JP2010082614A - Coating unit, pattern correcting device and pattern correcting method using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a coating unit capable of easily correcting a fine pattern of ≤10 μm without damaging a substrate even when the surface of the substrate has unevenness. <P>SOLUTION: The coating unit 1 is configured such that a lower end of a cylindrical member 2 closed with a film 3 to form a throughhole 3a on the center part of the film 3, correcting paste 4 is ejected on the film 3, the film 3 and the substrate 13 are made to face each other with a certain space therebetween in a state that an open defect part 14a and the throughhole 3a are positioned, a gas is ejected through a nozzle 6 to the center part of the film 3, the center part of the film 3 is projected downward to be brought into contact with the substrate 13 and the correcting paste 4 is applied on the open defect part 14a through the throughhole 3a. Then even when the surface of the substrate has uneveness, the correcting paste 4 is applied to the substrate 13 without locally pushing the substrate 13 hard. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a coating apparatus, a pattern correction apparatus and a pattern correction method using the same, and more particularly, a coating apparatus for applying a correction liquid to a defective portion of a fine pattern formed on a substrate, and a pattern correction apparatus using the same. And a pattern correction method. More specifically, the present invention can correct an open defect (disconnection defect) in a pattern (wiring), a white defect in a liquid crystal color filter, a mask defect, and the like that occur in a flat panel display manufacturing process. The present invention relates to a coating apparatus, a pattern correction apparatus using the same, and a pattern correction method.

  In recent years, with the increase in size and definition of flat panel displays such as liquid crystal displays, plasma displays, and EL displays, defects have occurred in the wiring on the substrate in the display manufacturing process, and the colored layers of the liquid crystal color filters. There is a high probability that defects will occur. For this reason, a method for improving the yield and correcting various defects has been proposed.

  For example, a fine pattern, for example, an electrode (wiring) is formed on the surface of a glass substrate of a liquid crystal display. If this wiring is disconnected, apply conductive correction paste (correction liquid) attached to the tip of the application needle to the open defect, and apply the wiring several times while shifting the application position in the length direction of the electrode. Is corrected (for example, see Patent Document 1).

  There is also a coating apparatus including a container in which a through hole is opened at the bottom thereof and a correction paste (correction liquid) is injected, and an application needle having a diameter substantially the same as the through hole. In this coating device, the tip of the application needle is immersed in the correction paste during standby, and the tip of the application needle protrudes under the container through the through-hole during application and is corrected to adhere to the tip of the application needle. A paste is apply | coated to a defective part (for example, refer patent document 2).

JP-A-8-292442 JP 2006-310266 A

  However, in the method of correcting the open defect portion using the application needle, the correction paste adhering to the flat surface at the tip of the application needle is transferred to the open defect portion, so the application diameter of the correction paste is the diameter of the flat surface at the tip of the application needle. Determined by. Therefore, it is difficult to realize a coating diameter of about 10 μm, and it is difficult to form a thin line using this.

Further, since the flat surface at the tip of the application needle is very small, the surface pressure increases even if the movable part including the application needle is lightweight. For example, even if the weight of the movable part including the application needle is as light as about 10 g, if the diameter of the flat surface at the tip of the application needle is 50 μm, the surface pressure is about 5 kg / mm ² . Therefore, when a minute protrusion exists in the vicinity of the defective portion, it is assumed that the protrusion is crushed or the surface pressure is locally increased. In addition, it is conceivable that the correction paste cannot be applied to the defective portion because the protrusion interferes.

  Therefore, a main object of the present invention is to provide a coating apparatus capable of easily correcting a fine pattern of 10 μm or less without damaging the substrate even when the substrate surface is uneven, and pattern correction using the same. An apparatus and a pattern correction method are provided.

  A coating apparatus according to the present invention is a coating apparatus that applies a correction liquid to a defective portion of a fine pattern formed on a substrate, and at least a part of the bottom thereof is formed of a film, and the film corresponds to the defective portion. A through-hole having a shape is opened and a container into which a correction liquid is injected is provided. The film and the substrate face each other with a gap in a state where the defect portion and the through hole are aligned. The coating device further has a nozzle at the tip thereof facing the opening on the upper side of the through-hole, and a nozzle provided substantially perpendicular to the upper surface of the film, and gas is injected through the nozzle. And a gas jetting means for projecting a range including the through hole in the film downward, bringing the lower opening of the through hole into contact with the substrate, and applying the correction liquid to the defective part through the through hole. .

Preferably, the film is a resin film.
Preferably, the film is deformed downward by the pressure of the gas injected from the tip of the nozzle, and returns to the original position by the restoring force when the gas injection is stopped.

Preferably, the through hole is formed by laser ablation.
Preferably, the opening at the upper end of the container is closed with a lid, and the base end of the nozzle is fixed to the lid of the container so that the tip of the nozzle does not come into contact with the correction liquid.

  Preferably, a vent is formed in the lid for allowing the gas injected from the nozzle to escape to the outside of the container.

  Another coating apparatus according to the present invention is a coating apparatus for applying a correction liquid to a defective portion of a fine pattern formed on a substrate, and at least a part of the bottom is formed of a film, and the film is defective. A through-hole having a shape corresponding to the part is opened, and a container into which correction fluid is injected is provided. The film and the substrate face each other with a gap in a state where the defect portion and the through hole are aligned. The coating apparatus further supplies gas into the container to increase the pressure in the container, and projects the range including the through hole in the film downward to bring the opening below the through hole into contact with the substrate. The gas injection means for applying the correction liquid to the defective portion through the through hole is provided.

Preferably, the gas comprises a solvent vapor of the correction fluid.
Further preferably, the gas injection means includes a solvent vapor generating section for generating a vapor of the solvent of the correction liquid.

  Further preferably, the gas injection means further comprises a selection means for selecting one of a gas containing the solvent vapor of the correction liquid and a gas not containing the vapor of the correction liquid solvent. The gas selected by the means is injected.

