JP2007147837A - Defect removing device, defect removing method, manufacturing method of color filter, color filter and liquid crystal element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a defect removing device capable of quickly removing a defective region over a wide range and preventing the deterioration of quality relating to the defect removal. <P>SOLUTION: The defect removing device 1 controls a Z-directional positioning mechanism 17 and adjusts an interval between a nozzle 9 and the defective region 55. The defect removing device 1 controls an X-directional positioning mechanism 15, a Y-directional positioning mechanism 16 and a θ-directional positioning mechanism 18 and performs relative positioning between a substrate 3 and a water column laser irradiation device 7. The defect removing device 1 moves the nozzle 9 of the water column laser illumination device 7 to the position of an illumination point 57 in the defective region 55. The defect removing device 1 forms a water column 31 by continuously jetting water toward a coloring agent 27 in the defective region 55 from the nozzle 9. The defect removing device 1 condenses laser beams 32 into the water column 31, applies condensed laser to the coloring agent 27 in the defective region 55 as a water column laser 33, allows the coloring agent 27 to flow out by dissolving the same and, thereby, removes the same. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a liquid crystal element used in a display device, a color filter constituting the liquid crystal element, a defect removing apparatus for removing defects such as a color filter, and the like.

Conventionally, as a method for forming a color filter pattern in a liquid crystal display on a substrate, there are various methods such as a dyeing method, a pigment dispersion method, an electrodeposition method, and a printing method.
However, any of the above methods has a problem in terms of cost, yield, and the like because it is necessary to repeat the same process for three colors of R (red), G (green), and B (blue).
Therefore, a pattern forming apparatus has been proposed that forms a colored layer pattern by ejecting ink of three colors of R (red), G (green), and B (blue) onto a substrate by an inkjet method (for example, [Patents] Reference 1]).
According to this ink jet method, pattern formation of three colors of R (red), G (green), and B (blue) can be performed in a single process, and the manufacturing process can be simplified, thereby reducing cost and yield. The improvement etc. can be aimed at.

  In addition, when a defect occurs in the colored layer formed by applying the colorant, the defect is removed by irradiating the YAG laser after the colorant is cured to burn off the colorant at the defective portion. The colorant is applied again to the portion where the defect has been removed to correct the defect.

  In addition, a color filter correction method for correcting a protrusion defect on the substrate surface with jetted high-pressure water has been proposed (see, for example, [Patent Document 2]).

JP 2002-361852 A JP-A-8-271717

However, the defects of the colored layer of the color filter formed by the conventional photolithography method occur in a small area, but the defects of the colored layer of the color filter formed by the inkjet method often occur in a large area.
The spot diameter of a laser used in a conventional defect removal method by laser irradiation is a maximum of 100 μm square. Therefore, there is a problem that the area that can be removed by one irradiation is small and it takes a considerable time to remove the defect.

Further, the conventional defect removal method by laser irradiation has a problem that the colorant dissolved and scattered by laser irradiation is re-fixed to other portions, or the surroundings are altered or deformed by heat due to laser irradiation.
Moreover, there is a problem that it is difficult to completely remove the colorant at the defective portion only with the jet water.

  The present invention has been made in view of the above-described problems, and provides a defect removal apparatus and the like that can quickly remove a wide range of defect areas and prevent deterioration in quality associated with defect removal. For the purpose.

  In order to achieve the above-described object, a first invention is a defect removal apparatus for removing defects on a substrate coated with a coating agent, a laser light generation apparatus for generating laser light, and a liquid supply for supplying a liquid An apparatus and an ejection nozzle that ejects the liquid, and after the coating agent is cured, the liquid is continuously ejected from the ejection nozzle toward the coating agent at the defective part to form a liquid column; The defect removing apparatus is characterized in that a column is used as a light guide tube and a laser beam is irradiated into the liquid column to remove the coating agent at the defective portion.

The defect removal apparatus is an apparatus for removing defects (foreign matter defects, point defects, coating defects, etc.) on the substrate. The defect removing device forms a liquid column (water column etc.) by ejecting liquid (water etc.) from the injection nozzle toward the defective part, and irradiates the liquid column through the laser as a light guide tube, The coating agent at the defective part is dissolved and removed after curing.
The coating agent is a liquid material used when processing a substrate. For example, a color filter used in a display device such as an LCD (Liquid Crystal Display Panel), a PDP (Plasma Display Panel), or an organic EL (Electro Luminescent Display). And a coating material used for pattern formation of electrical circuits and organic semiconductors.

