JP2010259969A - Coating unit, pattern correction device using this coating unit and pattern correction method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a coating unit wherein micropatterns upto 10 μm and below can be easily corrected, without damaging a base, even when there is unevenness in the base surface. <P>SOLUTION: This coating unit 1 is operated with the following structure: the lower end of a cylindrical member 2 is closed with a film 3 serving as a cover, then, a through-hole 3a is formed in the center of the film 3 and a paste container 5 is arranged so as to cover the through-hole 3a. In addition, the paste container 5 is supported in such a way that it is movable vertically, then, a correction paste 6 is injected into the paste container 5, and the film 3 and the base 15 are set opposed to each other, with a gap left in between, in such a state that the positions of an open defective part 16a and the through-hole 3a are registered. Further, a gas is ejected to the upper end of the paste container 5 through a nozzle 8, then the center of the film 3 is brought into contact with the base 15 by making the center project downward, and the correction paste 6 is applied to the open defective part 16a through the through-hole 3a. Consequently, even when there is an unevenness in the surface of the base 15, it is possible to apply the correction paste 6 without strongly pressing the base 15 locally. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a coating apparatus, a pattern correction apparatus and a pattern correction method using the same, and more particularly, a coating apparatus that forms a fine pattern by applying a liquid material on a substrate, and a defect in a fine pattern formed on the substrate. The present invention relates to a coating apparatus for applying a correction liquid to a portion, a pattern correction apparatus and a pattern correction method using the same. More specifically, the present invention relates to an open defect (disconnection defect) in a pattern (wiring) generated in a manufacturing process of a flat panel display, a white defect in a liquid crystal color filter, a mask. The present invention relates to a coating apparatus capable of correcting defects and the like, and a pattern correcting apparatus and a pattern correcting method using the same.

  In recent years, a pattern formed on a glass substrate or a film substrate has been miniaturized, and recently, it may be necessary to form a pattern having a width of 10 μm or less. In addition, as flat panel displays such as liquid crystal displays, plasma displays, and EL displays have become larger and higher in definition, defects in wiring on the substrate, etc. in the display manufacturing process, and the color layers of the liquid crystal color filters There is a high probability that defects will occur. For this reason, a method for improving the yield and correcting various defects has been proposed.

  For example, a fine pattern, for example, an electrode (wiring) is formed on the surface of a glass substrate of a liquid crystal display. If this wiring is disconnected, apply conductive correction paste (liquid substance, correction liquid) attached to the tip of the application needle to the open defect and apply multiple times while shifting the application position in the length direction of the electrode. Then, the wiring is corrected (see, for example, Patent Document 1).

  There is also a coating apparatus including a container in which a through hole is opened at the bottom thereof and a correction paste (correction liquid) is injected, and an application needle having a diameter substantially the same as the through hole. In this coating device, the tip of the application needle is immersed in the correction paste during standby, and the tip of the application needle protrudes under the container through the through-hole during application and is corrected to adhere to the tip of the application needle. A paste is apply | coated to a defective part (for example, refer patent document 2).

JP-A-8-292442 JP 2006-310266 A

  However, in the method of correcting the open defect portion using the application needle, the correction paste adhering to the flat surface at the tip of the application needle is transferred to the open defect portion, so the application diameter of the correction paste is the diameter of the flat surface at the tip of the application needle. Determined by. Therefore, it is difficult to realize a coating diameter of about 10 μm, and it is difficult to form a thin line using this.

Further, since the flat surface at the tip of the application needle is very small, the surface pressure increases even if the movable part including the application needle is lightweight. For example, even if the weight of the movable part including the application needle is as light as about 10 g, if the diameter of the flat surface at the tip of the application needle is 50 μm, the surface pressure is about 5 kg / mm ² . Therefore, when a minute protrusion exists in the vicinity of the defective portion, it is assumed that the protrusion is crushed or the surface pressure is locally increased. In addition, it is conceivable that the correction paste cannot be applied to the defective portion because the protrusion interferes.

  Therefore, the main object of the present invention is to use a coating apparatus capable of easily forming or correcting a fine pattern of 10 μm or less without damaging the substrate even when the substrate surface is uneven, and to use the same. A pattern correction apparatus and a pattern correction method are provided.

  The coating apparatus according to the present invention is a coating apparatus that forms a fine pattern by applying a liquid substance on a substrate, and at least a part of the bottom of the coating apparatus is formed of a film, and the film penetrates in a shape corresponding to the fine pattern. A first container having a hole, a second container including a cylindrical part disposed on the film so that an edge of the opening at the lower end surrounds the through-hole, and a liquid substance is injected therein; A guide member that supports the second container so as to be movable in the up-down direction, and a nozzle provided with an injection port at the tip thereof facing the upper end of the second container. The film and the substrate face each other with a gap in a state where the substrate and the through hole are aligned. The coating apparatus further injects gas through a nozzle to push the second container downward, projects the range including the through hole in the film downward, and opens the opening below the through hole to the substrate. And a gas jetting means for applying the liquid substance to the substrate through the through hole. Therefore, even when the surface of the substrate is uneven, the liquid material can be applied without strongly pressing the substrate locally, and a fine pattern of 10 μm or less can be easily formed without damaging the substrate. it can. In addition, since the second container is provided on the film, the liquid substance can be held only in a minute range including the through holes, and the amount of the liquid substance used can be reduced.

  Another coating apparatus according to the present invention is a coating apparatus for applying a correction liquid to a defective portion of a fine pattern formed on a substrate, wherein at least a part of the bottom is formed of a film, and the film has a defective portion. A second container including a first container in which a through-hole having a corresponding shape is opened, and a cylindrical portion in which the edge of the opening at the lower end of the first container surrounds the through-hole and into which correction fluid is injected. And a guide member that supports the second container so as to be movable in the up-down direction, and a nozzle that has an injection port at the tip thereof facing the upper end of the second container. The film and the substrate face each other with a gap in a state where the defect portion and the through hole are aligned. The coating apparatus further injects gas through a nozzle to push the second container downward, projects the range including the through hole in the film downward, and opens the opening below the through hole to the substrate. And a gas injection means for applying the correction liquid to the defective portion through the through hole. Therefore, even when the surface of the substrate is uneven, the correction liquid can be applied without strongly pressing the substrate locally, and a fine pattern of 10 μm or less can be easily corrected without damaging the substrate. it can. Further, since the second container is provided on the film, the correction liquid can be held only in a minute range including the through hole, and the amount of the correction liquid used can be reduced.

  Preferably, the second container is pushed downward by the pressure of the gas injected from the tip of the nozzle, and the correction liquid in the second container is pushed out from the through hole. The film is pushed downward by the second container and deforms downward. When the gas injection is stopped, the film returns to the original position by the restoring force.

  Preferably, the opening at the upper end of the first container is closed by the first lid, and the proximal end of the nozzle is fixed to the first lid.

  Preferably, the opening at the upper end of the first container is closed by the first lid, and the nozzle is formed in the first lid.

  Preferably, the first lid is formed with a vent hole for allowing the gas injected from the nozzle to escape to the outside of the first container.

  Preferably, the first container includes a cylindrical member, and the film is bonded to the lower end surface of the cylindrical member.

  Preferably, the first container includes a cylindrical member, the film is provided so as to be exchangeable so as to cover the opening at the lower end of the cylindrical member, and both ends of the film are held on the side surfaces of the cylindrical member.

  Also preferably, the upper end of the cylindrical portion of the second container is closed by a second lid having a hole in the center, and is corrected by the gas injected from the nozzle and passed through the hole of the second lid. The liquid is pushed out from the through hole.

  Further preferably, an elastic member provided to close the opening at the upper end of the cylindrical portion of the second container is further provided. The elastic member is deformed downward by the gas injected from the nozzle, and the correction liquid is pushed out from the through hole.

  In addition, preferably, a push plate provided to be movable in the vertical direction within the cylindrical portion of the second container is further provided. The correction liquid is injected between the film and the pressing plate, the pressing plate is pushed downward by the gas injected from the nozzle, and the correction liquid is pushed out from the through hole.

  Also preferably, the gas comprises a solvent vapor of the correction fluid. In this case, drying can be suppressed by replenishing the correction fluid with an appropriate amount of solvent.

  Further preferably, the gas injection means includes a solvent vapor generating section for generating a vapor of the solvent of the correction liquid.