  Still another coating apparatus according to the present invention is a coating apparatus for applying a correction liquid to a defective portion of a fine pattern formed on a substrate, and at least a part of the bottom of the coating apparatus is formed of a film. A through-hole having a shape corresponding to the defective portion is opened, and a container into which a correction liquid is injected is provided. The film and the substrate face each other with a gap in a state where the defect portion and the through hole are aligned. The coating apparatus further includes a first nozzle provided at a front end of the nozzle facing the opening on the upper side of the through-hole, and substantially perpendicular to the upper surface of the film, and a first nozzle The gas is injected through the substrate, the range including the through hole in the film is projected downward, the lower opening of the through hole is brought into contact with the substrate, and the correction liquid is applied to the defective portion through the through hole. The first gas injection means, the second nozzle provided at the tip of the injection nozzle, and the gas containing the solvent of the correction liquid were injected through the second nozzle and injected into the container. Second gas injection means for suppressing drying of the correction fluid.

  Preferably, the apparatus further includes a solvent vapor generating means provided in the container, which suppresses drying of the correction liquid in the container by generating a vapor of the correction liquid solvent.

  Further preferably, the apparatus further includes a solvent vapor supply means for supplying the solvent vapor of the correction liquid to a range including at least the through-hole on the back surface of the film and suppressing drying of the correction liquid.

  Moreover, a pattern correction apparatus according to the present invention is a pattern correction apparatus that includes the above-described coating apparatus and corrects a defective portion of a fine pattern formed on a substrate. It is characterized by comprising positioning means for allowing the film and the substrate to face each other with a gap in a state where the holes are aligned.

  Preferably, the positioning means includes a rotation mechanism that rotates the container so that the length direction of the through hole matches the extending direction of the fine pattern.

  Preferably, a plurality of coating devices having different through hole shapes are provided, and the positioning unit relatively moves the coating device selected from the plurality of coating devices and the substrate.

  The pattern correction method according to the present invention is a pattern correction method for correcting a defect portion of a fine pattern formed on a substrate, wherein at least a part of the bottom is formed of a film, and the film is subjected to a defect portion. A through-hole of a different shape is opened, and the container into which the correction liquid is injected and the injection port at the tip of the container face each other with a gap in the opening above the through-hole, and are provided substantially perpendicular to the upper surface of the film A step in which the film and the substrate are opposed to each other with a gap between the film and the substrate in a state in which the defective portion and the through hole are aligned, and a gas is injected through the nozzle, and a range including the through hole in the film is included. Projecting downward and bringing the lower opening of the through-hole into contact with the substrate, applying the correction liquid to the defective portion through the through-hole, and stopping the gas injection to separate the film from the substrate; Do It is characterized in.

  Preferably, the gas comprises a solvent vapor of the correction fluid.

  In the coating apparatus and the pattern correction apparatus according to the present invention, at least a part of the bottom is formed of a film, a through-hole having a shape corresponding to the defective portion is opened in the film, and a container into which correction liquid is injected is provided. With the defect and the through hole aligned, the film and the substrate face each other with a gap between them, and the spray port at the tip of the film faces the opening on the upper side of the through hole. A nozzle provided substantially perpendicular to the nozzle, and gas is injected through the nozzle, the range including the through hole in the film is projected downward, and the lower opening of the through hole is brought into contact with the substrate to penetrate. Gas injection means for applying the correction liquid to the defective part through the hole is provided. Therefore, even when the surface of the substrate is uneven, the correction liquid can be applied without strongly pressing the substrate locally, and a fine pattern of 10 μm or less can be easily corrected without damaging the substrate. it can.

  Further, in another coating apparatus and pattern correction apparatus according to the present invention, a container in which at least a part of the bottom is formed of a film, a through-hole having a shape corresponding to a defective portion is opened in the film, and correction liquid is injected The film and the substrate face each other with a gap in a state where the defect portion and the through hole are aligned, and further, gas is supplied into the container to increase the pressure in the container, Gas injection means for projecting the range including the hole downward, bringing the lower opening of the through hole into contact with the substrate, and applying the correction liquid to the defective part through the through hole is provided. Therefore, even when the surface of the substrate is uneven, the correction liquid can be applied without strongly pressing the substrate locally, and a fine pattern of 10 μm or less can be easily corrected without damaging the substrate. it can.

  Further, in still another coating apparatus and pattern correction apparatus according to the present invention, at least a part of the bottom of the coating apparatus and the pattern correction apparatus is formed with a film, a through-hole having a shape corresponding to the defective portion is opened in the film, and the correction liquid is injected. In a state where the container is provided and the defect portion and the through hole are aligned with each other, the film and the substrate face each other with a gap between them, and the injection port at the tip of the film faces the opening portion on the upper side of the through hole. The first nozzle provided substantially perpendicular to the upper surface of the film, and the gas is injected through the first nozzle, and the range including the through hole of the film is projected downward to form the through hole. A first gas spraying means for contacting the lower opening with the substrate and applying the correction liquid to the defective part through the through hole; a second nozzle having a spray port at its tip provided in the container; Gas containing the solvent of the correction fluid through the second nozzle. Injecting, is provided with a second gas injection means to suppress the drying of the injected correction fluid in the container. Therefore, even when the surface of the substrate is uneven, the correction liquid can be applied without strongly pressing the substrate locally, and a fine pattern of 10 μm or less can be easily corrected without damaging the substrate. it can. Further, the correction liquid in the container can absorb the solvent, and drying of the correction liquid can be suppressed.

  Further, in the pattern correction method according to the present invention, at least a part of the bottom is formed of a film, a through hole having a shape corresponding to the defective portion is opened in the film, and a container into which the correction liquid is injected, and a tip of the container The injection port is opposed to the opening on the upper side of the through hole with a gap, provided with a nozzle provided substantially perpendicular to the upper surface of the film, and the film and the substrate in a state where the defect portion and the through hole are aligned. With a gap between them, injecting gas through the nozzle, projecting the area of the film including the through-hole downward, bringing the lower opening of the through-hole into contact with the substrate, and through the through-hole. Then, the correction liquid is applied to the defective portion, the gas injection is stopped, and the film is peeled off from the substrate. Therefore, even when the surface of the substrate is uneven, the correction liquid can be applied without strongly pressing the substrate locally, and a fine pattern of 10 μm or less can be easily corrected without damaging the substrate. it can.