  The defect removal device detects a reference position such as an alignment mark on the substrate, images the substrate, performs image processing, identifies the position of the defect, adjusts the interval between the ejection nozzle and the substrate, and adjusts the reference position and the position of the defect. Based on the above, it is desirable to relatively position the spray nozzle and the substrate.

In 1st invention, the defect removal apparatus can prevent the reattachment of the melt | dissolved material by irradiating a laser, spraying water on a defect part.
Also, if water jetting and laser light irradiation are separated, defect removal by laser light is incomplete or inaccurate, but by passing the laser light through the water column, scattering and refraction of the laser light on the water surface is prevented. As a result, defects can be removed accurately and sufficiently.
In addition, the defect removal device uses the water of the water column laser to flush away the removal object, and suppresses the expansion of heat to improve the cooling effect. Is not generated, and neither alteration nor deformation due to heat occurs.

  A second invention is a defect removal method for removing defects in a substrate coated with a coating agent, and after the coating agent is cured, a liquid is continuously ejected from a spray nozzle toward the coating agent at a defective portion. The defect removing method is characterized by forming a column, irradiating the liquid column with a laser beam using the liquid column as a light guide tube, and removing the coating agent at the defective part.

  2nd invention is invention regarding the defect removal method by the defect removal apparatus of 1st invention.

3rd invention is a color filter manufacturing method which manufactures the color filter which has a colored layer on a board | substrate, Comprising: The process of apply | coating a coloring agent on the said board | substrate, and forming the said colored layer, The hardening of the said coloring agent Later, a liquid column is formed by continuously ejecting liquid from the injection nozzle toward the colorant at the defective portion, and the liquid column is used as a light guide tube to irradiate the liquid column with laser light, thereby the colorant at the defective portion. And a step of removing the color filter.
3rd invention is invention regarding the manufacturing method of the color filter manufactured by removing a defect by the defect removal method of 2nd invention.

  A fourth invention is a color filter from which a defect is removed by the defect removing method of the second invention.

A fifth invention is a liquid crystal element configured by bonding a set of two substrates and enclosing a liquid crystal between the substrates, and the substrate has defects removed by the defect removing method of the second invention. A liquid crystal element including a color filter.
The fifth invention is an invention relating to a liquid crystal element including a color filter from which defects have been removed by the defect removing method of the second invention.

  According to the present invention, it is possible to provide a defect removal apparatus and the like that can quickly remove a defect area over a wide range and prevent deterioration in quality associated with defect removal.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of a defect removal apparatus and the like according to the invention will be described in detail with reference to the accompanying drawings. In the following description and the accompanying drawings, the same reference numerals are given to components having substantially the same functional configuration, and redundant description will be omitted.

(1. Configuration of the defect removal apparatus 1)
Initially, the structure of the defect removal apparatus 1 which concerns on embodiment of this invention is demonstrated, referring FIG.
FIG. 1 is a schematic perspective view of the defect removal apparatus 1.
The X direction indicates the transport direction of the substrate 3, the Y direction indicates the horizontal movement direction of the water column laser irradiation device 5, the Z direction indicates the vertical rotation axis, and the θ direction indicates the rotation direction. The X axis, the Y axis, and the Z axis are perpendicular to each other.

  The defect removal apparatus 1 includes an adsorption table 5, a water column laser irradiation apparatus 7, a laser generator 11, an X direction positioning mechanism 15, a Y direction positioning mechanism 16, a Z direction positioning mechanism 17, a θ direction positioning mechanism 18, an alignment camera 20, a gantry. 21 and the surface plate 22.

The defect removal apparatus 1 is an apparatus for removing defects on the substrate 3. The defect removal apparatus 1 forms a liquid column by continuously ejecting liquid from the nozzle 9 of the water column laser irradiation apparatus 7 toward the defect area 55, and irradiates the liquid column with the laser beam using the liquid column as a light guide tube. Then, the liquid material such as the colorant 27 in the defect area 55 is removed.
In the following description, water is used as the liquid ejected from the water column laser irradiation device 7.

  The suction table 5 is a table that sucks and fixes the substrate 3 (glass substrate, film substrate, etc.). The adsorption of the substrate is performed, for example, by reducing the pressure and vacuum of the air between the adsorption table and the substrate. In this case, the suction table is provided with a small hole (not shown) for sucking air, and at the time of suction, air is sucked by a vacuum pump (not shown) or the like through the hole.