  Further preferably, the apparatus further includes a solvent vapor generating means that is provided in the first container and generates a solvent vapor of the correction liquid to suppress drying of the correction liquid.

  Further preferably, the apparatus further includes a solvent vapor supply means for supplying the solvent vapor of the correction liquid to a range including at least the through-hole on the lower surface of the film and suppressing drying of the correction liquid. In this case, it is possible to prevent the correction liquid in the through hole from being dried, stabilize the coating shape, increase the number of times that the coating can be repeatedly applied, and reduce the number of maintenance times of the coating apparatus.

  A pattern correction apparatus according to the present invention is a pattern correction apparatus that includes the coating apparatus and corrects a defective portion of a fine pattern formed on a substrate, and moves the first container and the substrate relative to each other to detect defects. And positioning means for facing the film and the substrate with a gap in a state where the portion and the through hole are aligned.

  Still another coating apparatus according to the present invention is a coating apparatus that applies a correction liquid to a defective portion of a fine pattern formed on a substrate, and at least a part of the bottom thereof is formed of a first film. A container in which a concave portion is formed on the upper surface of the first film, a through hole having a shape corresponding to the defective portion is opened at the bottom of the concave portion, a correction liquid is injected into the concave portion, and the concave portion is covered with the second film; The nozzle at the tip of the nozzle is provided to face the second film. The first film and the substrate face each other with a gap in a state where the defect portion and the through hole are aligned. The coating apparatus further injects gas through the nozzle, pushes the second film downward to push out the correction liquid from the through hole, and causes the range including the through hole in the first film to protrude downward. Gas injection means for contacting the substrate with the lower opening of the through-hole and applying the correction liquid to the defective portion through the through-hole. Therefore, even when the surface of the substrate is uneven, the correction liquid can be applied without strongly pressing the substrate locally, and a fine pattern of 10 μm or less can be easily corrected without damaging the substrate. it can. Further, since the concave portion is formed on the upper surface of the first film and the through hole is opened at the bottom of the concave portion, the correction liquid can be held only in a minute range including the through hole. Can be reduced.

  Still another coating apparatus according to the present invention is a coating apparatus for applying a correction liquid to a defective portion of a fine pattern formed on a substrate, and at least a part of the bottom of the coating apparatus is formed of a film. A first container having a through-hole having a shape corresponding to the defective portion, and a cylindrical portion in which the edge of the opening at the lower end surrounds the through-hole and the correction liquid is injected therein And a guide member that supports the second container so as to be movable in the vertical direction. The film and the substrate face each other with a gap in a state where the defect portion and the through hole are aligned. The coating apparatus further pushes the correction liquid in the second container or the second container downward to project the range including the through hole in the film downward, and the opening below the through hole is formed on the substrate. A linear actuator is provided that contacts and applies the correction liquid to the defective portion through the through hole. Therefore, even when the surface of the substrate is uneven, the correction liquid can be applied without strongly pressing the substrate locally.

  The pattern correction method according to the present invention is a pattern correction method for correcting a defect portion of a fine pattern formed on a substrate, wherein at least a part of the bottom is formed of a film, and the film is subjected to a defect portion. A first container in which a through-hole having an open shape is opened, a second container including a cylindrical portion in which the edge of the opening at the lower end of the container is placed on the film so as to surround the through-hole, and correction fluid is injected therein A defect member and a through-hole provided with a container, a guide member that supports the second container so as to be movable in the up-down direction, and a nozzle provided with an injection port at the tip thereof facing the upper end of the second container The first step in which the film and the substrate are opposed to each other with the gap being aligned, and the range including the through hole in the film by injecting gas through the nozzle and pushing the second container downward Protruding downward Performing a second step in which the opening on the side is brought into contact with the substrate and the correction liquid is applied to the defective portion through the through hole, and a third step in which gas injection is stopped and the film is peeled off from the substrate. It is characterized by. Therefore, even when the surface of the substrate is uneven, the correction liquid can be applied without strongly pressing the substrate locally, and a fine pattern of 10 μm or less can be easily corrected without damaging the substrate. it can. Further, since the second container is provided on the film, the correction liquid can be held only in a minute range including the through hole, and the amount of the correction liquid used can be reduced.

  Preferably, the defect portion is corrected by repeating the first to third steps while changing the application position. In this case, by applying the correction liquid a plurality of times while shifting the application position, it becomes possible to draw a correction pattern of an arbitrary shape by connecting a minute correction pattern, and the degree of freedom of correction is improved.

  As described above, according to the present invention, even when the surface of the substrate is uneven, it is possible to apply the liquid material or correction liquid without strongly pressing the substrate locally, and 10 μm without damaging the substrate. The following fine patterns can be easily formed or modified. Further, the liquid substance or the correction liquid can be held only in a minute range including the through hole, and the amount of the liquid substance or the correction liquid used can be reduced.

It is sectional drawing which shows the structure of the coating device by Embodiment 1 of this invention. It is sectional drawing which shows the process of opening the clearance gap between the through-hole shown in FIG. It is sectional drawing which shows the process of injecting gas through the nozzle shown in FIG. It is sectional drawing which shows the state after stopping the injection of gas shown in FIG. It is sectional drawing which shows the process of baking the correction pattern shown in FIG. FIG. 10 is a cross-sectional view showing a modification of the first embodiment. It is sectional drawing which shows the other example of a change of Embodiment 1. FIG. 10 is a cross-sectional view showing still another modification example of the first embodiment. FIG. 10 is a cross-sectional view showing still another modification example of the first embodiment. FIG. 10 is a cross-sectional view showing still another modification example of the first embodiment. FIG. 10 is a cross-sectional view showing still another modification example of the first embodiment. It is sectional drawing which shows the structure of the coating device by Embodiment 2 of this invention. FIG. 10 is a cross-sectional view showing a modified example of the second embodiment. It is sectional drawing which shows the structure of the coating device by Embodiment 3 of this invention. FIG. 10 is a cross-sectional view showing a modified example of the third embodiment. It is sectional drawing which shows the other example of a change of Embodiment 3. FIG. 12 is a cross-sectional view showing still another modification of the third embodiment. FIG. 12 is a cross-sectional view showing still another modification of the third embodiment. It is a figure which shows the principal part of the coating device by Embodiment 4 of this invention. It is a figure which shows the rotation mechanism which rotates the coating unit shown in FIG. It is a figure which shows the principal part of the coating device by Embodiment 5 of this invention. It is a figure which shows the coating method using the coating unit shown in FIG. It is a figure which shows the other application | coating method using the application | coating unit shown in FIG. FIG. 10 is a cross-sectional view showing a modified example of the fifth embodiment. It is sectional drawing which shows the coating unit of the coating device by Embodiment 6 of this invention. It is sectional drawing which shows the example of a change of Embodiment 6. It is sectional drawing which shows the other example of a change of Embodiment 6. FIG. 23 is a cross-sectional view showing still another modification example of the sixth embodiment. FIG. 23 is a cross-sectional view showing still another modification example of the sixth embodiment. It is sectional drawing which shows the coating unit of the coating device by Embodiment 7 of this invention. It is sectional drawing which shows the example of a change of Embodiment 7. It is a figure which shows the structure of the pattern correction apparatus by Embodiment 8 of this invention.

[Embodiment 1]
1 is a cross-sectional view showing a configuration of a coating apparatus according to Embodiment 1 of the present invention. In FIG. 1, the coating apparatus includes a coating unit 1 and a gas injection device 10. The application unit 1 includes a cylindrical member 2. The opening at the lower end of the cylindrical member 2 is closed with a circular film 3. The cylindrical member 2 and the film 3 constitute a first container. In a state where a certain tension is applied to the film 3, the outer peripheral portion of the film 3 is fixed to the lower end surface of the cylindrical member 2 by adhesion or the like. The film 3 is, for example, a polyimide film, and the thickness thereof is, for example, about 10 to 25 μm.

  A through hole 3 a is formed in the approximate center of the film 3. The through hole 3a is processed into a shape (for example, a straight line shape) corresponding to an open defect portion of the wiring formed on the substrate to be corrected. When the film 3 is a polyimide film, the through hole 3a is processed by laser ablation using a pulse laser such as a YAG third harmonic laser, a YAG fourth harmonic laser, or an excimer laser. When the surface of the film 3 is irradiated with laser light to form the through hole 3a, burrs are generated at the edge of the through hole 3a on the back surface side of the film 3. In order to prevent this burr from adversely affecting the shape of the correction pattern, it is preferable to direct the surface side (laser irradiation surface) of the film 3 with less burr generation to the outside (lower side) of the coating unit 1.

