JP2010229026A - 多層熱的保護システム及び多層熱的保護システムを形成する方法 - Google Patents
多層熱的保護システム及び多層熱的保護システムを形成する方法 Download PDFInfo
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- JP2010229026A JP2010229026A JP2010071443A JP2010071443A JP2010229026A JP 2010229026 A JP2010229026 A JP 2010229026A JP 2010071443 A JP2010071443 A JP 2010071443A JP 2010071443 A JP2010071443 A JP 2010071443A JP 2010229026 A JP2010229026 A JP 2010229026A
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Abstract
【解決手段】第1のセラミック層(3)がボンディングコート層(4)を介して金属基板(5)に取り付けられており、第1のセラミック層(3)上に、セラミック接着剤層(2)を介して第1のセラミック層(3)に取り付けられた少なくとも1つの第2のセラミック層(1)が設けられており、第1のセラミック層(3)が、低温セラミック層であり、第2のセラミック層(1)が、高温セラミック層である。
【選択図】図1
Description
1.卑金属/ボンディングコート(BC)/遮熱コーティング(TBC)
2.卑金属/BC/TBC/環境バリアコーティング(EBC)
3.セラミックマトリックス複合材(CMC)
a)酸化物CMC+高温絶縁
b)非酸化物CMC+EBC
4.例えば米国特許出願公開第2003/0207155号明細書に開示されているような自立型ハイブリッドセラミック構造体
一連の実験が、7YSZコーティングを、ゾル−ゲル法によって製造された、約80%の気孔率を有する開放気孔αアルミナモノリシックセラミックに結合するために、高グレードのアルミン酸カルシウムセメントを使用して行われた。
Claims (15)
- 多層熱的保護システムにおいて、第1のセラミック層(3)が、ボンディングコート層(4)を介して金属基板(5)に取り付けられており、第1のセラミック層(3)上に、セラミック接着剤層(2)を介して第1のセラミック層(3)に取り付けられた少なくとも1つの第2のセラミック層(1)が設けられており、第1のセラミック層(3)が、プラズマ溶射によって提供されており、第2のセラミック層(1)が、第1のセラミック層(3)に接着により取り付けられたモノリシックセラミックエレメントを含むことを特徴とする、多層熱的保護システム。
- モノリシックセラミックエレメントが、タイル、柱状構造、ブロック構造、又はこれらの組み合わせのグループから選択された、前もって製造されたエレメントであり、前もって製造されたエレメントが、前もって製造され、基板(5)に提供される前に既に焼結されており、好適には、前もって製造されたエレメントが、機械に取り付けられた時にもはやさらなる焼結プロセスを受けないように、約1600℃の温度において焼結されることを特徴とする、請求項1記載の多層熱的保護システム。
- 第1のセラミック層(3)が、0.1〜2mmの厚さを有しており、第2のセラミック層(1)が、2〜35mm、好適には5〜10mmの厚さを有していることを特徴とする、請求項1又は2記載の多層熱的保護システム。
- 第1のセラミック層(3)が、1150℃以下、好適には1100℃以下の温度能力(Tmax)を有しており、第2のセラミック層(1)が、第1のセラミック層(3)よりも高い温度能力(Tmax)を有しており、好適には、第2のセラミック層(1)の温度能力(Tmax)が、第1のセラミック層(3)の温度能力(Tmax)よりも、少なくとも100℃、好適には少なくとも200度だけ高く、好適には、第2のセラミック層(1)が、少なくとも1200℃、より好適には少なくとも1500℃、さらにより好適には1200〜1750℃の範囲の温度能力(Tmax)を有しており、好適には、第2のセラミック層(1)が、単層、多層又はグレード付けされた層のシステムであることを特徴とする、請求項1から3までのいずれか1項記載の多層熱的保護システム。
- 第2のセラミック層(1)が、αアルミナベース及び/又はマグネシアベースであり、好適には、第2のセラミック層(1)が、本質的に、αアルミナ及び/又はマグネシアから成ることを特徴とする、請求項1から4までのいずれか1項記載の多層熱的保護システム。
