JP2010153571A5 - - Google Patents
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- Publication number
- JP2010153571A5 JP2010153571A5 JP2008329733A JP2008329733A JP2010153571A5 JP 2010153571 A5 JP2010153571 A5 JP 2010153571A5 JP 2008329733 A JP2008329733 A JP 2008329733A JP 2008329733 A JP2008329733 A JP 2008329733A JP 2010153571 A5 JP2010153571 A5 JP 2010153571A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- wiring
- wiring groove
- groove
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000945 filler Substances 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 7
- 229910052751 metal Inorganic materials 0.000 claims 7
- 230000001678 irradiating effect Effects 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 3
- 238000010030 laminating Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 2
- 150000002739 metals Chemical class 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008329733A JP2010153571A (ja) | 2008-12-25 | 2008-12-25 | 配線基板及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008329733A JP2010153571A (ja) | 2008-12-25 | 2008-12-25 | 配線基板及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010153571A JP2010153571A (ja) | 2010-07-08 |
| JP2010153571A5 true JP2010153571A5 (enrdf_load_stackoverflow) | 2012-01-05 |
Family
ID=42572348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008329733A Pending JP2010153571A (ja) | 2008-12-25 | 2008-12-25 | 配線基板及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010153571A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014050871A1 (ja) * | 2012-09-27 | 2014-04-03 | 積水化学工業株式会社 | 多層基板の製造方法、多層絶縁フィルム及び多層基板 |
| JP6162458B2 (ja) * | 2013-04-05 | 2017-07-12 | 新光電気工業株式会社 | 配線基板、半導体装置及び配線基板の製造方法 |
| JP7397718B2 (ja) * | 2020-02-28 | 2023-12-13 | 京セラ株式会社 | 印刷配線板及び印刷配線板の製造方法 |
| JP2021197403A (ja) * | 2020-06-10 | 2021-12-27 | 凸版印刷株式会社 | 多層配線基板及び多層配線基板の製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69418698T2 (de) * | 1994-04-14 | 1999-10-07 | Hewlett-Packard Gmbh | Verfahren zur Herstellung von Leiterplatten |
| JP2002324978A (ja) * | 2001-04-24 | 2002-11-08 | Kyocera Corp | 多層配線基板 |
| JP4895448B2 (ja) * | 2001-09-27 | 2012-03-14 | 京セラ株式会社 | 多層配線基板 |
| JP2005243831A (ja) * | 2004-02-25 | 2005-09-08 | Ngk Spark Plug Co Ltd | セラミック配線基板及びその製造方法、並びにそれを用いた部品実装済み配線基板 |
| JP4592333B2 (ja) * | 2004-05-31 | 2010-12-01 | 三洋電機株式会社 | 回路装置およびその製造方法 |
| JP4439336B2 (ja) * | 2004-06-02 | 2010-03-24 | 三洋電機株式会社 | 回路装置の製造方法 |
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2008
- 2008-12-25 JP JP2008329733A patent/JP2010153571A/ja active Pending