  Further, when the formation of the through-hole 3a by laser ablation is completed, dust generated during laser ablation is scattered on the surface of the film 3 (laser irradiation surface). In order to remove such dust, a low-power laser beam may be irradiated to a wide range of the film 3 around the through hole 3a. At this time, by switching to the YAG second harmonic laser and irradiating a low-power laser beam over a wide range centering on the through hole 3a, it is possible to remove only dust and burrs. It is possible to prevent the generation of dust. As the laser, a laser that can selectively emit one of two types of laser light, that is, laser light for opening the through-hole 3a and laser light for removing dust is preferably used. Alternatively, the film 3 that has been subjected to laser processing may be dried after being cleaned including the cylindrical member 2.

  A disc-shaped guide member 4 is fixed to the lower end portion inside the cylindrical member 2. A circular guide hole 4 a is formed in the center of the guide member 4. The lower surface of the guide member 4 and the upper surface of the film 3 face each other substantially in parallel with a gap. The cylindrical member 2 and the guide member 4 may be integrally formed.

  A bottomed cylindrical paste container (second container) 5 is inserted into the guide hole 4 a with the bottom side up, and the paste container 5 moves in the vertical direction by deformation of the guide hole 4 a and the film 3. Supported as possible. The edge of the opening 5 a at the lower end of the paste container 5 is in contact with the upper surface of the film 3 so as to surround the through hole 3 a of the film 3. In the center of the bottom of the paste container 5, a hole 5b smaller than the opening 5a at the lower end is opened. The paste container 5 is filled with a correction paste 6 in advance. Thereby, the correction paste 6 is supplied only to a limited range including the through hole 3a.

As the correction paste 6, when the correction target is a wiring, a metal nano paste such as gold or silver is used. For example, a gold nano paste having a viscosity of about 1 Pa · s to 20 Pa · s can be used. If the correction paste 6 has a high viscosity, the correction paste 6 injected into the opening 5a of the paste container 5 is difficult to flow around and the metal weight ratio is high, so that the film thickness after firing is made thicker and the resistance is reduced. It becomes possible.
Further, the surface in contact with the film 3 around the opening 5a of the paste container 5 may be bonded in advance. In this case, the correction paste 6 is filled from the hole 5b.

  The upper opening of the cylindrical member 2 is closed by a disc-shaped lid 7. A gas supply hole 7a for supplying gas is formed in the center of the lid 7, and one or two or more vent holes 7b are formed around the gas supply hole 7a. Below the center part of the lid 7, a nozzle 8 is provided vertically downward. The lid 7 and the nozzle 8 are integrally formed, and the inside of the nozzle 8 communicates with the gas supply hole 7a. The injection port 8a at the tip of the nozzle 8 is opposed to the hole 5b at the bottom of the paste container 5 with a predetermined gap. The gap between the tip of the nozzle 8 and the hole 5b is set to about 1 mm to 2 mm, for example. Therefore, even if the nozzle 8 serves as a stopper and the paste container 5 moves upward, it does not come out of the guide portion 4a.

  An outlet of the joint 9 is connected to the gas supply hole 7a of the lid 7, and an inlet of the joint 9 is connected to the gas injection device 10 via a pipe (not shown). The gas injection device 10 includes a regulator (R) 11 that adjusts the pressure of gas, an electromagnetic valve (V) 12 that controls on / off of gas flow into the nozzle 8, and a timer that controls the opening time of the electromagnetic valve 12. (T) 13. A gas supply source (G) 14 is connected to the regulator 11. As the gas, for example, nitrogen gas is used, but compressed air may be used as long as the correction paste 6 to be used is not deteriorated. Note that the electromagnetic valve 12 may be controlled by a control computer or PLC (Programmable Logic Controller) without providing the timer 13.

  2-5 is a figure which shows the process of correcting an open defect part using this coating device. In FIG. 2, the coating unit 1 and the substrate 15 are relatively moved by a positioning device (not shown), and the through hole 3 a of the coating unit 1 is positioned above the open defect portion 16 a generated in the wiring 16 on the substrate 15. In this state, the film 3 at the bottom of the coating unit 1 and the surface of the substrate 15 face each other with a predetermined gap G1. The gap G1 is set in a range in which the film 3 can be deformed to come into contact with the substrate 15 and the wiring 16, for example, about 10 μm to 200 μm.

  Next, the electromagnetic valve 12 is opened for the time set by the timer 13. As a result, as shown in FIG. 3, gas is injected from the tip of the nozzle 8 to the range including the hole 5 b of the paste container 5, the paste container 5 is pushed by the pressure of the gas, moves downward, and the film 3 is deformed. Then, the central portion of the film 3 protrudes downward, and the lower surface of the film 3 in a range including the through holes 3 a contacts the substrate 15. Moreover, the gas injected from the tip of the nozzle 8 enters the paste container 5 through the hole 5b, and pushes out the correction paste 6 filled in the opening 5a from the through hole 3a. At this time, the correction paste 6 is applied to the open defect portion 16a through the through hole 3a. The gas injected into the container 2 is discharged to the outside through the vent hole 7b.

  When the gas injection is stopped, the film 3 in a range including the through hole 3a is separated from the substrate 15 by the restoring force of the film 3, and the open defect portion 16a has substantially the same shape as the through hole 3a as shown in FIG. A correction pattern 6a is formed. The gas pressure and the injection time are adjusted to optimum values based on the results of experiments performed in advance. The gas injection time is, for example, 1 second or less. Further, the inner diameter of the injection port 8a of the nozzle 8 may be in a range where the film 3 in the range including the through hole 3a can be brought into contact with the substrate 15 by pushing the bottom of the paste container 5 and moving downward. It is set to about 1 mm to 3 mm. The gas pressure is set to about 0.1 to 0.3 MPa, for example.

  Thus, since gas is injected to the range including the hole 5b of the paste container 5, the correction paste 6 in the through hole 3a is pushed out to the lower side (substrate 15 side) by the gas. For this reason, it becomes possible to make the film thickness of the correction pattern 6a thicker.

  Thereafter, as shown in FIG. 5, if necessary, the correction pattern 6a is baked and cured by using the baking device 17 to obtain a conductive correction pattern 6A. As the firing device 17, a YAG second continuous wave laser or the like is used. The correction pattern 6a may be radiated and fired, or may be baked while scanning the correction pattern 6a with the laser beam narrowed down.

  In the first embodiment, since the gas 3 is injected to bring the film 3 into contact with the substrate 15 (the surface of the substrate 15 including the open defect portion 16a), the film 3 can be pressed uniformly. Even if the surface of the substrate 15 is uneven, the film 3 contacts the surface of the substrate 15, so that the correction paste 6 can be applied to the open defect portion 16 a without being affected by the unevenness. Further, since the load is not concentrated on the protrusions, the substrate 15 is not deformed or damaged. Moreover, since the high-viscosity correction paste 6 can be used as compared with a coating method using an inkjet or a dispenser, the resistance value of the correction portion can be further reduced.

  Further, the method of filling the paste container 5 with the correction paste 6 is adopted, and the correction paste 6 is supplied only to a minute range including the through hole 3a, so that the amount of the correction paste 6 used can be reduced. . Moreover, it is possible to prevent the correction paste 6 from being scattered around during gas injection. Furthermore, since the area where the correction paste 6 comes into contact with the outside air is reduced, drying and deterioration of the correction paste 6 can be suppressed.

  In addition, when using gold nano paste as the correction paste 6, a high-viscosity product containing a metal additive (for example, Au, Bi) for improving adhesion is commercially available. Adhesion can be further improved.

  In addition, it is possible to repeatedly perform defect correction using the same coating unit 1, and it is possible to shorten the tact time for defect correction. When the amount of the correction paste 6 in the coating unit 1 decreases, the correction paste 6 may be replenished.

  Moreover, when correcting the some open defect part 16a using the same coating | coated unit 1, use time becomes long, the correction paste 6 in the coating | coated unit 1 dries, and the shape of the correction pattern 6a may become unstable. Since it is assumed, it is good to prevent drying using the correction paste 6 containing a high boiling point solvent.