The water column laser irradiation device 7 is a device that continuously jets water toward the defect region 55 of the substrate 3 to form a water column, and irradiates the water column with laser light using the water column as a light guide tube. The above-mentioned water column and laser light using the water column as a light guide tube are referred to as “water column laser”.
The water column laser irradiation device 7 is provided in the gantry 21 via the Y-direction positioning mechanism 16. The water column laser irradiation device 7 has a nozzle 9 that irradiates a water column laser. The water column laser irradiation device 7 irradiates the liquid material in the defect region 55 from the nozzle 9 with a water column laser to remove defects on the substrate 3.

The water pressure generator 10 is a device that generates water pressure and supplies water to the water column laser irradiation device 7. Water is supplied to the water column laser irradiation device 7 through the flow path 12.
The laser generator 11 is a device that generates laser light and supplies it to the water column laser irradiation device 7. The laser beam is supplied to the water column laser irradiation device 7 through the optical path 13.

The X-direction positioning mechanism 15 and the Y-direction positioning mechanism 16 are linear movement positioning mechanisms and are devices that move and position an object in a predetermined axial direction. In addition, a general-purpose thing can be used as a linear movement positioning mechanism, for example, a step motor, a servo motor, and a linear motor are used as an actuator for movement, LM guide (made by THK Corporation), air is used as a guide mechanism. A slide or the like can be used.
The X-direction positioning mechanism 15 performs positioning by moving the suction table 5 in the X direction.
The Y direction positioning mechanism 16 performs positioning by moving the water column laser irradiation device 7 in the Y direction.
For the X direction, a movement positioning mechanism similar to the X direction positioning mechanism 15 may be provided on the water column laser irradiation device 7 side. Regarding the Y direction, a movement positioning mechanism similar to the Y direction positioning mechanism 16 may be provided on the suction table 5 side.

The θ-direction positioning mechanism 18 and the rotational positioning mechanism are devices that rotate and position an object. In addition, as a rotation positioning mechanism, a general purpose thing can be used, for example, a direct drive motor etc. can be used.
The θ-direction positioning mechanism 18 performs positioning by rotating the suction table 5 in the θ direction.

The alignment camera 20 images a predetermined portion (an alignment mark (not shown) or the like formed on the substrate) of the substrate 3 in order to detect the θ direction angle and XY coordinates of the substrate 3 that is sucked and fixed to the suction table 5. Camera. The captured image of the alignment camera 20 is input to an alignment unit (not shown) of the defect removal apparatus 1.
The alignment camera 20 is fixedly supported on a frame (not shown) of the defect removal apparatus 1.

An alignment unit (not shown) performs a process of extracting the θ direction angle and XY coordinates of the substrate 3 based on the captured image. An alignment unit (not shown) compares the extracted data with predetermined data, calculates a deviation between them, and calculates a control amount so as to reduce the deviation. The alignment unit (not shown) outputs control amounts to the X-direction positioning mechanism 15, the Y-direction positioning mechanism 16, the Z-direction positioning mechanism 17, and the θ-direction positioning mechanism 18, and the substrate 3 and the water column laser irradiation device 7. Perform position control.
As described above, the defect removal apparatus 1 controls the substrate 3 and the water column laser irradiation apparatus 7 based on the captured image of the alignment camera 20 so as to have a predetermined θ-direction angle and a predetermined XY coordinate.

(2. Nozzle 9 of water column laser irradiation device 7)
Next, the water column laser irradiation device 7 will be described with reference to FIGS.

(2-1. Irradiation with water column laser 33)
FIG. 2 is a diagram showing irradiation of the water column laser 33 by the water column laser irradiation device 7.
A substrate 3 shown in FIG. 2 is a color filter, and a black matrix 25, a colored layer 26, and the like are formed on a base material 23 such as glass. The substrate 3 has a defect region 55.
The water column laser irradiation device 7 continuously jets water toward the defect region 55 of the substrate 3 to form the water column 31 and irradiates the water column 31 with the laser beam 32 using the water column 31 as a light guide tube. The water column 31 and the laser beam 32 are applied to the defect region 55 of the substrate 3 as the water column laser 33.
The water column laser irradiation device 7 dissolves and removes the colorant 27 in the defect region 55 by irradiating the water column laser 33 from the nozzle opening 29 of the nozzle 9 after the colorant 27 is cured.

