JP2010251410A5 - - Google Patents

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Publication number
JP2010251410A5
JP2010251410A5 JP2009097050A JP2009097050A JP2010251410A5 JP 2010251410 A5 JP2010251410 A5 JP 2010251410A5 JP 2009097050 A JP2009097050 A JP 2009097050A JP 2009097050 A JP2009097050 A JP 2009097050A JP 2010251410 A5 JP2010251410 A5 JP 2010251410A5
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JP
Japan
Prior art keywords
wafer
light
jig
bonding apparatus
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009097050A
Other languages
English (en)
Japanese (ja)
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JP2010251410A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009097050A priority Critical patent/JP2010251410A/ja
Priority claimed from JP2009097050A external-priority patent/JP2010251410A/ja
Publication of JP2010251410A publication Critical patent/JP2010251410A/ja
Publication of JP2010251410A5 publication Critical patent/JP2010251410A5/ja
Pending legal-status Critical Current

Links

JP2009097050A 2009-04-13 2009-04-13 ウエハ接合装置 Pending JP2010251410A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009097050A JP2010251410A (ja) 2009-04-13 2009-04-13 ウエハ接合装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009097050A JP2010251410A (ja) 2009-04-13 2009-04-13 ウエハ接合装置

Publications (2)

Publication Number Publication Date
JP2010251410A JP2010251410A (ja) 2010-11-04
JP2010251410A5 true JP2010251410A5 (enExample) 2012-04-05

Family

ID=43313453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009097050A Pending JP2010251410A (ja) 2009-04-13 2009-04-13 ウエハ接合装置

Country Status (1)

Country Link
JP (1) JP2010251410A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6353374B2 (ja) * 2015-01-16 2018-07-04 東京エレクトロン株式会社 接合装置、接合システムおよび接合方法
JP6353373B2 (ja) * 2015-01-16 2018-07-04 東京エレクトロン株式会社 接合装置、接合システムおよび接合方法
JP6562828B2 (ja) * 2015-12-11 2019-08-21 東京エレクトロン株式会社 検査装置、接合装置、接合システムおよび検査方法
CN112018002A (zh) * 2020-08-25 2020-12-01 武汉新芯集成电路制造有限公司 晶圆键合设备及晶圆键合的方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3790995B2 (ja) * 2004-01-22 2006-06-28 有限会社ボンドテック 接合方法及びこの方法により作成されるデバイス並びに接合装置

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