  Further, when the open defect portion 16a in the vicinity of the unfired correction pattern 6a is corrected, the existing correction pattern 6a adheres to the back surface of the film 3 and the existing correction pattern 6a is crushed or the back surface of the film 3 is Since the case where it contaminates is assumed, it is desirable to bake the existing correction pattern 6a in such a case.

  Hereinafter, various modifications of the first embodiment will be described. In the modified example of FIG. 6, the coating unit 1 is replaced with the coating unit 20. The coating unit 20 is different from the coating unit 1 in that the nozzle 8 is removed, the cylindrical member 2 is shortened by the length of the nozzle 8, and the gas supply hole 7a of the lid 7 is formed in a nozzle shape. is there. The inner diameter of the gas supply hole 7a is gradually reduced downward. In this modified example, the coating unit can be downsized.

  Further, in the modified example of FIG. 7, the coating unit 1 is replaced with the coating unit 21. The application unit 21 is different from the application unit 1 in that the paste container 5 is replaced with a cylindrical paste container 22 and the opening at the upper end of the paste container 22 is closed with an elastic member 23. Similar to the paste container 5, the paste container 22 is inserted into the guide hole 4 a, and the lower edge of the paste container 22 is in contact with the upper surface of the film 3 so as to surround the through hole 3 a of the film 3. The elastic member 23 is, for example, a circular rubber film, and is fixed to the upper end surface of the paste container 22. When gas is ejected from the nozzle 8, the elastic member 23 is deformed by the pressure of the gas, and pushes the correction paste 6 to push out the correction paste 6 from the through hole 3a. In this modified example, since the gas sprayed from the nozzle 8 is not directly sprayed on the correction paste 6, deterioration of the correction paste 6 can be suppressed.

  Further, in the modified example of FIG. 8, the coating unit 1 is replaced with the coating unit 24. The application unit 24 is different from the application unit 1 in that the paste container 5 is replaced with a cylindrical paste container 22 and a disk-shaped pressing plate 25 is inserted inside the paste container 22. The pressing plate 25 is provided so as to be movable in the vertical direction inside the paste container 22. The correction paste 6 is injected between the paste container 22, the pressing plate 25, and the film 3. When gas is injected from the nozzle 8, the pressing plate 25 is pushed downward by the pressure of the gas, and the correction paste 6 is pushed out from the through hole 3a by the pressing plate 25. Even in this modified example, the gas jetted from the nozzle 8 is not directly sprayed on the correction paste 6, so that deterioration of the correction paste 6 can be suppressed.

  Further, in the modified example of FIG. 9, the coating unit 1 is replaced with the coating unit 26. The application unit 26 is different from the application unit 1 in that a disc-shaped pressing plate 25 is inserted inside the paste container 5. The pressing plate 25 is provided so as to be movable in the vertical direction inside the paste container 5. The correction paste 6 is injected between the paste container 5, the pressing plate 25, and the film 3. When gas is jetted from the nozzle 8 to the push plate 25 through the hole 5b, the push plate 25 is pushed downward by the pressure of the gas, and the correction paste 6 is pushed out from the through hole 3a by the push plate 25. In this modified example, the same effect as the modified example in FIG. 8 can be obtained.

  Further, in the modified example of FIG. 10, the coating unit 26 is replaced with a coating unit 27. The application unit 27 is different from the application unit 26 in that an annular elastic member 28 such as an O-ring is provided between the lower end surface of the paste container 5 and the upper surface of the film 3. In this modified example, the correction paste 6 can be prevented from leaking out of the paste container 5 without previously bonding the portion where the film 3 and the paste container 5 are in contact with each other.

  Further, in the modified example of FIG. 11, the coating unit 1 is replaced with the coating unit 29. The difference between the coating unit 29 and the coating unit 1 is that the guide member 4 and the paste container 5 are removed, a groove 3b is formed at the center of the upper surface of the film 3, and a through hole 3a is formed at the bottom of the groove 3b. The correction paste 6 is filled in the groove 3b, and the film 30 is covered so as to cover the groove 3b. The gas sprayed from the nozzle 8 hits the surface of the film 30 to deform the film 30 downward, pushes the correction paste 6 downward, and pushes out the correction paste 6 from the through hole 3a. Since the correction paste 6 is sandwiched between the films 3 and 30 and is sealed except for the through holes 3a, drying of the correction paste 6 is suppressed. In this modified example, the film 30 is only placed on the film 3, but a portion around the groove 3b where the film 3 and the film 30 are in contact may be bonded.

[Embodiment 2]
FIG. 12 is a cross-sectional view showing a main part of a coating apparatus according to Embodiment 2 of the present invention. In FIG. 12, this coating apparatus is different from the coating apparatus of the first embodiment in that a solvent vapor generation unit 31 is provided for preventing the correction paste 6 in the through hole 3a from drying. .

  The solvent vapor generation unit 31 is obtained by injecting the solvent 33 of the correction paste 6 into a container 32 having an upper end opened. In order to prevent the solvent 33 from spilling out of the container 32, the solvent 33 may be in the form of a gel, or a sheet 34 that has absorbed the solvent 33 may be placed in the container 32.

  The solvent 33 of the correction paste 6 is a solvent contained in the correction paste 6 (for example, a solvent that disperses metal fine particles contained in the correction paste 6) or a solvent that can dilute the correction paste 6. For example, when the diluent of the correction paste 6 is terpineol, terpineol is injected into the container 32 as the solvent 33.

  When a high-boiling solvent 33 (for example, terpineol) is used, the solvent 33 does not immediately evaporate even when the container 32 remains open, but when a highly volatile solvent 33 (for example, toluene) is used. It is preferable to make the opening of the container 32 as small as possible, or to provide an openable / closable lid (not shown).

  When a plurality of open defect portions 16a are corrected using the same coating unit 1, a standby time from when the correction paste 6 is applied to one open defect portion 16a to when the correction paste 6 is applied to the next open defect portion 16a. The coating unit 1 is moved onto the solvent vapor generation unit 31, and the opening on the lower side of the through hole 3 a of the film 3 is disposed close to the opening on the upper end of the solvent vapor generation unit 31. Thereby, the vapor | steam of the solvent 33 is supplied to the correction paste 6 in the through-hole 3a, and drying of the correction paste 6 in the through-hole 3a is suppressed.

  In the second embodiment, since the vapor of the solvent 33 is supplied to the correction paste 6 in the through hole 3a during standby, the correction paste 6 is used even when a plurality of open defect portions 16a are corrected using the same coating unit 1. Can be prevented by preventing clogging of the through-hole 3a, and correction can be made without degrading the correction quality.

Note that the vapor amount of the solvent 33 may be controlled by heating the container 32 with a heater (not shown).
FIG. 13 is a sectional view showing a modification of the second embodiment. In FIG. 13, in this modified example, the inner diameter of the opening at the upper end of the container 32 of the solvent vapor generating unit 31 is larger than the outer diameter of the lower end of the cylindrical member 2 of the coating unit 1. An annular groove is formed at the upper end inside the container 32, and an annular elastic member 35 such as an O-ring is fitted in the groove. During standby, the lower end of the cylindrical member 2 is inserted into the opening at the upper end of the container 32, and the space between the container 32 and the cylindrical member 2 is sealed by the elastic member 35. In this modification, the vapor of the solvent 33 can be prevented from leaking, and the vapor of the solvent 33 can be efficiently supplied to the correction paste 6 in the through hole 3a.

[Embodiment 3]
When correcting a plurality of open defect portions 16a using the same application unit 1, the correction paste 6 in the application unit 1 is dried over time, and the correction pattern 6a applied to the open defect portion 16a is interrupted or has a shape. It may be tapered or the through hole 3a may be clogged. In the third embodiment, this problem can be solved.

  FIG. 14 is a diagram showing a configuration of a coating apparatus according to Embodiment 3 of the present invention, and is compared with FIG. In FIG. 14, this coating apparatus is different from the coating apparatus of FIG. 1 in that the gas injection device 10 is replaced with a gas injection device 40. The gas injection device 40 is obtained by adding a solvent vapor generation unit 41 to the gas injection device 10. The solvent vapor generation unit 41 includes a container 42 and a pipe 43. One end of the pipe 43 is connected to the outlet of the electromagnetic valve 12, and the other end passes through the upper end of the side wall of the container 42 and is bent to the bottom side of the container 42. Moreover, the exit 42a is provided in the upper end part of the side wall of the container 42, and the exit 42a of the container 42 is connected to the inlet of the coupling 9 via piping. The solvent 42 of the correction paste 6 is injected into the container 42, and the container 42 is filled with the vapor of the solvent 33.