(2-2. One aspect of water column laser irradiation device 7)
FIG. 3 is a diagram illustrating an aspect of the water column laser irradiation device 7.
The water column laser irradiation device 7 shown in FIG. 3 includes a water container 35, a condenser lens 37, and the like. The water container 35 is provided with a nozzle 9 and a glass window 39.
In the water container 35, water is supplied from the water pressure generator 10 to generate water pressure. The water supplied from the water pressure generator 10 is continuously jetted from the nozzle port 29 of the nozzle 9 to form a water column 31. The laser beam 32 supplied from the laser generator 11 is collected by the condenser lens 37, passes through the water container 35 through the glass window 39, is emitted from the nozzle port 29 of the nozzle 9, and is water in the water column 31. It progresses while being internally reflected at the air interface.
As the laser beam 32 to be used, it is desirable to use a laser beam having a wavelength of 1000 nm or less, for example, a second harmonic YAG laser (wavelength 532 nm) or a third harmonic YAG laser (wavelength 355 nm).

  As a water column laser irradiation apparatus used in this embodiment, a water jet induction laser irradiation apparatus (SYNOVA, Switzerland) used for semiconductor dicing has already been put into practical use.

(2-3. Form of nozzle 9)
Generally, the pixel width is about 60 μm to 200 μm. Therefore, in order to cope with various color filters, it is desirable that the inner diameter of the nozzle 9 is such that the diameter of the water column 31 is 50 μm or less. In addition, the height of the water column 31 is desirably 2 mm to 3 mm or less. Further, it is desirable to keep the diameter of the water column 31 as thin as possible as close as possible to the object.
Also, a plurality of nozzles 9 may be provided and used depending on the size of the target defective part.

(2-5. Separation of laser irradiation and water jet)
FIG. 4 is a diagram showing defect removal when laser irradiation and water jet are separated.
The water column 47 is ejected from the water pressure generator 41 through the nozzle 45 toward the defect area 55 of the substrate 3. The laser beam 49 is irradiated from the laser generator 43 toward the defect region 55 of the substrate 3. The water column 47 and the laser beam 49 are respectively injected or irradiated onto the defect region 55 of the substrate 3 from different directions.

  The water in the water column 47 that has reached the defect area 55 of the substrate 3 becomes a water film 48 and covers the surface. The laser light 49 is irregularly reflected or refracted on the surface or boundary surface of the water film 48 to become irregularly reflected light 51 or refracted light 53, and all the laser light 49 does not reach the defect region 55 of the substrate 3. Accordingly, reattachment and thermal deformation can be prevented by the water column 47, but the defect removal by the laser beam 49 is insufficient and inefficient.

(3. Operation of defect removal apparatus 1)
Next, the operation of the defect removal apparatus 1 will be described with reference to FIGS.
FIG. 5 is a flowchart showing the operation of the defect removal apparatus 1.

The defect removing apparatus 1 supplies the substrate 3 to the suction table 5 by an automatic supply device (not shown) and operates the vacuum pump to suck it (step 101).
The operator instructs and inputs the defect area 55 and the reference position to the defect removal apparatus 1 (step 102).
The defect removing apparatus 1 detects a reference position such as an alignment mark on the substrate 3 (step 103).
Note that the position of the defective area 55 may be input using an imaging apparatus that captures the surface of the substrate 3 or an image processing apparatus that specifies the position coordinates of the defective area 55 by image processing image data.

The defect removal apparatus 1 controls the Z-direction positioning mechanism 17 and adjusts the interval between the nozzle 9 and the defect area 55 (step 104).
The defect removal apparatus 1 controls the X-direction positioning mechanism 15, the Y-direction positioning mechanism 16, and the θ-direction positioning mechanism 18 to perform relative positioning between the substrate 3 and the water column laser irradiation apparatus 7. The defect removal apparatus 1 moves the nozzle 9 of the water column laser irradiation apparatus 7 to the position of the irradiation point 57 in the defect area 55 (step 105).
The defect removing apparatus 1 continuously injects water from the nozzle 9 toward the colorant 27 in the defect area 55 to form the water column 31 (step 106).
The defect removing apparatus 1 condenses the laser beam 32 in the water column 31 and irradiates the colorant 27 in the defect region 55 as the water column laser 33 to dissolve and remove the colorant 27 (step 107).
The defect removing apparatus 1 repeats the processing from step 105 until the defect removal is completed for all the defective areas 55, scans the inside of the defective area 55, and irradiates the water column laser 33 (step 108).

