JP2010251410A5 - - Google Patents
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- JP2010251410A5 JP2010251410A5 JP2009097050A JP2009097050A JP2010251410A5 JP 2010251410 A5 JP2010251410 A5 JP 2010251410A5 JP 2009097050 A JP2009097050 A JP 2009097050A JP 2009097050 A JP2009097050 A JP 2009097050A JP 2010251410 A5 JP2010251410 A5 JP 2010251410A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- light
- jig
- bonding apparatus
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
上記の従来技術の課題を解決するため、本発明によれば、下ウエハ及び上ウエハをそれぞれ固定保持する治具が装着されたチャンバ内で、両ウエハの相対的な移動調整と各ウエハに設けられた位置合わせ用のマークに対する光の照射及びその検出とに基づいて両ウエハ間の位置合わせを行い、両ウエハを接触させてウエハ接合を行うウエハ接合装置において、前記下ウエハ及び上ウエハと各前記治具との間に介在し、各前記ウエハの面全体に直接接触する光透過性部材と、前記光の照射を行う光源と、前記光で照らし出された前記マークの読み取り手段とを備え、前記各治具は、前記各ウエハのマークに対する光が透過する領域に対応する部分にそれぞれ開口部を有するとともに、一方の前記治具が前記光源と一方の前記光透過性部材の間に配置され、他方の前記治具が前記読み取り手段と他方の前記光透過性部材の間に配置されていることを特徴とするウエハ接合装置が提供される。 In order to solve the above-described problems of the prior art, according to the present invention, relative movement adjustment of both wafers and provision to each wafer are provided in a chamber in which jigs for fixing and holding the lower wafer and the upper wafer are mounted. In a wafer bonding apparatus that performs alignment between both wafers based on irradiation of light to the alignment mark and detection thereof, and performs wafer bonding by bringing both wafers into contact with each other, the lower wafer and the upper wafer, A light transmissive member interposed between the jig and in direct contact with the entire surface of each wafer; a light source for irradiating the light; and a means for reading the mark illuminated by the light. , each jig, the which has a respective opening in a portion corresponding to the area where light is transmitted for the mark of each wafer, during one of the jig of the light source and one of the light transmitting member Is location, the wafer bonding apparatus characterized by other of the jig is disposed between said reading means and the other of the light transmitting member.
Claims (6)
前記下ウエハ及び上ウエハと各前記治具との間に介在し、各前記ウエハの面全体に直接接触する光透過性部材と、
前記光の照射を行う光源と、
前記光で照らし出された前記マークの読み取り手段と
を備え、
前記各治具は、前記各ウエハのマークに対する光が透過する領域に対応する部分にそれぞれ開口部を有するとともに、一方の前記治具が前記光源と一方の前記光透過性部材の間に配置され、他方の前記治具が前記読み取り手段と他方の前記光透過性部材の間に配置されていることを特徴とするウエハ接合装置。 Based on relative movement adjustment of both wafers, irradiation of light to alignment marks provided on each wafer, and detection thereof in a chamber in which jigs for fixing and holding the lower wafer and the upper wafer are mounted. In a wafer bonding apparatus for performing wafer bonding by aligning both wafers and bringing both wafers into contact with each other,
A light transmissive member interposed between the lower wafer and the upper wafer and each jig, and in direct contact with the entire surface of each wafer;
A light source for irradiating the light;
Means for reading the mark illuminated by the light;
With
Each jig, the which has a respective opening in a portion corresponding to the area where light is transmitted for the mark of the wafer, is one of the jig is disposed between the light source and one of the light transmitting member The other jig is disposed between the reading means and the other light-transmitting member .
前記下ウエハ及び上ウエハと各前記治具との間に介在し、各前記ウエハの面全体に直接接触する光透過性部材と、
前記光の照射を行う光源と、
前記光で照らし出された前記マークの読み取り手段と
を備え、
前記各治具は、前記各ウエハのマークに対する光が透過する領域に対応する部分にそれぞれ光透過性の部材で構成された光透過領域を有するとともに、一方の前記治具が前記光源と一方の前記光透過性部材の間に配置され、他方の前記治具が前記読み取り手段と他方の前記光透過性部材の間に配置されていることを特徴とするウエハ接合装置。 Based on relative movement adjustment of both wafers, irradiation of light to alignment marks provided on each wafer, and detection thereof in a chamber in which jigs for fixing and holding the lower wafer and the upper wafer are mounted. In a wafer bonding apparatus for performing wafer bonding by aligning both wafers and bringing both wafers into contact with each other,
A light transmissive member interposed between the lower wafer and the upper wafer and each jig, and in direct contact with the entire surface of each wafer;
A light source for irradiating the light;
Means for reading the mark illuminated by the light;
With
Each of the jigs has a light transmissive region formed of a light transmissive member in a portion corresponding to a region through which light with respect to the mark on each wafer is transmitted, and one of the jigs includes the light source and one of the light sources. A wafer bonding apparatus, wherein the wafer bonding apparatus is disposed between the light transmissive members, and the other jig is disposed between the reading means and the other light transmissive member .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009097050A JP2010251410A (en) | 2009-04-13 | 2009-04-13 | Wafer joining device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009097050A JP2010251410A (en) | 2009-04-13 | 2009-04-13 | Wafer joining device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010251410A JP2010251410A (en) | 2010-11-04 |
| JP2010251410A5 true JP2010251410A5 (en) | 2012-04-05 |
Family
ID=43313453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009097050A Pending JP2010251410A (en) | 2009-04-13 | 2009-04-13 | Wafer joining device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010251410A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6353373B2 (en) * | 2015-01-16 | 2018-07-04 | 東京エレクトロン株式会社 | Joining apparatus, joining system, and joining method |
| JP6353374B2 (en) * | 2015-01-16 | 2018-07-04 | 東京エレクトロン株式会社 | Joining apparatus, joining system, and joining method |
| JP6562828B2 (en) * | 2015-12-11 | 2019-08-21 | 東京エレクトロン株式会社 | Inspection apparatus, bonding apparatus, bonding system, and inspection method |
| CN112018002A (en) * | 2020-08-25 | 2020-12-01 | 武汉新芯集成电路制造有限公司 | Wafer bonding equipment and wafer bonding method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005071735A1 (en) * | 2004-01-22 | 2005-08-04 | Bondtech Inc. | Joining method and device produced by this method and joining unit |
-
2009
- 2009-04-13 JP JP2009097050A patent/JP2010251410A/en active Pending
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