- 第2のセラミック層(1)が、少なくとも1つの表面露出層(1a)と、少なくとも1つの下側に位置する付加的な層(1b)とを有しており、表面露出層(1a)が、ギャップ(7)によって分離されたタイル(8)の二次元の配列として構成されており、好適には、タイルが、矩形、方形、菱形、又は六角形であり、好適には、両次元におけるタイルの側方延長が、15〜35mm、好適には20〜30mmであり、さらに好適には、タイル(8)の間のギャップ(7)が、基板表面の平面に対して垂直な又は傾斜した平行な側壁を備えたスロット、又は係止形状を備えたスロットであることを特徴とする、請求項1から5までのいずれか1項記載の多層熱的保護システム。
- セラミック接着剤層(2)が、好適にはアルミン酸カルシウムベースの、より好適には本質的にアルミン酸カルシウムから成る、耐火セメントペースト層であることを特徴とする、請求項1から6までのいずれか1項記載の多層熱的保護システム。
- 金属基板(5)が、ニッケルベース超合金であることを特徴とする、請求項1から7までのいずれか1項記載の多層熱的保護システム。
- ボンディングコートが、MCrAlYから成るか又はPtAlから成り、M=Co、Ni又はCo/Niであり、好適には、ボンディングコートの組成が、25Cr5.5Al2.5Si1Ta0.6Yで残りがNiであるか、又は12Co20Cr11Al2.7Si1Ta0.6Yで残りがNiであることを特徴とする、請求項1から8までのいずれか1項記載の多層熱的保護システム。
- 第1のセラミック層(3)が、7YSZベースであるか又は7YSZから成ることを特徴とする、請求項1から9までのいずれか1項記載の多層熱的保護システム。
- 少なくともセラミック接着剤層(2)との1つの境界面において、機械的な結合補助手段が、好適には、ボンディングコート(4)及び/又は第1のセラミック層(3)及び/又は接着剤層(4)及び/又は第2のセラミック層(1)に設けられた溝、リブ、アンカー、及び/又は表面組織の形式で提供されていることを特徴とする、請求項1から10までのいずれか1項記載の多層熱的保護システム。
- 請求項1から11までのいずれか1項記載の多層熱的保護システムを製造する方法において、第1のセラミック層(3)をボンディングコート層(4)を介して金属基板(5)に取り付けるステップと、第1のセラミック層(3)にセラミック接着剤層(2)を介して少なくとも1つの第2のセラミック層(1)を取り付けるステップとを有しており、第1のセラミック層(3)が、プラズマ溶射によって提供され、第2のセラミック層(1)が、第1のセラミック層(3)に接着剤により取り付けられたモノリシックセラミックエレメントを含んでおり、好適には、接着剤取付けが、セメントを用いて行われており、該セメントを、室温で、4〜12時間に亘って、好適には接合面に対して垂直に提供される70〜850g/cm2の範囲の圧縮荷重を加えながら乾燥させるステップを有しており、さらに、好適には、その後、好適には5〜15時間に亘って、500〜600℃の温度で硬化させるか又は硬化させることによって交換/補足され、好適には硬化が、接合面に垂直に加えられる250g/cm2までの硬化荷重を加えながら生じることを特徴とする、多層熱的保護システムを製造する方法。
- 1400℃よりも高い温度に曝される構成部材の少なくとも部分を被覆するための、請求項1から11までのいずれか1項記載の多層熱保護システムの使用。
- 好適には1400℃よりも高い温度の高温ガスに曝される、熱機関、特にガスタービンにおける高温ガス通路に曝される構成部材を少なくとも部分的に被覆するための、請求項1から11までのいずれか1項記載の多層熱保護システムの使用。
- 包囲する部材が、ボンディングコート層(4)によって金属基板(5)に取り付けられた遮熱コーティング層から成る遮熱コーティングシステムで被覆されている一方で、高温ガス通路に曝されるガスタービン部材の最も温度に曝される部分のみを選択的に被覆するための、請求項1から11までのいずれか1項記載の遮熱コーティング層システムの使用。
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Also Published As
Publication number | Publication date |
---|---|
EP2233451B1 (en) | 2013-11-20 |
CA2696933A1 (en) | 2010-09-27 |
ES2448591T3 (es) | 2014-03-14 |
US20100247953A1 (en) | 2010-09-30 |
CN101845969A (zh) | 2010-09-29 |
CN101845969B (zh) | 2015-07-29 |
EP2233451A1 (en) | 2010-09-29 |
CA2696933C (en) | 2016-03-15 |
JP5709391B2 (ja) | 2015-04-30 |
EP2233450A1 (en) | 2010-09-29 |
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