JP2010160083A - プローブ組立体 - Google Patents
プローブ組立体 Download PDFInfo
- Publication number
- JP2010160083A JP2010160083A JP2009003103A JP2009003103A JP2010160083A JP 2010160083 A JP2010160083 A JP 2010160083A JP 2009003103 A JP2009003103 A JP 2009003103A JP 2009003103 A JP2009003103 A JP 2009003103A JP 2010160083 A JP2010160083 A JP 2010160083A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- slit
- probes
- needle tip
- longitudinal direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Liquid Crystal (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009003103A JP2010160083A (ja) | 2009-01-09 | 2009-01-09 | プローブ組立体 |
KR1020090133894A KR20100082712A (ko) | 2009-01-09 | 2009-12-30 | 프로브 조립체 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009003103A JP2010160083A (ja) | 2009-01-09 | 2009-01-09 | プローブ組立体 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2010160083A true JP2010160083A (ja) | 2010-07-22 |
Family
ID=42577344
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009003103A Pending JP2010160083A (ja) | 2009-01-09 | 2009-01-09 | プローブ組立体 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2010160083A (ko) |
KR (1) | KR20100082712A (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012037362A (ja) * | 2010-08-06 | 2012-02-23 | Micronics Japan Co Ltd | プローブユニット及び検査装置 |
JP2012132891A (ja) * | 2010-12-03 | 2012-07-12 | Micronics Japan Co Ltd | プローブ組立体 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101142462B1 (ko) * | 2010-06-07 | 2012-05-08 | 한국광기술원 | 미세 피치 폭을 가지는 엘시디 패널 검사용 프로브블록 및 그 제작 방법 |
-
2009
- 2009-01-09 JP JP2009003103A patent/JP2010160083A/ja active Pending
- 2009-12-30 KR KR1020090133894A patent/KR20100082712A/ko not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012037362A (ja) * | 2010-08-06 | 2012-02-23 | Micronics Japan Co Ltd | プローブユニット及び検査装置 |
JP2012132891A (ja) * | 2010-12-03 | 2012-07-12 | Micronics Japan Co Ltd | プローブ組立体 |
Also Published As
Publication number | Publication date |
---|---|
KR20100082712A (ko) | 2010-07-19 |
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