  In addition, when the container 42 into which the solvent 33 is injected moves along with the defect correction, it is assumed that the liquid surface of the solvent 33 is shaken and the solvent 33 flows to the nozzle 8 side. In order to prevent the solvent 33 from flowing toward the nozzle 8, a filter 45 may be provided in the container 42 so as to cover the outlet 42 a from the inside of the container 42, the solvent 33 may be gelled, or the solvent 33 The sheet 46 having absorbed therein may be placed in the container 42.

  Further, the vapor amount of the solvent 33 may be increased by heating the container 42 with a heater (not shown). Alternatively, the tip of the pipe 43 may be inserted into the solvent 33 to generate a gas bubble in the solvent 33 to increase the amount of vapor of the solvent 33. On the contrary, if the solvent 33 having a high boiling point is used, the vapor amount of the solvent 33 can be suppressed, and the solvent 33 can be prevented from being excessively absorbed by the correction paste 6.

  In the same manner as in the first embodiment, after positioning the through hole 3a of the film 3 above the open defect portion 16a, the electromagnetic valve 12 is opened for the time set by the timer 13. Thereby, the vapor | steam of the gas and the solvent 33 is mixed in the container 42, gas is injected to the range containing the hole 5b of the paste container 5, and gas is injected also to the surface of the correction paste 6. FIG.

  As shown in FIG. 3, the film 3 is deformed by the gas injection, and the film 3 in a range including the through hole 3 a comes into contact with the substrate 15. If the gas injection is stopped, as shown in FIG. 4, the film 3 in the range including the through hole 3a is separated from the substrate 1 by the restoring force of the film 3, and the substrate 1 has substantially the same shape as the through hole 3a. A correction pattern 6a is formed.

  In this Embodiment 3, since the gas containing the vapor | steam of the solvent 33 of the correction paste 6 is injected, it is possible to prevent the correction paste 6 from drying by supplying an appropriate amount of the solvent 33 to the correction paste 6 in the coating unit 1. it can. Therefore, even when a plurality of open defect portions 16a are corrected using the same application unit 1, the correction paste 6 is dried, the correction pattern 6a is interrupted, the shape is tapered, or the through hole 3a is clogged. Can be prevented, and the coating performance can be stabilized over a long period of time.

  FIG. 15 is a block diagram showing a modification of the third embodiment, and is a diagram contrasted with FIG. In FIG. 15, in this modified example, the gas injection device 40 is replaced with a gas injection device 47. The gas injection device 47 is obtained by adding electromagnetic valves (V) 48 and 49 and a selector (S) 50 in the gas injection device 40. The inlet of the electromagnetic valve 48 is connected to the outlet 42a of the container 42, and the outlet of the electromagnetic valve 48 is connected to the inlet of the joint 9 through a pipe. The inlet of the electromagnetic valve 49 is connected to a pipe between the outlet of the regulator 11 and the electromagnetic valve 12, and the outlet of the electromagnetic valve 49 is connected to a pipe between the outlet of the electromagnetic valve 48 and the inlet of the joint 9.

  The output signal of the timer 13 is given to the selector 50. The selector 50 is controlled by a selection signal φS. The selection signal φS is set to “H” level when injecting a gas containing the solvent 33 vapor of the correction paste 6, and to the “L” level when injecting gas not containing the solvent 33 of the correction paste 6. Is done. The selector 50 provides the output signal of the timer 13 to the electromagnetic valves 12 and 48 when the selection signal φS is at “H” level, and outputs the output signal of the timer 13 when the selection signal φS is at “L” level. The electromagnetic valve 49 is given.

  When selection signal φS is at “H” level, electromagnetic valves 12 and 48 are opened for a predetermined time in response to the output signal of timer 13. Thereby, gas flows from the gas supply source 14 through the path of the regulator 11, the electromagnetic valve 12, the solvent vapor generation unit 41, the electromagnetic valve 48, and the nozzle 8, and the gas containing the vapor of the solvent 33 is injected from the nozzle 8.

  When selection signal φS is at “L” level, electromagnetic valve 49 is opened for a predetermined time in response to the output signal of timer 13. As a result, gas flows from the gas supply source 14 through the path of the regulator 11, the electromagnetic valve 49, and the nozzle 8, and gas that does not contain the vapor of the solvent 33 is injected from the nozzle 8.

  In this modified example, since either one of the gas containing the vapor of the solvent 33 and the gas not containing the vapor of the solvent 33 can be selectively injected, the amount of the solvent 33 absorbed by the correction paste 6 It is possible to prevent the solvent 33 from being excessively absorbed by the correction paste 6. For example, when a plurality of open defect portions 16a are corrected using the same application unit 1, each open defect portion 16a is basically corrected by injecting a gas that does not contain the vapor of the solvent 33, and a predetermined number of open defects. The open defect portion 16a may be corrected by injecting a gas containing the vapor of the solvent 33 every time the portion 16a is corrected or every time a predetermined time elapses. When the viscosity of the correction paste 6 is increased, the coating unit 1 is disposed at a position where the through hole 3 a does not contact the substrate 15, and a gas containing the vapor of the solvent 33 is jetted, and the solvent 33 is injected into the correction paste 6. The steam may be supplied.

  FIG. 16 is a block diagram showing still another modification of the third embodiment, and is a diagram contrasted with FIG. 14, in this modified example, the coating unit 1 is replaced with the coating unit 60, and the gas ejection device 10 that ejects the gas not including the vapor of the solvent 33 illustrated in FIG. 1 and the solvent illustrated in FIG. Both the gas injection apparatus 40 which injects the gas containing 33 vapor | steam are provided.

  The application unit 60 is different from the application unit 1 in that the nozzle 8 is used for injecting a gas that does not contain the vapor of the solvent 33 and a nozzle 61 that injects a gas that contains the vapor of the solvent 33 is added. The proximal end of the nozzle 61 is connected to the gas supply hole 7 c opened in the lid 7, and the distal end of the nozzle 61 is disposed in the vicinity of the hole 5 b opened in the bottom of the paste container 5. Further, the outlet of the joint 62 is joined to the upper opening of the gas supply hole 7c, and the inlet of the joint 62 is connected to the outlet 42a of the container 42 of the gas injection device 40 via a pipe (not shown). The inlet of the joint 9 is connected to the outlet of the electromagnetic valve 12 of the gas injection device 10 through a pipe (not shown).

  When applying the correction paste 6 to the open defect portion 16a, the through hole 3a is positioned above the open defect portion 16a, the electromagnetic valve 12 of the gas injection device 10 is opened for a predetermined time, and the gas does not contain the solvent 33. Is ejected from the nozzle 8. Thereby, as shown in FIGS. 3 and 4, the correction paste 6 is applied to the open defect portion 16a through the through hole 3a.

  During standby, the coating unit 60 is retracted to a position away from the substrate 15, the electromagnetic valve 12 of the gas injection device 40 is opened for a predetermined time as required, and a gas containing the solvent 33 is injected from the nozzle 61. Thereby, an appropriate amount of the solvent 33 is supplied to the correction paste 6 in the coating unit 60, and drying of the correction paste 6 is prevented. For example, when correcting a plurality of open defect portions 16a using the same coating unit 60, each time a predetermined number of open defect portions 16a are corrected or a gas containing the vapor of the solvent 33 is injected every time a predetermined time elapses. Good.

  If the pressure of the regulator 11 of the gas injection device 40 is set low, the deformation amount of the film 3 can be suppressed, and it becomes unnecessary to retract the coating unit 60 to a position away from the substrate 15 during standby. .

  FIG. 17 is a block diagram showing still another modification of the third embodiment, and is a diagram contrasted with FIG. 17, in this modification, the coating unit 1 is replaced with the coating unit 65, and the gas injection device 40 is replaced with the gas injection device 10 shown in FIG.

  The coating unit 65 is a unit in which a container for the solvent 33 is provided in the coating unit 1. A groove 4b is formed on the upper surface of the guide member 4, the groove 4b serves as a container for the solvent 33, and the solvent 33 of the correction paste 6 is injected into the groove 4b. In order to prevent the solvent 33 from leaking around, it is preferable to put the sheet 46 having absorbed the solvent 33 into the groove 4b. The coating unit 65 is filled with the vapor of the solvent 33, and an appropriate amount of the solvent 33 is supplied to the correction paste 6 in the coating unit 65. Even in this modified example, the same effect as in the third embodiment can be obtained.

