JP2010153882A5 - - Google Patents

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Publication number
JP2010153882A5
JP2010153882A5 JP2010015596A JP2010015596A JP2010153882A5 JP 2010153882 A5 JP2010153882 A5 JP 2010153882A5 JP 2010015596 A JP2010015596 A JP 2010015596A JP 2010015596 A JP2010015596 A JP 2010015596A JP 2010153882 A5 JP2010153882 A5 JP 2010153882A5
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JP
Japan
Prior art keywords
circuit
substrate
material according
group
electrode
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Granted
Application number
JP2010015596A
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English (en)
Japanese (ja)
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JP4844677B2 (ja
JP2010153882A (ja
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Priority to JP2010015596A priority Critical patent/JP4844677B2/ja
Priority claimed from JP2010015596A external-priority patent/JP4844677B2/ja
Publication of JP2010153882A publication Critical patent/JP2010153882A/ja
Publication of JP2010153882A5 publication Critical patent/JP2010153882A5/ja
Application granted granted Critical
Publication of JP4844677B2 publication Critical patent/JP4844677B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2010015596A 2010-01-27 2010-01-27 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 Expired - Fee Related JP4844677B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010015596A JP4844677B2 (ja) 2010-01-27 2010-01-27 回路接続材料、回路部材の接続構造及び回路部材の接続方法。

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010015596A JP4844677B2 (ja) 2010-01-27 2010-01-27 回路接続材料、回路部材の接続構造及び回路部材の接続方法。

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2005137627A Division JP4844003B2 (ja) 2005-05-10 2005-05-10 回路接続材料、回路部材の接続構造及び回路部材の接続方法。

Publications (3)

Publication Number Publication Date
JP2010153882A JP2010153882A (ja) 2010-07-08
JP2010153882A5 true JP2010153882A5 (cg-RX-API-DMAC7.html) 2010-10-28
JP4844677B2 JP4844677B2 (ja) 2011-12-28

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ID=42572530

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010015596A Expired - Fee Related JP4844677B2 (ja) 2010-01-27 2010-01-27 回路接続材料、回路部材の接続構造及び回路部材の接続方法。

Country Status (1)

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JP (1) JP4844677B2 (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120068751A (ko) * 2010-07-26 2012-06-27 히다치 가세고교 가부시끼가이샤 접착제 조성물, 접속 구조체, 접속 구조체의 제조 방법 및 접착제 조성물의 용도
CN105176471A (zh) * 2010-07-26 2015-12-23 日立化成工业株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法、以及粘接剂组合物的应用
TWI580745B (zh) * 2011-12-16 2017-05-01 日立化成股份有限公司 接著劑組成物、膜狀接著劑、接著片、連接結構體及連接結構體的製造方法
TWI579360B (zh) * 2011-12-16 2017-04-21 日立化成股份有限公司 接著劑組成物、膜狀接著劑、接著片、連接結構體及連接結構體的製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000239642A (ja) * 1999-02-23 2000-09-05 Toyobo Co Ltd 反応性ホットメルト接着剤組成物
US6762249B1 (en) * 1999-08-25 2004-07-13 Hitachi Chemical Company, Ltd. Wiring-connecting material and process for producing circuit board with the same
JP4235895B2 (ja) * 2002-04-18 2009-03-11 東洋紡績株式会社 昇華型感熱転写記録材用ポリエステルフィルムおよびその製造方法
JP4470091B2 (ja) * 2003-08-11 2010-06-02 東洋紡績株式会社 ポリウレタン樹脂組成物、積層体およびフレキシブルプリント配線板

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