JP2010171181A5 - - Google Patents

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Publication number
JP2010171181A5
JP2010171181A5 JP2009011938A JP2009011938A JP2010171181A5 JP 2010171181 A5 JP2010171181 A5 JP 2010171181A5 JP 2009011938 A JP2009011938 A JP 2009011938A JP 2009011938 A JP2009011938 A JP 2009011938A JP 2010171181 A5 JP2010171181 A5 JP 2010171181A5
Authority
JP
Japan
Prior art keywords
lead
bonding wire
die pad
semiconductor chip
pad portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2009011938A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010171181A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009011938A priority Critical patent/JP2010171181A/ja
Priority claimed from JP2009011938A external-priority patent/JP2010171181A/ja
Priority to CN2010100020878A priority patent/CN101794758B/zh
Priority to US12/691,168 priority patent/US20100181628A1/en
Publication of JP2010171181A publication Critical patent/JP2010171181A/ja
Publication of JP2010171181A5 publication Critical patent/JP2010171181A5/ja
Withdrawn legal-status Critical Current

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JP2009011938A 2009-01-22 2009-01-22 半導体装置 Withdrawn JP2010171181A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009011938A JP2010171181A (ja) 2009-01-22 2009-01-22 半導体装置
CN2010100020878A CN101794758B (zh) 2009-01-22 2010-01-11 半导体器件
US12/691,168 US20100181628A1 (en) 2009-01-22 2010-01-21 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009011938A JP2010171181A (ja) 2009-01-22 2009-01-22 半導体装置

Publications (2)

Publication Number Publication Date
JP2010171181A JP2010171181A (ja) 2010-08-05
JP2010171181A5 true JP2010171181A5 (https=) 2012-03-08

Family

ID=42336239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009011938A Withdrawn JP2010171181A (ja) 2009-01-22 2009-01-22 半導体装置

Country Status (3)

Country Link
US (1) US20100181628A1 (https=)
JP (1) JP2010171181A (https=)
CN (1) CN101794758B (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5622934B2 (ja) * 2011-06-09 2014-11-12 三菱電機株式会社 半導体装置
EP2720263A4 (en) * 2011-06-09 2015-04-22 Mitsubishi Electric Corp SEMICONDUCTOR COMPONENT
JP6161251B2 (ja) * 2012-10-17 2017-07-12 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
CN104103619B (zh) * 2014-06-30 2017-05-24 通富微电子股份有限公司 半导体功率器件的导线强化焊接结构
CN104600042A (zh) * 2014-12-25 2015-05-06 杰群电子科技（东莞）有限公司 一种半导体器件
DE102015104996B4 (de) * 2015-03-31 2020-06-18 Infineon Technologies Austria Ag Halbleitervorrichtungen mit Steuer- und Lastleitungen von entgegengesetzter Richtung
JP6721346B2 (ja) * 2016-01-27 2020-07-15 ローム株式会社 半導体装置
WO2019167254A1 (ja) * 2018-03-02 2019-09-06 新電元工業株式会社 半導体装置及び半導体装置の製造方法
CN109119396A (zh) * 2018-09-14 2019-01-01 上海凯虹科技电子有限公司 引线框架及采用该引线框架的封装体
DE102019120523A1 (de) * 2019-07-30 2021-02-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Leiterrahmenverbund, Verfahren zur Herstellung einer Mehrzahl von Bauteilen und Bauteil
JP7054008B2 (ja) * 2019-08-27 2022-04-13 日亜化学工業株式会社 発光装置の製造方法
JP2023118480A (ja) * 2022-02-15 2023-08-25 富士電機株式会社 半導体装置及び車両
JP2023118481A (ja) 2022-02-15 2023-08-25 富士電機株式会社 半導体装置及び車両

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3062192B1 (ja) * 1999-09-01 2000-07-10 松下電子工業株式会社 リ―ドフレ―ムとそれを用いた樹脂封止型半導体装置の製造方法
JP3895570B2 (ja) * 2000-12-28 2007-03-22 株式会社ルネサステクノロジ 半導体装置
JP3436253B2 (ja) * 2001-03-01 2003-08-11 松下電器産業株式会社 樹脂封止型半導体装置およびその製造方法
JP4244318B2 (ja) * 2003-12-03 2009-03-25 株式会社ルネサステクノロジ 半導体装置
WO2008057770A2 (en) * 2006-10-27 2008-05-15 Unisem (Mauritius) Holdings Limited Partially patterned lead frames and methods of making and using the same in semiconductor packaging
TWI337387B (en) * 2007-04-20 2011-02-11 Chipmos Technologies Inc Leadframe for leadless package, package structure and manufacturing method using the same

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