It is sectional drawing which shows the structure of the coating device by Embodiment 1 of this invention. It is sectional drawing which shows the process of opening the clearance gap between the through-hole shown in FIG. It is sectional drawing which shows the process of injecting gas through the nozzle shown in FIG. It is sectional drawing which shows the state after stopping the injection of gas shown in FIG. It is sectional drawing which shows the process of baking the correction pattern shown in FIG. FIG. 10 is a cross-sectional view showing a modification of the first embodiment. It is sectional drawing which shows the other example of a change of Embodiment 1. FIG. 10 is a cross-sectional view showing still another modification example of the first embodiment. FIG. 10 is a cross-sectional view showing still another modification example of the first embodiment. FIG. 10 is a cross-sectional view showing still another modification example of the first embodiment. It is the figure which looked at the application | coating unit shown in FIG. 1 from the downward direction. FIG. 10 is a cross-sectional view showing still another modification example of the first embodiment. It is a figure which shows the structure of the pattern correction apparatus provided with the coating unit shown in FIG. It is sectional drawing which shows the structure of the coating device by Embodiment 2 of this invention. FIG. 10 is a cross-sectional view showing a modified example of the second embodiment. It is sectional drawing which shows the other example of a change of Embodiment 2. FIG. 10 is a cross-sectional view showing still another modification of the second embodiment. FIG. 10 is a cross-sectional view showing still another modification of the second embodiment. FIG. 10 is a cross-sectional view showing still another modification of the second embodiment. FIG. 10 is a cross-sectional view showing still another modification of the second embodiment. It is a figure which shows the structure of the pattern correction apparatus provided with the coating device shown in FIG.

[Embodiment 1]
FIG. 1 is a diagram showing a configuration of a coating apparatus according to Embodiment 1 of the present invention. In FIG. 1, the coating apparatus includes a coating unit 1 and a gas injection device 8. The application unit 1 includes a cylindrical member 2. The opening at the lower end of the cylindrical member 2 is closed with a circular film 3. The outer peripheral portion of the film 3 is fixed to the lower end surface of the cylindrical member 2 in a state where a certain tension is applied to the film 3. The film 3 is, for example, a polyimide film, and the thickness thereof is, for example, about 10 to 25 μm.

  A through hole 3 a is formed in the approximate center of the film 3. The through hole 3a is processed into a shape (for example, a straight line shape) corresponding to an open defect portion of the wiring formed on the substrate to be corrected. When the film 3 is a polyimide film, the through hole 3a is processed by laser ablation using a pulse laser such as a YAG third harmonic laser, a YAG fourth harmonic laser, or an excimer laser. When the surface of the film 3 is irradiated with laser light to form the through hole 3a, burrs are generated at the edge of the through hole 3a on the back surface side of the film 3. In order to prevent the burrs from adversely affecting the shape of the correction pattern, it is preferable to direct the surface side of the film 3 without burrs to the outer side (lower side) of the coating unit 1.

  Further, when the formation of the through-hole 3a by laser ablation is completed, dust generated during laser ablation is scattered on the surface of the film 3 (laser irradiation surface). In order to remove such dust, a low-power laser beam may be irradiated to a wide range of the film 3 around the through hole 3a. At this time, it is possible to remove only dust by switching to the YAG second harmonic laser and irradiating a low-power laser beam over a wide range centering on the through-hole 3a. Can be prevented. As the laser, a laser that can selectively emit one of two types of laser light, that is, laser light for opening the through-hole 3a and laser light for removing dust is preferably used.

  The correction paste 4 is injected into the bottom of the coating unit 1. As the correction paste 4, when the correction target is a wiring, a metal nano paste such as gold or silver is used. For example, a gold nano paste having a viscosity of about 1 Pa · s to 20 Pa · s can be used. If the correction paste 4 has a high viscosity, the metal weight ratio is also high, so that the film thickness after firing can be made thicker and the resistance can be lowered.

  Further, the upper opening of the cylindrical member 2 is closed by a disc-shaped lid 5. A gas supply hole 5a for supplying gas is formed in the center of the lid 5, and one or two or more vent holes 5b are formed around the gas supply hole 5a. Below the center of the lid 5, a nozzle 6 is provided vertically downward. The lid 5 and the nozzle 6 are integrally formed, and the inside of the nozzle 6 communicates with the gas supply hole 5a. The injection port 6a at the tip of the nozzle 6 faces the through hole 3a of the film 3 with a predetermined gap. The gap between the tip of the nozzle 6 and the liquid surface of the correction paste 4 is set to about 1 mm to 2 mm, for example.

  An outlet of the joint 7 is connected to the gas supply hole 5a of the lid 5, and an inlet of the joint 7 is connected to the gas injection device 8 through a pipe (not shown). The gas injection device 8 includes a regulator (R) 9 that adjusts the gas pressure, an electromagnetic valve (V) 10 that controls on / off of the gas flow into the nozzle 6, and a timer that controls the opening time of the electromagnetic valve 10. (T) 11. A gas supply source (G) 12 is connected to the regulator 9. As the gas, for example, nitrogen gas is used, but compressed air may be used as long as the correction paste 4 to be used does not deteriorate. The electromagnetic valve 10 may be controlled by a control computer or PLC (Programmable Logic Controller) without providing the timer 11.

  2-5 is a figure which shows the process of correcting an open defect part using this coating device. In FIG. 2, the coating unit 1 and the substrate 13 are relatively moved by a positioning device (not shown), and the through hole 3 a of the coating unit is positioned above the open defect portion 14 a generated in the wiring 14 on the substrate 13. Thus, the film 3 at the bottom of the coating unit 1 and the surface of the substrate 13 face each other with a predetermined gap G1. The gap G1 is set in a range in which the film 3 can be deformed to come into contact with the substrate 13 and the wiring 14, for example, about 10 μm to 200 μm.

