JP2010251410A - ウエハ接合装置 - Google Patents

ウエハ接合装置 Download PDF

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Publication number
JP2010251410A
JP2010251410A JP2009097050A JP2009097050A JP2010251410A JP 2010251410 A JP2010251410 A JP 2010251410A JP 2009097050 A JP2009097050 A JP 2009097050A JP 2009097050 A JP2009097050 A JP 2009097050A JP 2010251410 A JP2010251410 A JP 2010251410A
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Japan
Prior art keywords
wafer
jig
wafers
silicon
light
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Pending
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JP2009097050A
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Japanese (ja)
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JP2010251410A5 (enExample
Inventor
Hiroshi Murayama
啓 村山
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2009097050A priority Critical patent/JP2010251410A/ja
Publication of JP2010251410A publication Critical patent/JP2010251410A/ja
Publication of JP2010251410A5 publication Critical patent/JP2010251410A5/ja
Pending legal-status Critical Current

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2009097050A 2009-04-13 2009-04-13 ウエハ接合装置 Pending JP2010251410A (ja)

Priority Applications (1)

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JP2009097050A JP2010251410A (ja) 2009-04-13 2009-04-13 ウエハ接合装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009097050A JP2010251410A (ja) 2009-04-13 2009-04-13 ウエハ接合装置

Publications (2)

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JP2010251410A true JP2010251410A (ja) 2010-11-04
JP2010251410A5 JP2010251410A5 (enExample) 2012-04-05

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JP2009097050A Pending JP2010251410A (ja) 2009-04-13 2009-04-13 ウエハ接合装置

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016114329A1 (en) * 2015-01-16 2016-07-21 Tokyo Electron Limited Joint apparatus, joint system, and joint method
WO2016114328A1 (en) * 2015-01-16 2016-07-21 Tokyo Electron Limited Joint apparatus, joint system, and joint method
JP2017108055A (ja) * 2015-12-11 2017-06-15 東京エレクトロン株式会社 検査装置、接合装置、接合システムおよび検査方法
CN112018002A (zh) * 2020-08-25 2020-12-01 武汉新芯集成电路制造有限公司 晶圆键合设备及晶圆键合的方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311298A (ja) * 2004-01-22 2005-11-04 Bondotekku:Kk 接合方法及びこの方法により作成されるデバイス並びに接合装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311298A (ja) * 2004-01-22 2005-11-04 Bondotekku:Kk 接合方法及びこの方法により作成されるデバイス並びに接合装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016114329A1 (en) * 2015-01-16 2016-07-21 Tokyo Electron Limited Joint apparatus, joint system, and joint method
WO2016114328A1 (en) * 2015-01-16 2016-07-21 Tokyo Electron Limited Joint apparatus, joint system, and joint method
JP2016134457A (ja) * 2015-01-16 2016-07-25 東京エレクトロン株式会社 接合装置、接合システムおよび接合方法
JP2016134459A (ja) * 2015-01-16 2016-07-25 東京エレクトロン株式会社 接合装置、接合システムおよび接合方法
JP2017108055A (ja) * 2015-12-11 2017-06-15 東京エレクトロン株式会社 検査装置、接合装置、接合システムおよび検査方法
CN112018002A (zh) * 2020-08-25 2020-12-01 武汉新芯集成电路制造有限公司 晶圆键合设备及晶圆键合的方法

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