JP2010153521A5 - - Google Patents

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Publication number
JP2010153521A5
JP2010153521A5 JP2008328904A JP2008328904A JP2010153521A5 JP 2010153521 A5 JP2010153521 A5 JP 2010153521A5 JP 2008328904 A JP2008328904 A JP 2008328904A JP 2008328904 A JP2008328904 A JP 2008328904A JP 2010153521 A5 JP2010153521 A5 JP 2010153521A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008328904A
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JP2010153521A (ja
JP5058144B2 (ja
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Priority to JP2008328904A priority Critical patent/JP5058144B2/ja
Priority claimed from JP2008328904A external-priority patent/JP5058144B2/ja
Priority to US12/644,477 priority patent/US7985629B2/en
Publication of JP2010153521A publication Critical patent/JP2010153521A/ja
Publication of JP2010153521A5 publication Critical patent/JP2010153521A5/ja
Application granted granted Critical
Publication of JP5058144B2 publication Critical patent/JP5058144B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008328904A 2008-12-25 2008-12-25 半導体素子の樹脂封止方法 Expired - Fee Related JP5058144B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008328904A JP5058144B2 (ja) 2008-12-25 2008-12-25 半導体素子の樹脂封止方法
US12/644,477 US7985629B2 (en) 2008-12-25 2009-12-22 Resin sealing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008328904A JP5058144B2 (ja) 2008-12-25 2008-12-25 半導体素子の樹脂封止方法

Publications (3)

Publication Number Publication Date
JP2010153521A JP2010153521A (ja) 2010-07-08
JP2010153521A5 true JP2010153521A5 (ja) 2011-11-10
JP5058144B2 JP5058144B2 (ja) 2012-10-24

Family

ID=42285444

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008328904A Expired - Fee Related JP5058144B2 (ja) 2008-12-25 2008-12-25 半導体素子の樹脂封止方法

Country Status (2)

Country Link
US (1) US7985629B2 (ja)
JP (1) JP5058144B2 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110191933B (zh) * 2017-01-20 2022-01-14 三井化学东赛璐株式会社 粘着性膜及电子装置的制造方法
CN109659267B (zh) * 2018-12-21 2021-04-23 中芯集成电路（宁波）有限公司 半导体器件制作方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3094481B2 (ja) * 1991-03-13 2000-10-03 松下電器産業株式会社 電子回路装置とその製造方法
CN1117395C (zh) * 1994-03-18 2003-08-06 日立化成工业株式会社 半导体组件的制造方法及半导体组件
JP4283987B2 (ja) 2000-11-20 2009-06-24 富士フイルム株式会社 感光性熱硬化性樹脂組成物、それを用いた感光性熱硬化性樹脂層転写材料及び画像形成方法
TW200302685A (en) * 2002-01-23 2003-08-01 Matsushita Electric Ind Co Ltd Circuit component built-in module and method of manufacturing the same
JP4159431B2 (ja) * 2002-11-15 2008-10-01 株式会社ルネサステクノロジ 半導体装置の製造方法
JPWO2004070826A1 (ja) * 2003-02-06 2006-06-01 富士通株式会社 電極間接続構造体の形成方法および電極間接続構造体
JP4865197B2 (ja) * 2004-06-30 2012-02-01 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP4477966B2 (ja) * 2004-08-03 2010-06-09 株式会社ルネサステクノロジ 半導体装置の製造方法
JP4874005B2 (ja) * 2006-06-09 2012-02-08 富士通セミコンダクター株式会社 半導体装置、その製造方法及びその実装方法

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