  Next, the electromagnetic valve 10 is opened for the time set by the timer 11. As a result, as shown in FIG. 3, gas is injected from the tip of the nozzle 6 to a range including the through hole 3 a of the film 3, the film 3 is deformed by the pressure of the gas, and the central portion of the film 3 protrudes downward and penetrates. The lower surface of the film 3 in a range including the holes 3 a contacts the substrate 13. At this time, the correction paste 4 is applied to the open defect portion 14a through the through hole 3a. The gas injected into the container is discharged to the outside through the vent hole 5b.

  When the gas injection is stopped, as shown in FIG. 4, the film 3 in the range including the through hole 3 a is separated from the substrate 13 by the restoring force of the film 3, and the open defect portion 14 a has a correction substantially the same shape as the through hole 3 a. A pattern 4a is formed. The gas pressure and the injection time are adjusted to optimum values based on the results of experiments performed in advance. The gas injection time is, for example, 1 second or less. Further, the inner diameter of the injection port 6a of the nozzle 6 is set to a range in which the film 3 in the range including the through hole 3a can be brought into contact with the substrate 13, for example, about 0.1 mm to 1 mm. The gas pressure is set to about 0.1 to 0.3 MPa, for example.

  Thus, since gas is injected to the range containing the through-hole 3a, the correction paste 4 in the through-hole 3a is extruded by the gas below the through-hole 3a (board | substrate 13 side). For this reason, it becomes possible to make the film thickness of the correction pattern 4a thicker.

  If the width of the through hole 3a is smaller than the film thickness of the film 3, the force for holding the correction paste 4 in the through hole 3a tends to increase. For this reason, if the film 3 is simply brought into contact with the substrate 13, the correction paste 4 in the through hole 3a remains in the through hole 3a as it is, and the film thickness of the correction pattern 4a formed on the substrate 13 is very high. getting thin. For example, a film including a through hole 3a is formed after a through hole 3a having a width of 5 μm is formed in a film 3 having a thickness of 12.5 μm, and a gold nano correction paste 4 having a viscosity of 10 Pa · s is attached to the tip of a coating needle. When the pattern is formed by pressing 3 to the substrate 13 side, the thickness of the correction pattern 4a is as thin as about 0.4 μm. For this reason, the resistance value of the corrected portion cannot be lowered by one application and firing, and a plurality of applications and corrections are required for one defective portion 14a (Japanese Patent Laid-Open No. 2008-15340). reference).

  On the other hand, in this invention, since the correction paste 4 in the through-hole 3a is extruded by the pressure of the injected gas to the back surface side (board | substrate 13 side) of the film 3, the film thickness of the correction pattern 4a is made thick. Is possible. As described above, a through hole 3a having a width of 5 μm was formed in the film 3 having a thickness of 12.5 μm, and the gold nano correction paste 4 having a viscosity of 10 Pa · s was supplied onto the film 3 including the through hole 3a. Later, when the correction pattern 4a was formed by gas injection, the film thickness of the correction pattern 4a could be as thick as around 1.5 μm. As an example, when the modified pattern 4a having a width of 5 μm and a length of 50 μm was formed on the open defect portion 14a having a width of 5 μm and a length of 20 μm and fired, the resistance value of the corrected portion became 20Ω or less.

  Thereafter, as shown in FIG. 5, if necessary, the correction pattern 4a is baked and cured by using the baking apparatus 15 to obtain a conductive correction pattern 4A. As the baking apparatus 15, a YAG second continuous wave laser or the like is used. The correction pattern 4a may be radiated and baked, or may be baked while scanning the correction pattern 4a with the laser beam narrowed down.

  In the first embodiment, since the gas 3 is jetted to bring the film 3 into contact with the substrate 13 (the surface of the substrate 13 including the open defect portion 14a), the film 3 can be pressed uniformly. Even if the surface of the substrate 13 has irregularities, the film 3 comes into contact with the irregularities, so that the correction paste 4 can be applied to the open defect portion 14a without being affected by the irregularities. Further, since the load is not concentrated on the protrusions, the substrate 13 is not deformed or damaged. Moreover, since the high-viscosity correction paste 4 can be used as compared with a coating method using an inkjet or a dispenser, the resistance value of the correction portion can be further reduced.

  In addition, it is possible to perform defect correction repeatedly using the same coating unit 1, and the tact time of defect correction can be shortened. When the amount of the correction paste 4 in the coating unit 1 is reduced, the correction paste 4 may be replenished.

  Moreover, when correcting the some open defect part 14a using the same coating | coated unit 1, use time becomes long, the correction paste 4 in the coating | coated unit 1 may dry, and the shape of the correction pattern 4a may become unstable. Since it is assumed, it is good to prevent drying using the correction paste 4 containing a high boiling point solvent.

  Further, when the open defect portion 14a in the vicinity of the unfired correction pattern 4a is corrected, the existing correction pattern 4a adheres to the back surface of the film 3 and the existing correction pattern 4a is crushed, or the back surface of the film 3 is Since the case where it contaminates is assumed, it is desirable to bake the existing correction pattern 4a in such a case.

  Hereinafter, various modifications of the first embodiment will be described. In the modified example of FIG. 6, the correction paste 4 having high viscosity is used, and the correction paste 4 is injected only in a range including the through holes 3 a in the film 3. In this case, the number of times that the same application unit 1 can be applied is reduced, but the amount of the expensive correction paste 4 can be greatly reduced, and the correction cost can be reduced.

  Further, in the modified example of FIG. 7, the coating unit 1 is replaced with the coating unit 20. The difference between the coating unit 20 and the coating unit 1 is that a groove 3b is formed across the through hole 3a in a range including the through hole 3a on the upper surface of the film 3. In this modified example, the groove 3b becomes a paste pool, and more correction paste 4 can be held in a range including the through hole 3a.

