JP2010161123A5 - - Google Patents

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Publication number
JP2010161123A5
JP2010161123A5 JP2009001110A JP2009001110A JP2010161123A5 JP 2010161123 A5 JP2010161123 A5 JP 2010161123A5 JP 2009001110 A JP2009001110 A JP 2009001110A JP 2009001110 A JP2009001110 A JP 2009001110A JP 2010161123 A5 JP2010161123 A5 JP 2010161123A5
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JP
Japan
Prior art keywords
electronic component
circuit board
printed circuit
heating block
bonding material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009001110A
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English (en)
Japanese (ja)
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JP2010161123A (ja
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Publication date
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Priority to JP2009001110A priority Critical patent/JP2010161123A/ja
Priority claimed from JP2009001110A external-priority patent/JP2010161123A/ja
Publication of JP2010161123A publication Critical patent/JP2010161123A/ja
Publication of JP2010161123A5 publication Critical patent/JP2010161123A5/ja
Pending legal-status Critical Current

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JP2009001110A 2009-01-06 2009-01-06 電子部品リペア装置および電子部品リペア方法 Pending JP2010161123A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009001110A JP2010161123A (ja) 2009-01-06 2009-01-06 電子部品リペア装置および電子部品リペア方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009001110A JP2010161123A (ja) 2009-01-06 2009-01-06 電子部品リペア装置および電子部品リペア方法

Publications (2)

Publication Number Publication Date
JP2010161123A JP2010161123A (ja) 2010-07-22
JP2010161123A5 true JP2010161123A5 (enrdf_load_stackoverflow) 2011-12-01

Family

ID=42578115

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009001110A Pending JP2010161123A (ja) 2009-01-06 2009-01-06 電子部品リペア装置および電子部品リペア方法

Country Status (1)

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JP (1) JP2010161123A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5505181B2 (ja) * 2010-08-06 2014-05-28 富士通株式会社 電子部品のリペア方法、電子部品のリペア装置及び伝熱プレート
JP5720433B2 (ja) * 2011-06-23 2015-05-20 富士通株式会社 表面実装型部品の取り外し方法、表面実装型部品取り外し装置及び半導体パッケージの製造方法
DE102019105031B4 (de) * 2019-02-27 2022-03-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Vorrichtung und Verfahren zum Ersatz von mindestens einem Chip

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60261664A (ja) * 1984-06-07 1985-12-24 Mitsubishi Electric Corp リフロソルダリング方法
JPS61289964A (ja) * 1985-06-18 1986-12-19 Fuji Electric Co Ltd ろう付け方法
JPH0426572U (enrdf_load_stackoverflow) * 1990-06-27 1992-03-03
JPH05198621A (ja) * 1992-01-21 1993-08-06 Matsushita Electric Ind Co Ltd フリップチップｉｃの実装装置
JPH1041360A (ja) * 1996-07-26 1998-02-13 Haibetsuku:Kk 被加熱対象物の選択的脱着方法
JP2001185841A (ja) * 1999-12-27 2001-07-06 Suzuka Fuji Xerox Co Ltd 電子部品取付用加熱溶融装置
JP4331069B2 (ja) * 2004-07-29 2009-09-16 株式会社日立製作所 電子部品のリペア装置

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