6 and 7 are diagrams showing a defect region 55 of a coating defect.
The colorant 27-2 (for example, “Green”) of the color layer 26-2 extends beyond the partition walls of the black matrix 25 to the portion of the colorant 27-1 (for example, “Red”) of the color layer 26-1. Overflow and defect area 55 occur. In FIG. 7, the area of the defect region 55 is larger than that in FIG. 6.

In color filter patterning, when a colorant is applied by an inkjet head method or the like, the landing accuracy of a droplet may deteriorate for some reason, and the colorant may protrude from adjacent pixels. Unlike the case of a point defect, a foreign substance defect, etc., in the case of a coating defect, the defect area often covers a wide range.
In addition, when the black matrix is partially missing, or when the portion of the black matrix that should be a hydrophobic region due to a defect in the hydrophobic / hydrophobic pattern formation is partially a hydrophilic region, the colorant is a black matrix partition. Overflowing to the adjacent pixels beyond, a defective area occurs.

8 and 9 are diagrams showing the removal region 59 by the defect removal apparatus 1.
FIG. 8 shows a state after the defect region 55 shown in FIG. 6 is removed.
FIG. 9 shows a state after the defect region 55 shown in FIG. 7 is removed.
The defect removing apparatus 1 dissolves and removes the colorant 27 in the defect area 55 by the water column laser 33. The defect is corrected by applying a predetermined colorant 27 to the removal region 37 again.

FIG. 10 is a view showing the vicinity of a laser removal region 61 by laser irradiation.
By irradiating the defect area 55 with laser, the colorant 27-2 in the defect area 55 is dissolved and scattered, and the laser removal area 61 is formed.
In laser irradiation, since the spot diameter is limited, when the defect region 55 covers a wide range, the defect cannot be removed quickly.
In addition, the colorant 27-2 dissolved and scattered by the laser irradiation may adhere to other places and become a re-fixed material 63, which may cause a new defect.
In addition, laser irradiation may cause alteration or deformation of the surroundings due to heat.

  The processing of the defect removal device described above, such as operation control and various determinations, is performed by a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), a storage device (hard disk, etc.), and an input / output device. An electronic computer such as a computer equipped with a (media reader) or the like can be used.

In this case, programs necessary for various processes and controls, data necessary for program execution, input data, etc. are held in the storage device, and the CPU calls them to the work memory area on the RAM when the processes are executed, and executes operations. Various functions described above can be realized by performing processing (four arithmetic operations, comparison operations, etc.), hardware and software operation control, and the like.
Further, a program or the like necessary for various processes / controls may be distributed on a recording medium such as a CD-ROM, or the program may be transmitted / received via a communication line.

(4. Effects, etc.)
Through the above process, the defect removing apparatus irradiates the colorant in the defective area with a water column laser to dissolve and remove the colorant in the defective area after curing.
Thus, the defect removal apparatus can prevent reattachment of the dissolved material by irradiating the laser while spraying water onto the defective portion.
Also, if water jetting and laser light irradiation are separated, defect removal by laser light is incomplete or inaccurate, but by passing the laser light through the water column, scattering and refraction of the laser light on the water surface is prevented. As a result, defects can be removed accurately and sufficiently.
In addition, since the defect removal device can remove the removal object with water from the water column laser and suppress the expansion of heat to obtain a cooling effect, a new defect due to the re-fixed object can be obtained, such as defect removal only by laser irradiation. Is not generated, and neither alteration nor deformation due to heat occurs.

(5. Manufacture of liquid crystal elements)
FIG. 11 is a diagram showing a liquid crystal element 65 manufactured through coating defect removal by the defect removal apparatus 1.
The substrate 3 is a color filter substrate manufactured through application defect removal by the defect removal apparatus 1. A spacer 69 is formed on the substrate 3 to secure a space for enclosing the liquid crystal 73.
The substrate 71 is an array substrate such as a TFT (Thin Film Transistor).
The substrate 3 and the substrate 71 are bonded together, the sealing material 67 is provided in the peripheral portion of the substrate, and the liquid crystal 73 is sealed between the substrates, whereby the liquid crystal element 65 is manufactured.

  The preferred embodiments of the defect removal apparatus and the like according to the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It will be apparent to those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea disclosed in the present application, and these are naturally within the technical scope of the present invention. Understood.