  Further, in the modified example of FIG. 8, the coating unit 1 is replaced with the coating unit 21. The difference between the coating unit 21 and the coating unit 1 is that the lid 5 does not have a vent hole 5b. In this case, when gas is supplied into the coating unit 21 via the joint 7, the internal pressure of the coating unit 21 increases, the film 3 is deformed, and the central portion of the film 3 protrudes downward. At this time, the through hole 3a contacts the open defect portion 14a, and the correction paste 4 is applied to the open defect portion 14a. When the supply of gas is stopped and the inside of the coating unit 21 is opened to the atmosphere, the film 3 returns to the original state by the restoring force of the film 3. Even in this modified example, the same effect as the embodiment can be obtained.

  Further, in the modified example of FIG. 9, the coating unit 1 is replaced with the coating unit 22. This application unit 22 is different from the application unit 21 in that the nozzle 6 is removed. Also in this modified example, the correction paste 4 can be applied to the open defect portion 14a by the same method as in the modified example of FIG.

  Further, in the modified example of FIG. 10, the coating unit 1 is replaced with the coating unit 23. The application unit 23 is different from the application unit 1 in that the cylindrical member 2 and the film 3 are replaced with a bottomed container 24. The container 24 is obtained by integrating the cylindrical member 2 and the film 3. The bottom of the container 24 is formed as thin as the film 3. A through-hole 24a having a shape corresponding to the open defect portion 14a is formed in the approximate center of the bottom of the container 24. As the material of the container 24, a resin material or a metal material may be used. Even in this modified example, the same effect as the embodiment can be obtained. In the application unit 23, the vent hole 5b and the nozzle 6 are provided, but they may be removed as in the modified examples of FIGS.

  Moreover, FIG. 11 is the figure which looked at the coating unit 1 from the downward direction. In FIG. 11, the through hole 3 a is formed in a straight line at the approximate center of the film 3. In this state, since the application angle of the correction pattern 4a is limited, the open defect portion 14a that can be corrected is limited. Therefore, in the modified example of FIG. 12, the rotation mechanism 25 is provided in the coating unit 1. Thereby, even when the direction of the through-hole 3a and the wiring 14 is different, the coating unit 1 is rotated by the rotation mechanism 25, and the length direction of the through-hole 3a is matched with the extending direction of the wiring 14, and the correction paste 4 is applied. It becomes possible.

  When the open defect portion 14a is long and requires a long correction pattern 4a, the open defect portion 14a is divided into a plurality of sections in the length direction, and the through holes 3a are aligned for each section. The correction paste 4 may be applied. Alternatively, if a plurality of coating units 1 are prepared and the shape and length of each through-hole 3a are changed, the optimum coating unit 1 is selected and corrected according to the shape and length of the open defect portion 14a. This makes it possible to expand the applicable range of the correction and shorten the tact time of the correction.

  FIG. 13 is a diagram illustrating a configuration of a pattern correction apparatus including the coating unit 1. In FIG. 13, in the pattern correction device 30, a gantry type XY stage 32 is mounted on a surface plate 31. The XY stage 32 includes an X-axis stage 32a that moves in the left-right direction in the drawing, and a portal-shaped Y-axis stage 32b that can move in a direction perpendicular to the paper surface. The X-axis stage 32a is provided with a Z-axis stage 33 that can move in the vertical direction. On the Z-axis stage 33, an observation optical system 34, a laser 35, an objective lens 36, and a baking apparatus 15 are mounted. The laser 35 is provided on the observation optical system 34, and the objective lens 36 is provided on the lower end of the observation optical system 34. The Z-axis stage 33 is provided with an XYZ stage 37, and the coating unit 1 is mounted on the XYZ stage 37. A chuck 38 is provided on the surface plate 31, and the substrate 13 is fixed horizontally by the chuck 38.

  By driving the XY stage 32 and the Z-axis stage 33, the observation optical system 34, the laser 35, the objective lens 36, the baking apparatus 15, and the coating unit 1 can be positioned above a desired position on the surface of the substrate 13. It has become. Further, by driving the XYZ stage 37, the film 3 and the surface of the substrate 13 can be opposed to each other with a predetermined gap G1 in a state where the through hole 3a is positioned above the open defect portion 14a. The observation optical system 34 is used for observation of the open defect portion 14a and the correction patterns 4a and 4A. The laser 35 is used for processing the through hole 3a of the film 3, shaping the open defect portion 14a, and removing unnecessary portions of the correction patterns 4a and 4A.

  In addition, you may provide the rotation mechanism 25 which rotates the coating unit 1 as needed. Moreover, you may provide the apparatus which selects the some coating unit 1 and the desired coating unit 1 among them, and sets it to the XYZ stage 37. FIG.

[Embodiment 2]
When correcting a plurality of open defect portions 14a using the same application unit 1, the correction paste 4 in the application unit 1 is dried over time, and the correction pattern 4a applied to the open defect portion 14a is interrupted or has a shape. It may be tapered or the through hole 3a may be clogged. In the second embodiment, this problem can be solved.

  FIG. 14 is a diagram showing a configuration of a coating apparatus according to Embodiment 2 of the present invention, and is compared with FIG. In FIG. 14, this coating apparatus is different from the coating apparatus of FIG. 1 in that the gas injection device 8 is replaced with a gas injection device 40. The gas injection device 40 is obtained by adding a solvent vapor generation unit 41 to the gas injection device 8. The solvent vapor generation unit 41 includes a container 42 and a pipe 43. One end of the pipe 43 is connected to the outlet of the electromagnetic valve 10, and the other end passes through the upper end of the side wall of the container 42 and is bent to the bottom side of the container 42. Moreover, the exit 42a is provided in the upper end part of the side wall of the container 42, and the exit 42a of the container 42 is connected to the inlet of the coupling 7 through piping.

  A solvent 44 of the correction paste 4 is injected into the container 42, and the container 42 is filled with the vapor of the solvent 44. The solvent 44 of the correction paste 4 is a solvent contained in the correction paste 4 (for example, a solvent that disperses metal fine particles contained in the correction paste 4) or a solvent that can dilute the correction paste 4. For example, when the diluent of the correction paste 4 is terpineol, terpineol is injected into the container 42 as the solvent 44.

