JP2010141098A5 - - Google Patents
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- Publication number
- JP2010141098A5 JP2010141098A5 JP2008315513A JP2008315513A JP2010141098A5 JP 2010141098 A5 JP2010141098 A5 JP 2010141098A5 JP 2008315513 A JP2008315513 A JP 2008315513A JP 2008315513 A JP2008315513 A JP 2008315513A JP 2010141098 A5 JP2010141098 A5 JP 2010141098A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- wiring board
- built
- substrate
- prepreg resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 5
- 230000000149 penetrating effect Effects 0.000 claims 5
- 239000003365 glass fiber Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008315513A JP2010141098A (ja) | 2008-12-11 | 2008-12-11 | 電子部品内蔵基板及びその製造方法 |
| US12/635,066 US8559184B2 (en) | 2008-12-11 | 2009-12-10 | Electronic component built-in substrate and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008315513A JP2010141098A (ja) | 2008-12-11 | 2008-12-11 | 電子部品内蔵基板及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010141098A JP2010141098A (ja) | 2010-06-24 |
| JP2010141098A5 true JP2010141098A5 (enExample) | 2012-01-12 |
Family
ID=42240265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008315513A Pending JP2010141098A (ja) | 2008-12-11 | 2008-12-11 | 電子部品内蔵基板及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8559184B2 (enExample) |
| JP (1) | JP2010141098A (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011187681A (ja) * | 2010-03-09 | 2011-09-22 | Toshiba Corp | 半導体装置の製造方法および半導体装置 |
| EP2592915B1 (en) * | 2010-07-06 | 2022-01-26 | Fujikura, Ltd. | Manufacturing method for laminated wiring board |
| US8472207B2 (en) * | 2011-01-14 | 2013-06-25 | Harris Corporation | Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods |
| US8649183B2 (en) | 2011-02-10 | 2014-02-11 | Mulpin Research Laboratories, Ltd. | Electronic assembly |
| TWI425886B (zh) * | 2011-06-07 | 2014-02-01 | 欣興電子股份有限公司 | 嵌埋有電子元件之封裝結構及其製法 |
| KR20130097481A (ko) * | 2012-02-24 | 2013-09-03 | 삼성전자주식회사 | 인쇄회로기판(ｐｃｂ) 및 그 ｐｃｂ를 포함한 메모리 모듈 |
| JP5285819B1 (ja) * | 2012-11-07 | 2013-09-11 | 太陽誘電株式会社 | 電子回路モジュール |
| KR101420526B1 (ko) * | 2012-11-29 | 2014-07-17 | 삼성전기주식회사 | 전자부품 내장기판 및 그 제조방법 |
| US10264664B1 (en) * | 2015-06-04 | 2019-04-16 | Vlt, Inc. | Method of electrically interconnecting circuit assemblies |
| US10785871B1 (en) * | 2018-12-12 | 2020-09-22 | Vlt, Inc. | Panel molded electronic assemblies with integral terminals |
| DE102017209249A1 (de) * | 2017-05-31 | 2018-12-06 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur herstellung eines packages und package |
| KR20190012485A (ko) * | 2017-07-27 | 2019-02-11 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조 방법 |
| WO2019026835A1 (ja) * | 2017-08-04 | 2019-02-07 | 株式会社フジクラ | 多層プリント配線板の製造方法及び多層プリント配線板 |
| US10553563B2 (en) * | 2018-05-30 | 2020-02-04 | Epistar Corporation | Electronic device |
| US10790232B2 (en) * | 2018-09-15 | 2020-09-29 | International Business Machines Corporation | Controlling warp in semiconductor laminated substrates with conductive material layout and orientation |
| KR102854182B1 (ko) * | 2020-07-06 | 2025-09-03 | 삼성전기주식회사 | 전자부품 내장기판 |
| KR20220106561A (ko) * | 2021-01-22 | 2022-07-29 | 삼성전자주식회사 | 양면 배치형 전자 부품 모듈 및 그를 포함하는 전자장치 |
| CN115954330A (zh) * | 2023-02-03 | 2023-04-11 | 长鑫存储技术有限公司 | 封装结构及其制备方法 |
| WO2024165189A1 (en) * | 2023-02-09 | 2024-08-15 | Microchip Technology Caldicot Limited | Pcb stack with embedded component package and sintered vias |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3619395B2 (ja) * | 1999-07-30 | 2005-02-09 | 京セラ株式会社 | 半導体素子内蔵配線基板およびその製造方法 |
| KR100335717B1 (ko) * | 2000-02-18 | 2002-05-08 | 윤종용 | 고용량 메모리 카드 |
| TW550997B (en) * | 2001-10-18 | 2003-09-01 | Matsushita Electric Industrial Co Ltd | Module with built-in components and the manufacturing method thereof |
| US7485489B2 (en) * | 2002-06-19 | 2009-02-03 | Bjoersell Sten | Electronics circuit manufacture |
| US7394663B2 (en) * | 2003-02-18 | 2008-07-01 | Matsushita Electric Industrial Co., Ltd. | Electronic component built-in module and method of manufacturing the same |
| JP4287733B2 (ja) * | 2003-11-04 | 2009-07-01 | 日本シイエムケイ株式会社 | 電子部品内蔵多層プリント配線板 |
| JP2006156669A (ja) * | 2004-11-29 | 2006-06-15 | Dainippon Printing Co Ltd | 部品内蔵配線板、部品内蔵配線板の製造方法 |
| JP2007173570A (ja) * | 2005-12-22 | 2007-07-05 | Matsushita Electric Ind Co Ltd | 半導体装置、その製造方法、および半導体装置を備えた電子機器 |
| US8093506B2 (en) * | 2006-12-21 | 2012-01-10 | Ngk Spark Plug Co., Ltd. | Multilayer wiring board and power supply structure to be embedded in multilayer wiring board |
| JP2008205290A (ja) * | 2007-02-21 | 2008-09-04 | Fujitsu Ltd | 部品内蔵基板及びその製造方法 |
-
2008
- 2008-12-11 JP JP2008315513A patent/JP2010141098A/ja active Pending
-
2009
- 2009-12-10 US US12/635,066 patent/US8559184B2/en not_active Expired - Fee Related
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