JP2010177470A - 電子機器及び回路基板 - Google Patents
電子機器及び回路基板 Download PDFInfo
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- JP2010177470A JP2010177470A JP2009018759A JP2009018759A JP2010177470A JP 2010177470 A JP2010177470 A JP 2010177470A JP 2009018759 A JP2009018759 A JP 2009018759A JP 2009018759 A JP2009018759 A JP 2009018759A JP 2010177470 A JP2010177470 A JP 2010177470A
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 43
- 239000004065 semiconductor Substances 0.000 claims abstract description 38
- 230000001681 protective effect Effects 0.000 claims abstract description 24
- 229910000679 solder Inorganic materials 0.000 claims abstract description 17
- 238000005304 joining Methods 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 239000005871 repellent Substances 0.000 description 48
- 230000002940 repellent Effects 0.000 description 38
- 239000000758 substrate Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 3
- 239000002033 PVDF binder Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 2
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 2
- -1 polytetrafluoroethylene Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H01L2224/321—Disposition
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- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
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- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
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- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
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- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
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Abstract
【解決手段】筐体20Aと、前記筐体20Aに収容された回路基板201と、半田ボール210が設けられた一方の面202bと、この一方の面202bとは反対側の他方の面202aとを有し、前記半田ボール210を介して前記回路基板210に電気的に接続された半導体パッケージ202と、撥水性を有するとともに、前記半導体パッケージ202の実装領域を露出させて前記回路基板210に塗布された保護膜307と、前記半導体パッケージ202と当該半導体パッケージの実装領域との間に充填されたことで、前記回路基板201と前記半導体パッケージ202とに接合した接合部材204と、を備えたことを特徴とする。
【選択図】 図4
Description
(電子機器の構成)
図1は、本発明の実施の形態に係る電子機器の外観を示す概略図である。図1では、本発明の実施形態の一例としてノートブック型パーソナルコンピュータを開示している。
次に、図2、図3を参照しながら、本実施例のプリント回路基板201に実装された電子部品202(半導体パッケージ)の構成について説明する。図2は、本実施例のプリント回路基板201に実装された電子部品202を示した斜視図である。図3は、A−A部における断面図である。
次に、図13乃至図17を参照しながら、本実施例における撥水膜の塗布方法について説明する。図13は本実施例における撥水膜307の塗布領域を示した図である。図14乃至図17は、本実施例における撥水膜307の塗布領域を調整することで基板接合部材204の接合形状を制御した状態を示す図である。
2…本体機能部
3…文字入力部
4A…トラックパッド
4B…決定スイッチ
5…指紋読取部
10A…表示部
10…上部筐体
20A…本体部
20…下部筐体(筐体)
20a…上面
20b…底面
20e…左側面
20f…右側面
20g…前面
20h…背面
20i…前面
201…プリント回路基板
202…BGAパッケージ
203…パッケージ保護カバー
204…基板接合部材
205…部品接合部材
210…半田ボール
202a…上面
202b…底面
202c〜f、302c〜f…側面
307…撥水膜
Claims (10)
- 筐体と、
前記筐体に収容された回路基板と、
半田ボールが設けられた一方の面と、この一方の面とは反対側の他方の面とを有し、前記半田ボールを介して前記回路基板に電気的に接続された半導体パッケージと、
撥水性を有するとともに、前記半導体パッケージの実装領域を露出させて前記回路基板に塗布された保護膜と、
前記半導体パッケージと当該半導体パッケージの実装領域との間に充填されたことで、前記回路基板と前記半導体パッケージとに接合した接合部材と、
を備えたことを特徴とする電子機器。 - 前記保護膜は、前記半導体パッケージの一方の面と対向する前記回路基板の領域に塗布され、当該一方の面と前記回路基板の実装領域との間への接合部材の流入を防止することを特徴とする請求項1記載の電子機器。