  In addition, when the container 42 into which the solvent 44 is injected moves with the defect correction, it is assumed that the liquid level of the solvent 44 is shaken and the solvent 44 flows to the nozzle 6 side. In order to prevent the solvent 44 from flowing toward the nozzle 6, a filter 45 may be provided in the container 42 so as to cover the outlet 42 a from the inside of the container 42, the solvent 44 may be gelled, or the solvent 44. The sheet 46 having absorbed therein may be placed in the container 42.

  Further, the vapor amount of the solvent 44 may be increased by heating the container 42 with a heater (not shown). Alternatively, the tip of the pipe 43 may be inserted into the solvent 44 to generate gas bubbles in the solvent 44 to increase the amount of vapor of the solvent 44. On the contrary, if the solvent 44 having a high boiling point is used, the vapor amount of the solvent 44 can be suppressed, and the solvent 44 can be prevented from being excessively absorbed by the correction paste 4.

  In the same manner as in the first embodiment, after positioning the through hole 3a of the film 3 above the open defect portion 14a, the electromagnetic valve 10 is opened for the time set by the timer 11. Thereby, the gas and the vapor of the solvent 44 are mixed in the container 42, and the gas containing the vapor of the solvent 44 is injected from the nozzle 6 into the range including the through hole 3 a from above the film 3.

  As shown in FIG. 3, the film 3 is deformed and the film 3 in the range including the through holes 3 a comes into contact with the substrate 1 by the gas injection. If the gas injection is stopped, as shown in FIG. 4, the film 3 in a range including the through hole 3 a is separated from the substrate 1 by the restoring force of the film 3, and the substrate 1 is corrected to have substantially the same shape as the through hole 3 a. A pattern 4a is formed.

  In the second embodiment, since the gas containing the vapor of the solvent 44 of the correction paste 4 is injected, an appropriate amount of the solvent 44 is supplied to the correction paste 4 in the coating unit 1 to prevent the correction paste 4 from drying. it can. Therefore, even when a plurality of open defect portions 14a are corrected using the same application unit 1, the correction paste 4 is dried, the correction pattern 4a is interrupted, the shape is tapered, or the through hole 3a is clogged. Can be prevented.

  FIG. 15 is a sectional view showing a modification of the second embodiment. In FIG. 15, in this modification, when a plurality of open defect portions 14a are corrected using the same coating unit 1, the correction paste 4 is applied to one open defect portion 14a and then corrected to the next open defect portion 14a. At the time of waiting until the paste 4 is applied, the solvent vapor generating unit 50 is disposed in the vicinity of the opening on the lower side of the through hole 3a of the film 3.

  The solvent vapor generation unit 50 is obtained by injecting the solvent 44 of the correction paste 4 into a container 51 having an upper end opened close to the back surface of the film 3. In order to prevent the solvent 44 from spilling out of the container 51, the solvent 44 may be gelled, or a sheet 52 that has absorbed the solvent 44 may be placed in the container 51.

  When the high-boiling solvent 44 is used, the solvent 44 does not immediately evaporate even when the container 51 remains open. However, when the highly volatile solvent 44 (for example, toluene) is used, the container 51 It is preferable to make the opening of the opening as small as possible, or to provide an openable / closable lid (not shown).

  In this modification, since the vapor of the solvent 44 is supplied to the correction paste 4 in the through hole 3a during standby, the correction paste 4 is dried even when the plurality of open defect portions 14a are corrected using the same coating unit 1. Can be prevented, and correction can be made without degrading the correction quality. Note that the vapor amount of the solvent 44 may be controlled by heating the container 51 with a heater (not shown).

  FIG. 16 is a block diagram showing another modification of the second embodiment, and is a diagram to be compared with FIG. In FIG. 16, in this modified example, the gas injection device 40 is replaced with a gas injection device 55. The gas injection device 55 is obtained by adding electromagnetic valves (V) 56 and 57 and a selector (S) 58 in the gas injection device 40. The inlet of the electromagnetic valve 56 is connected to the outlet 42a of the container 42, and the outlet of the electromagnetic valve 56 is connected to the inlet of the joint 7 through a pipe. The inlet of the electromagnetic valve 57 is connected to a pipe between the outlet of the regulator 9 and the electromagnetic valve 10, and the outlet of the electromagnetic valve 57 is connected to a pipe between the outlet of the electromagnetic valve 56 and the inlet of the joint 7.

  The output signal of the timer 11 is given to the selector 58. The selector 58 is controlled by a selection signal φS. The selection signal φS is set to the “H” level when the gas containing the solvent 44 of the correction paste 4 is injected, and is set to the “L” level when the gas not containing the solvent 44 of the correction paste 4 is injected. Is done. The selector 58 provides the output signal of the timer 11 to the electromagnetic valves 10 and 56 when the selection signal φS is at “H” level, and outputs the output signal of the timer 11 when the selection signal φS is at “L” level. This is applied to the electromagnetic valve 57.

  When selection signal φS is at “H” level, electromagnetic valves 10 and 56 are opened for a predetermined time in response to the output signal of timer 11. Thereby, gas flows from the gas supply source 12 through the path of the regulator 9, the electromagnetic valve 10, the solvent vapor generation unit 41, the electromagnetic valve 56, and the nozzle 6, and the gas including the vapor of the solvent 44 of the correction paste 4 flows from the nozzle 6. Be injected.

  When selection signal φS is at “L” level, electromagnetic valve 57 is opened for a predetermined time in response to the output signal of timer 11. As a result, gas flows from the gas supply source 12 through the path of the regulator 9, the electromagnetic valve 57, and the nozzle 6, and gas that does not contain the vapor of the solvent 44 of the correction paste 4 is injected from the nozzle 6.

  In this modified example, any one of the gas including the vapor of the solvent 44 of the correction paste 4 and the gas not including the vapor of the solvent 44 of the correction paste 4 can be selectively injected. It is possible to control the amount of the solvent 44 absorbed into the correction paste 4 and to prevent the solvent 44 from being excessively absorbed by the correction paste 4. For example, when a plurality of open defect portions 14a are corrected using the same coating unit 1, each open defect portion 14a is corrected by injecting a gas that does not contain the vapor of the solvent 44, and a predetermined number of open defects. The open defect portion 14a may be corrected by injecting a gas containing vapor of the solvent 44 every time the portion 14a is corrected or every time a predetermined time elapses.