  FIG. 18 is a block diagram showing still another modification of the third embodiment, and is a diagram contrasted with FIG. In FIG. 18, in this modified example, the coating unit 65 is replaced with a coating unit 70. The coating unit 70 is provided with a valve 71 in each vent hole 7 b of the coating unit 65. During standby, the upper surface of the vent hole 7b is closed by the weight of the valve 71. When the gas is injected from the nozzle 8, the pressure in the coating unit 70 rises, the valve 71 is lifted upward, and the gas in the coating unit 70 is discharged to the outside through the vent hole 7b. In this modified example, since the valve 71 is provided in each vent 7b, it is possible to prevent the vapor of the solvent 33 from leaking from the vent 7b during standby.

[Embodiment 4]
FIG. 19 is a view showing a main part of a coating apparatus according to Embodiment 4 of the present invention, and is a view of coating unit 1 as viewed from below. In FIG. 19, the through hole 3 a is formed in a straight line at the approximate center of the film 3. In this state, since the application angle of the correction pattern 6a is limited, the open defect portion 16a that can be corrected is limited. Therefore, in the fourth embodiment, a rotation mechanism 72 is provided in the coating unit 1 as shown in FIG. Thereby, even when the direction of the through-hole 3a and the wiring 16 is different, the coating unit 1 is rotated by the rotating mechanism 72, and the correction paste 6 is applied by matching the length direction of the through-hole 3a with the extending direction of the wiring 16. It becomes possible.

  When the open defect portion 16a is long and requires a long correction pattern 6a, the open defect portion 16a is divided into a plurality of sections in the length direction, and the through holes 3a are aligned for each section. The correction paste 6 may be applied. Alternatively, by preparing a plurality of coating units 1 and changing the shape and length of each through hole 3a, the optimum coating unit 1 is selected and corrected according to the shape and length of the open defect portion 16a. This makes it possible to expand the applicable range of the correction and shorten the tact time of the correction.

[Embodiment 5]
FIG. 21 is a view showing a main part of a coating apparatus according to Embodiment 5 of the present invention, and is a view of coating unit 1 as viewed from below. In FIG. 21, in this Embodiment 5, the through-hole 3a of the film 3 is formed in a minute rectangle or a minute circle. By applying a plurality of times while shifting the application position of the application unit 1, it is also possible to connect a small correction pattern and draw a correction pattern of an arbitrary shape.

  FIG. 22 is a diagram showing a method of applying the correction paste 6 using the application unit 1 having the through hole 3a shown in FIG. 22, in this coating method, coating is performed n times (where n is an integer of 2 or more) while shifting the coating position by a predetermined distance in a desired direction (left direction in the figure). One correction pattern 6a is formed by one application, and two adjacent correction patterns 6a are formed so as to partially overlap each other. Thereby, a linear correction pattern is formed. One correction pattern 6a is formed in a rectangle having one side of 5 μm or less or a circle having a diameter of 5 μm or less. Therefore, the correction paste 6 applied at a time is very small, and it becomes easier to dry than a paste applied in a large amount.

  If a waiting time is provided each time one correction pattern 6a is applied, or if a drying or baking process is provided, the applied correction pattern 6a (correction paste 6) is opposed to the lower surface of the film 3 (on the substrate 15). Can be prevented from adhering to the surface. Further, as shown in FIGS. 23A and 23B, a plurality of (three in the figure) correction patterns 6a are first applied at intervals, and then a plurality of correction patterns 6a (two in the figure) are applied. The correction pattern 6a may be applied so as to fill the space between the two.

  FIG. 24 is a cross-sectional view showing a modified example of the fifth embodiment. In this modification, the coating unit 1 is replaced with a coating unit 75. In the coating unit 75, a recess 3c having a predetermined depth (for example, several μm) is formed at the center of the lower surface of the film 3, and a through hole 3a is formed at the bottom of the recess 3c. The area of the recess 3c is set larger than the area of the coating pattern to be drawn, for example, about 100 μm square.

  In this modified example, since the through-hole 3a is provided at the bottom of the recess 3c, even if the application is performed while changing the application position little by little as shown in FIG. 22 and FIGS. It can suppress that the corrected paste 6 made adheres to the lower surface of the film 3.

[Embodiment 6]
FIG. 25 is a cross-sectional view showing a configuration of a coating unit 80 of a coating apparatus according to Embodiment 6 of the present invention. In FIG. 25, the application unit 80 is different from the application unit 1 in that the paste container 5 is replaced with the paste container 81, the nozzle 8 is removed, and the gas supply hole 7a of the lid 7 is formed in a nozzle shape. It is. The inner diameter of the gas supply hole 7a is gradually reduced downward.

  The paste container 81 is formed in a cylindrical shape, is inserted into the guide hole 4a of the guide member 4, and is supported so as to be movable in the vertical direction by deformation of the guide hole 4a and the film 3. The paste container 81 is formed to be thinner than the paste container 5 in accordance with the minute through hole 3a. The edge of the opening 81a at the lower end of the paste container 81 is in contact with the upper surface of the film 3 so as to surround the through hole 3a. The diameter of the opening 81b at the upper end of the paste container 81 is set larger than the diameter of the opening 81a at the lower end. This is because the area for receiving the gas injected from the gas supply hole 7a is widened so that the paste container 81 can be easily moved downward. Further, since the inner diameter of the paste container 82 is formed thin, the correction paste 6 can be stably held inside the paste container 81 by capillary action.

  Alternatively, the lower end surface of the paste container 81 and the upper surface of the film 3 may be fixed with an adhesive or the like to prevent the correction paste 6 from leaking from the gap. As a result, the filling amount of the correction paste 6 can be further reduced.

  Further, a filter may be inserted into the opening 81 b at the upper end of the paste container 81. In this case, it is possible to reduce the wind pressure received by the correction paste 6 during gas injection and to prevent the correction paste 6 from drying.

  FIG. 26 is a cross-sectional view showing a modified example of the sixth embodiment. In FIG. 26, the application unit 85 is different from the application unit 80 in that the cylindrical member 2 and the guide member 4 are integrated. A disc-shaped guide portion 2 a is formed at the lower end inside the cylindrical member 2. A guide hole 2b that holds the paste container 81 movably in the vertical direction is formed in the center of the guide 2a.

  A groove 2c is formed on the upper surface of the guide portion 2a, and a solvent 33 of the correction paste 6 is injected into the groove 2c. In order to prevent the solvent 33 from leaking around, it is preferable to put the sheet 46 having absorbed the solvent 33 into the groove 2c. In addition, a hole 2d for supplying the vapor of the solvent 33 to the film 3 side is formed in the guide portion 2a. As a result, the coating unit 85 is filled with the vapor of the solvent 33, and an appropriate amount of the solvent 33 is supplied to the correction paste 6 in the coating unit 85. In addition, when the contact surface between the paste container 81 and the film 3 is not fixed with an adhesive or the like, it is assumed that the correction paste 6 leaks from the paste container 81 to some extent, but the vapor of the solvent 33 is released through the holes 2d. By flowing the gas to be contained, the leaked correction paste 6 can be prevented from drying.

  FIG. 27 is a cross-sectional view showing another modification of the sixth embodiment. In FIG. 27, the application unit 86 is different from the application unit 85 in that the paste container 81 extends upward and the upper end of the paste container 81 is close to the lower surface of the lid 7. At the time of standby, the inside of the paste container 81 is almost sealed. When gas is injected from the gas supply hole 7a toward the opening 81b of the paste container 81, the paste container 81 moves downward due to the pressure of the gas, and the gap between the paste container 81 and the lid 7 increases. When the gas injection is stopped, the paste container 81 returns upward due to the restoring force of the film 3, and the gap between the paste container 81 and the lid 7 becomes small. In this modified example, since the inside of the paste container 81 is almost sealed except when the application operation is performed, drying of the correction paste 6 in the paste container 81 can be suppressed.