- 前記保護膜は、前記半導体パッケージの一方の面に塗布され、当該一方の面と前記回路基板の実装領域との間への接合部材の流入を防止することを特徴とする請求項2記載の電子機器。
- 前記半導体パッケージの他方の面に熱接続された放熱部材を更に備え、
前記保護膜は、前記半導体パッケージの前記放熱部材に対向する伝熱面に塗布され、当該伝熱面と前記放熱部材との間への接合部材の流入を防止することを特徴とする請求項3記載の電子機器。 - 前記保護膜は、前記放熱部材の前記半導体パッケージに対向する受熱面に塗布され、前記半導体パッケージの伝熱面と前記放熱部材との間への接合部材の流入を防止することを特徴とする請求項4記載の電子機器。
- 前記保護膜は、前記回路基板に形成されたスルーホールの周縁に塗布され、当該スルーホールへの接合部材の流入を防止することを特徴とする請求項5記載の電子機器。
- 前記接合部材は、前記半導体パッケージの対角2隅部に対応して設けられ、
前記保護膜は、前記接合部材が設けられた領域の周縁に塗布されるとともに、当該領域からの前記接合部材の流出を防止することを特徴とする請求項1記載の電子機器。 - 前記接合部材は、少なくとも一部が前記回路基板と前記半導体パッケージとの間に位置するように前記回路基板上に設けられたことを特徴とする請求項7に記載の電子機器。
- 回路パターンと、
半田ボールが設けられた一方の面と、この一方の面とは反対側の他方の面とを有し、前記半田ボールを介して前記回路パターンに電気的に接続された半導体パッケージと、
撥水性を有するとともに、前記半導体パッケージの実装領域を露出させて塗布された保護膜と、
前記半導体パッケージと当該半導体パッケージの実装領域との間に充填された接合部材と、
を備えたことを特徴とする回路基板。 - 前記保護膜は、前記半導体パッケージの一方の面と対向する領域に塗布されたことを特徴とする請求項9記載の回路基板。
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JP2009018759A JP4621778B2 (ja) | 2009-01-29 | 2009-01-29 | 電子機器及び回路基板 |
US12/622,193 US20100187672A1 (en) | 2009-01-29 | 2009-11-19 | Electronic apparatus and circuit board |
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JP2009018759A JP4621778B2 (ja) | 2009-01-29 | 2009-01-29 | 電子機器及び回路基板 |
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Cited By (3)
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JP2012054417A (ja) * | 2010-09-01 | 2012-03-15 | Panasonic Corp | 電子部品の実装構造体及びその製造方法 |
JP2012182362A (ja) * | 2011-03-02 | 2012-09-20 | Dainippon Printing Co Ltd | 電子部品、及びその製造方法 |
JP2014072469A (ja) * | 2012-09-29 | 2014-04-21 | Kyocer Slc Technologies Corp | 半導体素子収納用配線基板およびその製造方法 |
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EP2423955B8 (en) * | 2009-04-24 | 2019-10-09 | Panasonic Intellectual Property Management Co., Ltd. | Method for mounting semiconductor package component, and structure having semiconductor package component mounted therein |
JP5058355B1 (ja) * | 2011-04-20 | 2012-10-24 | 株式会社東芝 | テレビおよび電子機器 |
JP5342034B2 (ja) * | 2012-04-17 | 2013-11-13 | 株式会社東芝 | 電子部品および電子機器 |
EP3706171A4 (en) * | 2017-11-01 | 2021-04-21 | Sony Semiconductor Solutions Corporation | IMAGING ELEMENT, IMAGING DEVICE, ELECTRONIC APPARATUS, AND IMAGING ELEMENT MANUFACTURING METHOD |
US10796976B2 (en) * | 2018-10-31 | 2020-10-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and method of forming the same |
US12009271B2 (en) * | 2019-07-15 | 2024-06-11 | Intel Corporation | Protruding SN substrate features for epoxy flow control |
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JP2012182362A (ja) * | 2011-03-02 | 2012-09-20 | Dainippon Printing Co Ltd | 電子部品、及びその製造方法 |
JP2014072469A (ja) * | 2012-09-29 | 2014-04-21 | Kyocer Slc Technologies Corp | 半導体素子収納用配線基板およびその製造方法 |
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US20100187672A1 (en) | 2010-07-29 |
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