  FIG. 17 is a block diagram showing still another modification of the second embodiment, and is a diagram contrasted with FIG. 17, in this modified example, the coating unit 1 is replaced with the coating unit 60, and the gas injection device 8 for injecting the gas containing no vapor of the solvent 44 shown in FIG. 1 and the solvent shown in FIG. Both the gas injection apparatus 40 which injects the gas containing 44 vapor | steam are provided.

  The application unit 60 is different from the application unit 1 in that the nozzle 6 is used for injecting a gas that does not include the vapor of the solvent 44, and a nozzle 61 that injects a gas that includes the vapor of the solvent 44 is added. The proximal end of the nozzle 61 is connected to the gas supply hole 5 c opened in the lid 5, and the distal end of the nozzle 61 is disposed in the vicinity of the liquid surface of the correction paste 4. The outlet of the joint 62 is joined to the upper opening of the gas supply hole 5, and the inlet of the joint 62 is connected to the outlet 42 a of the container 42 of the gas injection device 40 via a pipe (not shown). The inlet of the joint 7 is connected to the outlet of the electromagnetic valve 10 of the gas injection device 8 through a pipe (not shown).

  When applying the correction paste 4 to the open defect portion 14a, the through hole 3a is positioned above the open defect portion 14a, the electromagnetic valve 10 of the gas injection device 8 is opened for a predetermined time, and the solvent 44 of the correction paste 4 is opened. The gas which does not contain is injected from the nozzle 6. Thereby, as shown in FIGS. 3 and 4, the correction paste 4 is applied to the open defect portion 14a through the through hole 3a.

  During standby, the coating unit 60 is retracted to a position away from the substrate 13, the electromagnetic valve 10 of the gas ejection device 40 is opened for a predetermined time as necessary, and a gas containing the solvent 44 of the correction paste 4 is discharged from the nozzle 61. Spray. Thereby, an appropriate amount of the solvent 44 is supplied to the correction paste 4 in the coating unit 60, and drying of the correction paste 4 is prevented. For example, when correcting a plurality of open defect portions 14a using the same coating unit 60, each time a predetermined number of open defect portions 14a are corrected, or a gas containing vapor of the solvent 44 is injected every time a predetermined time elapses. Good.

  If the pressure of the regulator 9 of the gas injection device 40 is set low, the deformation amount of the film 3 can be suppressed, and it becomes unnecessary to retract the coating unit 60 to a position away from the substrate 13 during standby. .

  FIG. 18 is a block diagram showing still another modification of the second embodiment, and is a diagram contrasted with FIG. 18, in this modification, the coating unit 1 is replaced with the coating unit 65, and the gas injection device 40 is replaced with the gas injection device 8 shown in FIG.

  The coating unit 65 is a coating unit 1 in which a container 66 for the solvent 44 is provided. The container 66 is formed in an annular shape and is fitted on the inner peripheral surface of the cylindrical member 2. An annular groove 66a is formed on the upper surface of the container 66, and the solvent 44 of the correction paste 4 is injected into the groove 66a. It is preferable to put the sheet 67 in which the solvent 44 is absorbed into the groove 66a so that the solvent 44 does not leak around. The coating unit 65 is filled with the vapor of the solvent 44, and an appropriate amount of the solvent 44 is supplied to the correction paste 4 in the coating unit 65. Even in this modified example, the same effect as in the second embodiment can be obtained.

  FIG. 19 is a block diagram showing still another modification of the second embodiment, and is a diagram contrasted with FIG. In FIG. 19, in this modification, the application unit 65 is replaced with the application unit 70. The coating unit 70 is provided with a valve 71 in each vent hole 5 b of the coating unit 65. During standby, the upper surface of the vent hole 5b is closed by the weight of the valve 71. When gas is injected from the nozzle 6, the pressure in the coating unit 70 rises, the valve 71 is lifted upward, and the gas in the coating unit 70 is discharged to the outside through the vent hole 5b. In this modified example, since the valve 71 is provided in each vent 5b, it is possible to prevent the vapor of the solvent 44 from leaking from the vent 5b during standby.

  In the modified example of FIG. 20, the coating unit 1 is replaced with a coating unit 75. The coating unit 75 is different from the coating unit 1 in that the nozzle 6 is removed, the cylindrical member 2 is shortened by the length of the nozzle 6, and the gas supply hole 5a of the lid 5 is formed in a nozzle shape. is there. The inner diameter of the gas supply hole 5a is gradually reduced downward. In this modified example, the coating unit can be downsized. Needless to say, application units other than the application unit 1 can be changed in the same manner as the application unit 75.

  FIG. 21 is a diagram showing a configuration of the pattern correction device 76 including the coating device shown in FIG. 15, and is a diagram contrasted with FIG. In this pattern correction device 76, the gas injection device 40 is mounted on the Z-axis stage 33, and the solvent vapor generation unit 50 is fixed at a predetermined position on the XYZ stage 37. The XYZ stage 37 moves the coating unit 1 in the XYZ directions. The XYZ stage 37 moves the coating unit 1 to place the through-hole 3a of the film 3 above the open defect portion 14a during coating, and moves the coating unit 1 to move the through-hole 3a to the solvent vapor during standby. It arrange | positions on the generating part 50. FIG. Since other configurations and operations are the same as those of the pattern correction apparatus of FIG. 13, the description thereof will not be repeated.

