坑724可增加线路70与导电层或另一线路的接合面积及强度，该浅坑724的深度(未标示)可大于1微米(μm)或2微米或3微米以上，当然，亦可依需求令线路70具有如图2所示的第二侧边732。
如图7所示，是电路板50的剖面图，且该电路板50及图6电路板55所示的绝缘体40及防焊层80的特征及符号均相同，相同处请参阅图6说明，其不同处是：线路70，该线路70的一部分与绝缘体40的上表面41接合，使线路70除了具有上表面71、下表面72及侧边73外，更包含有延伸部74，同时，侧边73是由第一侧边731及第三侧边733组成，且第三侧边733未被绝缘体40包覆而裸露于绝缘体40上表面41，其中，第一侧边731与第三侧边733不是位于相同的水平面，该延伸部74就是线路70与绝缘体40上表面41接合的部分，且线路70上表面71是由第一上表面711及第二上表面712组成，并令第一上表面711凸出于绝缘体40上表面41，并以第一上表面711为基础，令第二上表面712与第一上表面711可位于相同或不同的平面上，该延伸部74具有上表面741及下表面742，且下表面742与绝缘体40上表面41接合，并可令上表面741的至少一部分裸露大气中，且延伸部上表面741可以实施为线路70上表面71的一部分，以供与外界物质电连接，使线路70藉延伸部74在绝缘体40上表面41自由的延伸，更利于线路70的布置，另外，线路70第二下表面722是呈非平面的形状，藉非平面的第二下表面722更可增加线路70与导电或非导电的物质的面积及质量，该非平面的第二下表面722可实施为锥形、弧形或其他适当的形状另外，线路70延伸部74可实施为一体成形，或由二金属组合而成的。
如图8所示，是一构装体30的剖面图，构装体30是与本发明电路板结合的实施例，该构装体30具有：电路板55，电路板55的特征与图2相似，请参阅图2的说明，其不同处是：令线路70第二下表面722不设置导电层(90)；一芯片20，芯片20藉一黏胶(未绘示)与电路板55的防焊层80接合，并藉防焊层80而设位在绝缘体40上表面41；一导线95，导线95的两端分别与芯片20的焊垫(未绘示)及电路板55的导电层90接合，使芯片20与电路板55线路70电连通；一塑料结构60，塑料结构60的型号可实施为住友公司G1250系列的树脂，该塑料结构60与电路板55防焊层80接合，并包覆芯片20、导线95及导电层90；一锡球96，该锡球96与线路70的第二下表面722及第二侧边732接合；由图8可知，电路板55是可以与塑料结构60及芯片20结合的，而芯片20更是可具有导电凸块(未绘示)，并藉一黏胶与电路板55接合，当芯片20藉导电凸块与电路板55的线路70电连通时，芯片20可不藉防焊层80而设位在绝缘体40上表面41，且不需设置导线(95)，另外，在构装体30藉锡球96与其他电路板(未绘示)接合后，当构装体30受到外力的拉扯时，线路70可藉线路70第一下表面721是被绝缘体40包覆的特征，令线路70如同被绝缘体40握住，因而不易受外力拉扯而造成与绝缘体40分离的损坏，使线路70第一下表面721与绝缘体40接合的结构，也是本发明电路板的一特征。
上述各图仅为本发明电路板的较佳实施例，当不能以此限定本发明实施范围；如图1及图5所示电路板50、55，除了绝缘体40及线路70是必要的组成组件外，其他如图2～4及图6～8所示的第二侧边732、另一线路75、导电层90、防焊层80、线路70上表面71凸出绝缘体40上表面41、非平面的线路70第二下表面722、延伸部74、塑料结构60或锡球96等特征，则可依需求分别的或多个或全部的与图1或图5所示的绝缘体40及线路70结合成一新的电路板结构，用以与芯片20或电阻或电容等电子组件结合用，同时，电路板可依需求以堆栈的方式增加另一绝缘体或线路或导电层的数量，使本发明电路板更具弹性的组合成业者需要的结构；故举凡数值变更或等效组件置换，或依本发明申请的权利要求范围所作的均等变化与修饰，皆应仍属本发明专利涵盖的范畴。
上述实例只为说明本发明的技术构思及特点，其目的在于让熟悉此项技术的人是能够了解本发明的内容并据以实施，并不能以此限制本发明的保护范围。凡根据本发明精神实质所做的等效变换或修饰，都应涵盖在本发明的保护范围之内。

Claims (13)

1.一种电路板，该电路板至少包含有：
一绝缘体，绝缘体具有开孔、上表面及下表面；一线路，所述线路具有侧边、上表面及下表面，且下表面是由第一下表面及第二下表面组成，该线路埋在绝缘体内，其中，线路上表面裸露于绝缘体上表面外的大气中，以供与外界物质电连接用，而线路侧边的至少一部分及第一下表面被绝缘体包覆，并令线路第二下表面设位在绝缘体开孔内，且裸露于绝缘体下表面外的大气中，以供与外界物质电连接用。
2.如权利要求1所述的一种电路板，其中，所述线路的第二下表面与第一下表面不是位于相同的平面，据此，所述线路还包含有第二侧边，该第二侧边设位于第一下表面与第二下表面二者间并裸露于绝缘体开孔内。
3.如权利要求1所述的一种电路板，其中，所述线路第二下表面呈非平面的形状。
4.如权利要求1所述的一种电路板，其中，还包含一另一线路，该另一线路贴附在绝缘体的下表面。
5.如权利要求1所述的一种电路板，其中，所述线路上表面是凹设并裸露于绝缘体上表面外。
6.如权利要求1所述的一种电路板，其中，所述线路侧边是由第一侧边及第三侧边组成，且第三侧边未被绝缘体包覆而裸露于绝缘体上表面，并令线路上表面至少一部分是凸出于绝缘体上表面。
7.如权利要求6所述的一种电路板，其中，所述线路还包含一延伸部，该延伸部具有上表面及下表面，且延伸部下表面与绝缘体上表面接合，而延伸部上表面为线路上表面的一部分。
8.如权利要求1所述的一种电路板，其中，还包含一防焊层，该防焊层与绝缘体的上表面或下表面接合，并令线路的至少一部分裸露于大气中。
9.如权利要求8所述的一种电路板，其中，还包含一塑料结构，该塑料结构至少与防焊层的一部分接合。
10.如权利要求1所述的一种电路板，其中，还至少包含一导电层，该导电层设置在线路上表面或第二下表面，并令导电层上表面是裸露在大气中。
11.如权利要求1所述的一种电路板，其中，该外界物质为导电凸块或导线或锡球或电阻或电容。
12.一种电路板，该电路板至少包含有：
一绝缘体，所述绝缘体具有上表面及下表面；一线路，所述线路具有侧边、上表面及下表面，该线路埋在绝缘体内，其中，线路侧边是由第一侧边及第三侧边组成，且第一侧边及下表面均被绝缘体包覆，并令未被绝缘体包覆的线路上表面，以及第三侧边裸露并凸出于绝缘体上表面外的大气中，以供与外界物质电连接用；一防焊层，该防焊层与绝缘体的上表面接合，并令线路的至少一部分裸露于大气中。
13.如权利要求12所述的一种电路板，其中，线路的第一侧边及第三侧边不是位于相同的水平面。
CN201410195473.1A 2013-05-20 2014-05-09 一种电路板 Expired - Fee Related CN104185357B (zh)

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