  FIG. 28 is a cross-sectional view showing still another modification of the sixth embodiment. In FIG. 28, the application unit 87 is different from the application unit 86 in that an insertion member 88 is added. The insertion member 88 is immersed in the correction paste 6 in the paste container 81. The insertion member 88 is, for example, a sphere, and FIG. 28 shows a state where one sphere is inserted. The inner diameter of the hole into which the correction paste 6 of the paste container 81 is injected is formed small, but the inner diameter is sufficiently larger than the through hole 3a, and a sphere having a diameter slightly smaller than the inner diameter is inserted. A plurality of spheres may be overlapped and a needle may be inserted instead of the sphere.

  In this modified example, since the insertion member 88 is immersed in the correction paste 6, it is possible to raise the correction paste 6 and reduce the amount of the correction paste 6 to be injected. Further, if the gap between the hole for injecting the correction paste 6 in the paste container 81 and the insertion member 88 is made smaller, the effect due to the capillary phenomenon is increased, so even if the lower end of the paste container 81 and the film 3 are not bonded. It becomes easy to hold the correction paste 6 in the paste container 81.

  FIG. 29 is a cross-sectional view showing still another modification of the sixth embodiment. In FIG. 29, the coating unit 89 is different from the coating unit 86 in that the cylindrical member 2 is replaced with a square tube member 90 and the circular lid 7 is replaced with a square lid 91. A plate-like guide portion 90 a is formed at the lower end inside the rectangular tube member 90. A guide hole 90b for holding the paste container 81 movably in the vertical direction is formed at the center of the guide portion 90a.

  A groove 90c is formed on the upper surface of the guide portion 90a, and the solvent 33 of the correction paste 6 is injected into the groove 90c. It is preferable to put the sheet 46 having absorbed the solvent 33 in the groove 90c so that the solvent 33 does not leak around. Further, a hole 90d for supplying the vapor of the solvent 33 to the film 3 side is formed in the guide portion 90a. The upper opening of the rectangular tube member 90 is closed with a square lid 91. A nozzle-like gas supply hole 91a is formed at the center of the lid 91, and a plurality of vent holes 91b are formed around the gas supply hole 91a. The film 3 is provided so as to be replaceable so as to cover the opening at the lower end of the rectangular tube member 90. Both end portions of the film 3 are fixed to both side surfaces of the rectangular tube member 90 by fixing metal fittings 92. At this time, a certain tension is applied to the film 3. The edge of the lower end portion of the rectangular tube member 90 is rounded with a large diameter, thereby preventing the film 3 from being folded.

  In this modified example, it is not necessary to bond the rectangular tube member 90 and the film 3, so that the assembly process of the coating unit 89 can be simplified. Moreover, since the rectangular tube member 90 etc. can be reused by replacing the film 3, it is economical.

  Moreover, since the film 3 is deformed with the side surface of the rectangular tube member 90 as a fixed surface (fulcrum), the length (L) of the deformed film 3 is larger than when the film 3 is bonded to the lower end surface of the cylindrical member 2. Thus, the amount of deformation of the film 3 downward increases. Therefore, the gap between the substrate 15 and the coating unit 89 at the time of coating can be increased, and the gap between the substrate 15 and the coating unit 89 can be easily managed. The structure shown in FIGS. 27, 28, and 29 may be applied to the application unit described above.

  In addition, if the roll-shaped film 3 previously slit-processed by the predetermined space | interval is used, the film 3 can be easily cut | judged to predetermined length, and it is convenient.

[Embodiment 7]
FIG. 30 is a sectional view showing a configuration of a coating unit 95 of the coating apparatus according to Embodiment 7 of the present invention. In FIG. 30, this coating unit 95 is different from the coating unit 85 in FIG. 26 in that the film 3 is deformed downward using a linear actuator instead of air pressure. The upper opening of the cylindrical member 2 is closed with a disc-shaped lid 96. A concave portion 96a is formed at the center of the lower surface of the lid 96, and a linear motion actuator 97 is fixed in the concave portion 96a with the drive shaft 97a facing downward.

  On the other hand, a piston 98 is inserted into the lower hole of the paste container 81 from above, and the correction paste 6 is injected under the piston 98. An elastic member (for example, a rubber plate) 99 is provided between the lower end of the drive shaft 97 a of the linear actuator 97 and the upper end of the piston 98. The elastic member 99 is provided to prevent the force of the linear actuator 97 from being applied directly to the film 3.

  When the drive shaft 97a of the linear actuator 97 is pushed downward, the correction paste 6 is pushed downward via the elastic member 99 and the piston 98, the film 3 is deformed downward, and the same application as in FIG. 3 is performed. It is. In the seventh embodiment, the same effect as in the first embodiment can be obtained. Note that the amount of movement of the drive shaft 97a of the direct acting actuator 97 may be very small. As the direct acting actuator 97, for example, an electromagnetic solenoid, an air cylinder, a piezoelectric element, a motor that can rotate a screw shaft, or the like is used.

  FIG. 31 is a sectional view showing a modification of the seventh embodiment. In FIG. 31, the application unit 100 differs from the application unit 95 in that the paste container 81 is replaced with a cylindrical paste container 101, and the piston 98 is removed. The paste container 101 is formed with a through hole 101a having a constant inner diameter, and the correction paste 6 is injected into the through hole 101a. The elastic member 99 is provided so as to cover the through hole 101a. The drive shaft 97 a of the linear actuator 97 directly presses the upper surface of the paste container 101 via the elastic member 99. In this case, the correction paste 6 cannot be pressed directly, but due to the deformation of the film 3, the lower opening of the hole 3a contacts the substrate 15, and the correction paste 6 is applied to the open defect portion 16a. The film thickness of the applied correction paste 6 is thinner than when the correction paste 6 is pressed and pressed, but the drawing performance is not inferior.

[Embodiment 8]
FIG. 32 is a diagram showing a configuration of a pattern correction apparatus 110 according to the eighth embodiment of the present invention. In FIG. 32, in the pattern correction device 110, a gantry type XY stage 112 is mounted on a surface plate 111. The XY stage 112 includes an X-axis stage 112a that moves in the left-right direction in the figure, and a portal-shaped Y-axis stage 112b that can move in a direction perpendicular to the paper surface. The X-axis stage 112a is provided with a Z-axis stage 113 that can move in the vertical direction. On the Z-axis stage 113, an observation optical system 114, a laser 115, an objective lens 116, and a baking apparatus 17 are mounted. The laser 115 is provided on the observation optical system 114, and the objective lens 116 is provided on the lower end of the observation optical system 114. The Z-axis stage 113 is provided with an XYZ stage 117, and the coating unit 1 is mounted on the XYZ stage 117. A chuck 118 is provided on the surface plate 111, and the substrate 15 is fixed horizontally by the chuck 118.

  By driving the XY stage 112 and the Z-axis stage 113, the observation optical system 114, the laser 115, the objective lens 116, the baking apparatus 17, and the coating unit 1 can be positioned above a desired position on the surface of the substrate 15. It has become. Further, by driving the XYZ stage 117, the film 3 and the surface of the substrate 15 can be opposed to each other with a predetermined gap G1 in a state where the through hole 3a is positioned above the open defect portion 16a. During standby, the coating unit 1 is moved to place the through hole 3 a on the solvent vapor generation unit 31. The observation optical system 114 is used for observation of the open defect portion 16a and the correction patterns 6a and 6A. The laser 115 is used for processing the through hole 3a of the film 3, shaping the open defect portion 16a, removing unnecessary portions of the correction patterns 6a and 6A, and the like.

  In addition, you may provide the rotation mechanism 72 which rotates the coating unit 1 as needed. A plurality of coating units 1 and a mechanism (not shown) capable of selecting and coating a desired coating unit 1 among them may be additionally provided in the XYZ stage 117. Further, the coating unit 1 mounted on the XYZ stage 117 may be directly mounted on the Z-axis stage 113.

  According to the coating device and the pattern correction device described so far, the defective portion generated in the fine pattern can be easily corrected, so that the open defect of the wiring formed on the TFT (thin film transistor) array substrate of the liquid crystal panel In addition to the correction of the portion, the present invention can be applied to correction of defective portions of various substrates.

  If a plurality of through holes 3a are formed on the film 3, it is possible to draw a plurality of correction patterns 6a at a time by a single coating operation.