  According to the coating device and the pattern correction device described so far, the defective portion generated in the fine pattern can be easily corrected, so that the open defect of the wiring formed on the TFT (thin film transistor) array substrate of the liquid crystal panel In addition to the correction of the portion, the present invention can be applied to correction of defective portions of various substrates.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  1,20-23,60,65,70,75 Application unit, 2 cylindrical member, 3 film, 3a through hole, 3b groove, 4 correction paste, 4a, 4A correction pattern, 5 lid, 5a gas supply hole, 5b through Pore, 6, 61 nozzle, 6a injection port, 7, 62 joint, 8, 40, 55 gas injection device, 9 regulator, 10, 56, 57 solenoid valve, 11 timer, 12 gas supply source, 13 substrate, 14 wiring, 14a Open defect portion, 15 Baking device, 24, 42, 66 Container, 24a Through hole, 25 Rotating mechanism, 30 Pattern correction device, 31 Surface plate, 32 XY stage, 32a X axis stage, 32b Y axis stage, 33 Z axis Stage, 34 Observation optical system, 35 Laser, 36 Objective lens, 37 XYZ stage, 38 Chuck, 41, 50 Steam generating unit, 42, 51 container, 43 pipe, 44 the solvent, 45 filter, 46,52,67 sheet, 58 a selector, 71 valve.

Claims (18)

A coating apparatus for applying a correction liquid to a defective portion of a fine pattern formed on a substrate,
At least a part of the bottom is formed of a film, a through-hole having a shape corresponding to the defective portion is opened in the film, and a container in which the correction liquid is injected is provided.
The film and the substrate face each other with a gap in a state where the defect portion and the through hole are aligned,
Furthermore, the nozzle at the tip is opposed to the opening on the upper side of the through hole with a gap, and is provided substantially perpendicular to the upper surface of the film;
A gas is injected through the nozzle, a range including the through hole of the film is protruded downward, and an opening on the lower side of the through hole is brought into contact with the substrate, An application apparatus comprising: a gas injection unit that applies correction liquid to the defective portion.   The coating apparatus according to claim 1, wherein the film is a resin film.   2. The film according to claim 1, wherein the film is deformed downward by the pressure of the gas injected from the tip of the nozzle, and returns to its original position by its restoring force when the injection of the gas is stopped. Or the coating device of Claim 2.   The coating device according to any one of claims 1 to 3, wherein the through hole is formed by laser ablation. The opening at the top of the container is closed with a lid,
The base end of the nozzle is fixed to the lid of the container so that the tip of the nozzle does not come into contact with the correction liquid, The coating according to any one of claims 1 to 4, apparatus.   The coating apparatus according to claim 5, wherein a vent hole for allowing the gas sprayed from the nozzle to escape to the outside of the container is formed in the lid. A coating apparatus for applying a correction liquid to a defective portion of a fine pattern formed on a substrate,
At least a part of the bottom is formed of a film, a through-hole having a shape corresponding to the defective portion is opened in the film, and a container in which the correction liquid is injected is provided.
The film and the substrate face each other with a gap in a state where the defect portion and the through hole are aligned,
Further, gas is supplied into the container to increase the pressure in the container, and a range including the through hole of the film is protruded downward to contact the lower opening of the through hole with the substrate. And a gas injection means for applying the correction liquid to the defective part through the through hole.   The said gas contains the vapor | steam of the solvent of the said correction liquid, The coating device in any one of Claim 1-7 characterized by the above-mentioned.   The coating apparatus according to claim 8, wherein the gas injection unit includes a solvent vapor generation unit that generates a vapor of the solvent of the correction liquid. And a selection means for selecting one of the gas containing the solvent vapor of the correction liquid and the gas not containing the vapor of the solvent of the correction liquid,
10. The coating apparatus according to claim 1, wherein the gas injection unit injects the gas selected by the selection unit. 11. A coating apparatus for applying a correction liquid to a defective portion of a fine pattern formed on a substrate,
At least a part of the bottom is formed of a film, a through-hole having a shape corresponding to the defective portion is opened in the film, and a container in which the correction liquid is injected is provided.
The film and the substrate face each other with a gap in a state where the defect portion and the through hole are aligned,
Furthermore, a first nozzle provided substantially perpendicular to the upper surface of the film, the spray port at the tip of the opening facing the opening on the upper side of the through hole,
Gas is injected through the first nozzle, a range including the through hole of the film is protruded downward, an opening on the lower side of the through hole is brought into contact with the substrate, and the through hole is formed. A first gas injection means for applying the correction liquid to the defective portion via,
A second nozzle having a nozzle at its tip provided in the container;
And a second gas injection means for injecting a gas containing the solvent of the correction liquid through the second nozzle and suppressing drying of the correction liquid injected into the container. Application equipment.   Further, the apparatus further comprises a solvent vapor generating means provided in the container and configured to generate a solvent vapor of the correction liquid and suppress drying of the correction liquid in the container. The coating apparatus according to any one of 11 to 11.   Furthermore, it comprises solvent vapor supply means for supplying the vapor of the solvent of the correction liquid to a range including at least the through-hole on the back surface of the film, and suppressing drying of the correction liquid. The coating device according to claim 12. A pattern correction apparatus comprising the coating apparatus according to any one of claims 1 to 13 for correcting a defective portion of a fine pattern formed on a substrate,
A pattern correction apparatus comprising: positioning means for moving the container and the substrate relative to each other so that the film and the substrate face each other with a gap in a state where the defect portion and the through hole are aligned. .   The pattern correction apparatus according to claim 14, wherein the positioning unit includes a rotation mechanism that rotates the container so that a length direction of the through hole coincides with an extending direction of the fine pattern. A plurality of coating devices having different shapes of the through holes;
The pattern correction apparatus according to claim 14, wherein the positioning unit relatively moves a coating apparatus selected from the plurality of coating apparatuses and the substrate. A pattern correction method for correcting a defective portion of a fine pattern formed on a substrate,
A container in which at least a part of the bottom is formed of a film, a through-hole having a shape corresponding to the defect portion is opened in the film, and the correction liquid is injected;
The nozzle at the tip is opposed to the opening on the upper side of the through hole with a gap, and provided with a nozzle provided substantially perpendicular to the upper surface of the film,
A step of facing the film and the substrate in a state where the defect portion and the through hole are aligned with each other;
A gas is injected through the nozzle, a range including the through hole of the film is protruded downward, and an opening on the lower side of the through hole is brought into contact with the substrate, Applying a correction fluid to the defective portion;
And stopping the gas injection to separate the film from the substrate.   The pattern correction method according to claim 17, wherein the gas includes a solvent vapor of the correction liquid.

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