Schematic perspective view of defect removal apparatus 1 The figure which shows irradiation of the water column laser 33 by the water column laser irradiation apparatus 7 The figure which shows the one aspect | mode of the water column laser irradiation apparatus 7 Diagram showing defect removal when laser irradiation and water jet are separated Flow chart showing operation of defect removal apparatus 1 The figure which shows the defect area | region 55 of a coating defect The figure which shows the defect area | region 55 of a coating defect The figure which shows the removal area | region 59 by the defect removal apparatus 1. The figure which shows the removal area | region 59 by the defect removal apparatus 1. The figure which shows the laser removal area | region 61 vicinity by laser irradiation The figure which shows the liquid crystal element 65 manufactured through the coating defect removal by the defect removal apparatus 1

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ......... Defect removal device 3 ......... Substrate 5 ......... Suction table 7 ......... Water column laser irradiation device 9 ......... Nozzle 10 ......... Water pressure generator 11 ......... Water column laser irradiation device 12 ......... Flow path 13 ... Optical path 15 ... X direction positioning mechanism 16 ... Y direction positioning mechanism 17 ... Z direction positioning mechanism 18 ... θ direction positioning mechanism 20 ... ... Alignment camera 21 ... ... Gantry 22 ……… Surface plate 23 ……… Base material 25 ……… Black matrix (BM)
26 ......... Colored layer 27 ......... Colorant 29 ......... Nozzle port 31 ......... Water column 32 ......... Laser beam 33 ......... Water column laser 35 ......... Water container 37 ......... Condensing lens 39 ... ... Glass window 55 ... ... Defect area 57 ... ... Irradiation point 59 ... ... Removal area 61 ... ... Laser removal area 63 ... ... Re-fixed matter 65 ... ... Liquid crystal element 67 ... ... Sealing material 69 ... …… Spacer 71 ………… Substrate 73 ……… Liquid crystal

Claims (10)

A defect removing apparatus for removing defects on a substrate coated with a coating agent,
A laser beam generator for generating laser beam;
A liquid supply device for supplying a liquid;
An injection nozzle for injecting the liquid,
After the coating agent is cured, the liquid is continuously ejected from the spray nozzle toward the defective coating agent to form a liquid column, and the liquid column is used as a light guide tube to irradiate the liquid column with laser light. A defect removing apparatus for removing the coating material at the defective portion. An interval adjusting means for adjusting an interval between the spray nozzle and the substrate;
Reference position detecting means for detecting a reference position on the substrate;
Defect position specifying means for picking up an image of the substrate and performing image processing to specify the position of the defect;
Relative positioning means for relatively positioning the spray nozzle and the substrate based on the reference position and the position of the defect;
The defect removal apparatus according to claim 1, comprising:   The defect removing apparatus according to claim 1, wherein the substrate is a color filter substrate. A defect removal method for removing defects on a substrate coated with a coating agent,
After curing of the coating agent, liquid is continuously ejected from the spray nozzle toward the coating agent at the defective part to form a liquid column, and the liquid column is used as a light guide tube to irradiate the liquid column with laser light, A defect removing method comprising removing a coating agent at a defective portion. An interval adjusting step for adjusting an interval between the spray nozzle and the substrate;
A reference position detecting step for detecting a reference position on the substrate;
Defect position specifying step of imaging the substrate and performing image processing to specify the position of the defect;
A relative positioning step of relatively positioning the spray nozzle and the substrate based on the reference position and the position of the defect;
The defect removal method according to claim 4, further comprising:   6. The defect removal method according to claim 4, wherein the substrate is a color filter substrate. A color filter manufacturing method for manufacturing a color filter having a colored layer on a substrate,
Applying a colorant on the substrate to form the colored layer;
After curing of the colorant, a liquid column is formed by continuously ejecting liquid from the spray nozzle toward the colorant at the defective portion, and the liquid column is used as a light guide tube to irradiate the liquid column with laser light, Removing the colorant at the defective part;
A method for producing a color filter, comprising: An interval adjusting step for adjusting an interval between the spray nozzle and the substrate;
A reference position detecting step for detecting a reference position on the substrate;
Defect position specifying step of imaging the substrate and performing image processing to specify the position of the defect;
A relative positioning step of relatively positioning the spray nozzle and the substrate based on the reference position and the position of the defect;
The color filter manufacturing method according to claim 7, comprising:   A color filter which has been subjected to defect removal by the defect removal method according to claim 4. A liquid crystal element configured by bonding a set of two substrates and enclosing a liquid crystal between the substrates,
7. The liquid crystal element, wherein the substrate includes a color filter from which defects have been removed by the defect removing method according to any one of claims 4 to 6.

Images