  Here, the coating unit is used to correct a defective portion of the fine pattern, but the coating unit can be applied to various uses other than the correction. It is also possible to print on.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  1,20,21,24,26,27,29,60,65,70,75,80,85-87,89,95,100 coating unit, 2 cylindrical member, 2a guide part, 2b guide hole, 2c groove 2d hole, 3,30 film, 3a through hole, 3b, 3c recess, 4 guide member, 4a guide hole, 4b groove, 5, 22, 81, 101 paste container, 5a, 81a, 81b opening, 5b hole, 6 correction paste, 6a, 6A correction pattern, 7, 91 lid, 7a, 91a gas supply hole, 7b, 91b vent hole, 8, 61 nozzle, 8a injection port, 9, 62 joint, 10, 40, 47 gas injection device , 11 Regulator, 12, 48, 49 Electromagnetic valve, 13 Timer, 14 Gas supply source, 15 Substrate, 16 Wiring, 16a Open defect, 17 Baking device, 23, 28 , 35, 99 Elastic member, 25 Press plate, 31, 41 Solvent vapor generation section, 32, 42 container, 33 solvent, 34, 46 sheet, 43 piping, 45 filter, 50 selector, 71 valve, 88 Insertion member, 90 Square tube member, 90a guide section, 90b guide hole, 90c groove, 90d hole, 92 fixing bracket, 96 lid, 96a recess, 97 linear motion actuator, 97a drive shaft, 98 piston, 110 pattern correction device, 111 surface plate, 112 XY stage, 112a X-axis stage, 112b Y-axis stage, 113 Z-axis stage, 114 observation optical system, 115 laser, 116 objective lens, 117 XYZ stage, 118 chuck.

Claims (20)

A coating apparatus for forming a fine pattern by applying a liquid substance on a substrate,
A first container in which at least a part of the bottom is formed of a film, and a through-hole having a shape corresponding to the fine pattern is opened in the film;
A second container including a cylindrical portion disposed on the film so that an edge of an opening at the lower end surrounds the through-hole, and into which a liquid substance is injected;
A guide member that supports the second container so as to be movable in the vertical direction;
A nozzle provided at the tip of the nozzle facing the upper end of the second container;
The film and the substrate face each other with a gap in a state where the substrate and the through hole are aligned,
Further, gas is injected through the nozzle to push the second container downward, and a range including the through-hole of the film is protruded downward to open the opening below the through-hole. A coating apparatus comprising gas injection means for contacting the substrate and applying the liquid substance to the substrate through the through hole. A coating apparatus for applying a correction liquid to a defective portion of a fine pattern formed on a substrate,
A first container in which at least a part of the bottom is formed of a film, and a through-hole having a shape corresponding to the defect portion is opened in the film;
A second container including a cylindrical portion that is disposed on the film so that an edge of the opening at the lower end surrounds the through-hole, and into which the correction liquid is injected;
A guide member that supports the second container to be movable in the vertical direction;
A nozzle provided at the tip of the nozzle facing the upper end of the second container;
The film and the substrate face each other with a gap in a state where the defect portion and the through hole are aligned,
Further, gas is injected through the nozzle to push the second container downward, and a range including the through-hole of the film is protruded downward to open the opening below the through-hole. A coating apparatus comprising gas injection means for contacting the substrate and applying the correction liquid to the defective portion through the through hole. Due to the pressure of the gas injected from the tip of the nozzle, the second container is pushed downward, and the correction liquid in the second container is pushed out from the through hole,
3. The coating according to claim 2, wherein the film is pushed downward by the second container and deforms downward, and when the gas injection is stopped, the film returns to its original position by its restoring force. apparatus. The opening at the upper end of the first container is closed by a first lid;
4. The coating apparatus according to claim 2, wherein a base end of the nozzle is fixed to the first lid. 5. The opening at the upper end of the first container is closed by a first lid;
The coating device according to claim 2, wherein the nozzle is formed in the first lid.   The coating according to claim 4 or 5, wherein a vent hole for allowing the gas jetted from the nozzle to escape to the outside of the first container is formed in the first lid. apparatus. The first container includes a tubular member;
The coating apparatus according to any one of claims 2 to 6, wherein the film is bonded to a lower end surface of the cylindrical member. The first container includes a tubular member;
The film is provided so as to be replaceable so as to cover the opening at the lower end of the cylindrical member,
The coating apparatus according to any one of claims 2 to 6, wherein both end portions of the film are held on a side surface of the cylindrical member. The upper end of the cylindrical portion of the second container is closed with a second lid having a hole in the center,
The application according to any one of claims 2 to 8, wherein the correction liquid is pushed out from the through hole by a gas that is jetted from the nozzle and passes through the hole of the second lid. apparatus. Furthermore, an elastic member provided to close the opening at the upper end of the cylindrical portion of the second container,
The coating apparatus according to any one of claims 2 to 8, wherein the elastic member is deformed downward by the gas ejected from the nozzle, and the correction liquid is pushed out from the through hole. Furthermore, a pressing plate provided to be movable in the vertical direction within the cylindrical portion of the second container is provided,
The correction fluid is injected between the film and the push plate,
The coating apparatus according to any one of claims 2 to 8, wherein the pressing plate is pushed downward by the gas ejected from the nozzle, and the correction liquid is pushed out from the through hole.   12. The coating apparatus according to claim 2, wherein the gas includes a solvent vapor of the correction liquid.   The coating apparatus according to claim 12, wherein the gas injection unit includes a solvent vapor generation unit that generates a vapor of the solvent of the correction liquid.   The solvent vapor generation means provided in the first container for generating a vapor of the solvent of the correction liquid to suppress drying of the correction liquid is further provided. The coating apparatus in any one of to.   Furthermore, the apparatus further comprises solvent vapor supply means for supplying a vapor of the solvent of the correction liquid to a range including at least the through-hole on the lower surface of the film, and suppressing drying of the correction liquid. The coating device according to claim 14. A pattern correction apparatus comprising the coating apparatus according to any one of claims 2 to 15 and correcting a defective portion of a fine pattern formed on a substrate,
The first container and the substrate are moved relative to each other, and a positioning means is provided for facing the film and the substrate with a gap in a state where the defect portion and the through hole are aligned. Pattern correction device. A coating apparatus for applying a correction liquid to a defective portion of a fine pattern formed on a substrate,
At least a part of the bottom is formed of the first film, a recess is formed on the upper surface of the first film, a through hole having a shape corresponding to the defect is opened at the bottom of the recess, and the recess A container in which the correction liquid is injected and the recess is covered with a second film;
A nozzle provided at the tip of the spray port so as to face the second film;
The first film and the substrate face each other with a gap in a state where the defect portion and the through hole are aligned,
Further, the gas is injected through the nozzle, the second film is pushed downward to push out the correction liquid from the through hole, and a range including the through hole in the first film is lowered downward. A coating apparatus comprising: a gas jetting unit that protrudes to bring the lower opening of the through hole into contact with the substrate and applies the correction liquid to the defective portion through the through hole. A coating apparatus for applying a correction liquid to a defective portion of a fine pattern formed on a substrate,
A first container in which at least a part of the bottom is formed of a film, and a through-hole having a shape corresponding to the defect portion is opened in the film;
A second container including a cylindrical portion that is disposed on the film so that an edge of the opening at the lower end surrounds the through-hole, and into which the correction liquid is injected;
A guide member that supports the second container so as to be movable in the vertical direction;
The film and the substrate face each other with a gap in a state where the defect portion and the through hole are aligned,
Further, the correction liquid in the second container or the second container is pushed downward to project the range including the through hole of the film downward, and the opening below the through hole is A coating apparatus, comprising: a linear actuator that contacts a substrate and applies the correction liquid to the defective portion through the through hole. A pattern correction method for correcting a defective portion of a fine pattern formed on a substrate,
A first container in which at least a part of the bottom is formed of a film, and a through-hole having a shape corresponding to the defect portion is opened in the film;
A second container including a cylindrical portion that is disposed on the film so that an edge of an opening at the lower end surrounds the through-hole, and into which the correction liquid is injected;
A guide member that supports the second container so as to be movable in the vertical direction;
A nozzle provided at the tip of the nozzle facing the upper end of the second container;
A first step of confronting the film and the substrate with a gap in a state where the defect portion and the through hole are aligned;
Gas is injected through the nozzle to push the second container downward, and the range including the through hole in the film is protruded downward, so that the opening below the through hole is formed in the substrate. A second step of contacting and applying the correction liquid to the defect through the through hole;
And a third step of separating the film from the substrate by stopping the gas injection.   The pattern correction method according to claim 19, wherein the defect portion is corrected by repeating the first to third steps while changing the application position.

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