JP2010073823A5 - - Google Patents

Download PDF

Info

Publication number
JP2010073823A5
JP2010073823A5 JP2008238439A JP2008238439A JP2010073823A5 JP 2010073823 A5 JP2010073823 A5 JP 2010073823A5 JP 2008238439 A JP2008238439 A JP 2008238439A JP 2008238439 A JP2008238439 A JP 2008238439A JP 2010073823 A5 JP2010073823 A5 JP 2010073823A5
Authority
JP
Japan
Prior art keywords
substrate holding
substrate
gas
film forming
forming apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008238439A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010073823A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008238439A priority Critical patent/JP2010073823A/ja
Priority claimed from JP2008238439A external-priority patent/JP2010073823A/ja
Priority to US12/559,616 priority patent/US20100068893A1/en
Priority to TW098131144A priority patent/TW201028497A/zh
Priority to KR1020090087274A priority patent/KR20100032326A/ko
Priority to CN200910173919A priority patent/CN101676433A/zh
Publication of JP2010073823A publication Critical patent/JP2010073823A/ja
Publication of JP2010073823A5 publication Critical patent/JP2010073823A5/ja
Withdrawn legal-status Critical Current

Links

JP2008238439A 2008-09-17 2008-09-17 成膜装置、成膜方法、及びコンピュータ可読記憶媒体 Withdrawn JP2010073823A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008238439A JP2010073823A (ja) 2008-09-17 2008-09-17 成膜装置、成膜方法、及びコンピュータ可読記憶媒体
US12/559,616 US20100068893A1 (en) 2008-09-17 2009-09-15 Film deposition apparatus, film deposition method, and computer readable storage medium
TW098131144A TW201028497A (en) 2008-09-17 2009-09-16 Film deposition apparatus, film deposition method, and computer readable storage medium
KR1020090087274A KR20100032326A (ko) 2008-09-17 2009-09-16 성막 장치, 성막 방법 및 컴퓨터 판독 가능 기억 매체
CN200910173919A CN101676433A (zh) 2008-09-17 2009-09-17 成膜装置及成膜方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008238439A JP2010073823A (ja) 2008-09-17 2008-09-17 成膜装置、成膜方法、及びコンピュータ可読記憶媒体

Publications (2)

Publication Number Publication Date
JP2010073823A JP2010073823A (ja) 2010-04-02
JP2010073823A5 true JP2010073823A5 (enExample) 2011-07-14

Family

ID=42007608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008238439A Withdrawn JP2010073823A (ja) 2008-09-17 2008-09-17 成膜装置、成膜方法、及びコンピュータ可読記憶媒体

Country Status (5)

Country Link
US (1) US20100068893A1 (enExample)
JP (1) JP2010073823A (enExample)
KR (1) KR20100032326A (enExample)
CN (1) CN101676433A (enExample)
TW (1) TW201028497A (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101451716B1 (ko) * 2008-08-11 2014-10-16 도쿄엘렉트론가부시키가이샤 성막 방법 및 성막 장치
KR101041143B1 (ko) * 2009-04-16 2011-06-13 삼성모바일디스플레이주식회사 기판 가공 장치
KR101150850B1 (ko) * 2010-01-22 2012-06-13 주식회사 엘지실트론 웨이퍼 세정장비용 카세트 지그 및 이를 구비한 카세트 어셈블리
JP5742185B2 (ja) * 2010-03-19 2015-07-01 東京エレクトロン株式会社 成膜装置、成膜方法、回転数の最適化方法及び記憶媒体
JP5565242B2 (ja) * 2010-09-29 2014-08-06 東京エレクトロン株式会社 縦型熱処理装置
JP5805461B2 (ja) * 2010-10-29 2015-11-04 株式会社日立国際電気 基板処理装置および半導体装置の製造方法
CN102485953B (zh) * 2010-12-01 2014-07-30 北京北方微电子基地设备工艺研究中心有限责任公司 托盘装置及结晶膜生长设备
CN102560636B (zh) * 2010-12-14 2016-03-30 北京北方微电子基地设备工艺研究中心有限责任公司 一种基片承载装置及应用该装置的基片处理设备
JP5675458B2 (ja) * 2011-03-25 2015-02-25 東京エレクトロン株式会社 成膜方法、成膜装置および記憶媒体
JP6061545B2 (ja) * 2012-08-10 2017-01-18 株式会社日立国際電気 半導体装置の製造方法、基板処理方法および基板処理装置
US9695509B2 (en) * 2012-10-23 2017-07-04 Hitachi Kokusai Electric Inc. Substrate processing apparatus, purging apparatus, method of manufacturing semiconductor device, and recording medium
JP5944883B2 (ja) * 2013-12-18 2016-07-05 東京エレクトロン株式会社 粒子逆流防止部材及び基板処理装置
JP2015185750A (ja) * 2014-03-25 2015-10-22 東京エレクトロン株式会社 真空処理装置
JP5895974B2 (ja) * 2014-06-13 2016-03-30 東京エレクトロン株式会社 縦型熱処理装置
JP6447393B2 (ja) * 2015-07-06 2019-01-09 東京エレクトロン株式会社 成膜処理装置、成膜処理方法及び記憶媒体
CN105063550B (zh) * 2015-08-20 2017-11-28 包头天和磁材技术有限责任公司 渗透装置及方法
JP6592394B2 (ja) * 2016-04-21 2019-10-16 東京エレクトロン株式会社 プラズマ処理装置の保守方法
FR3055468B1 (fr) * 2016-08-30 2018-11-16 Semco Tech Dispositif de traitement de pieces
CN117810127A (zh) 2017-02-23 2024-04-02 株式会社国际电气 基板处理装置、半导体装置的制造方法、基板处理方法、容器及存储介质
US12289839B2 (en) 2021-05-18 2025-04-29 Mellanox Technologies, Ltd. Process for localized repair of graphene-coated lamination stacks and printed circuit boards
US12221695B2 (en) * 2021-05-18 2025-02-11 Mellanox Technologies, Ltd. CVD system with flange assembly for facilitating uniform and laminar flow
US12163228B2 (en) 2021-05-18 2024-12-10 Mellanox Technologies, Ltd. CVD system with substrate carrier and associated mechanisms for moving substrate therethrough

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4926793A (en) * 1986-12-15 1990-05-22 Shin-Etsu Handotai Co., Ltd. Method of forming thin film and apparatus therefor
US4976996A (en) * 1987-02-17 1990-12-11 Lam Research Corporation Chemical vapor deposition reactor and method of use thereof
US8043432B2 (en) * 2007-02-12 2011-10-25 Tokyo Electron Limited Atomic layer deposition systems and methods

Similar Documents

Publication Publication Date Title
JP2010073823A5 (enExample)
JP2010515821A5 (enExample)
KR101108879B1 (ko) 가스분사장치 및 이를 이용한 기판처리장치
CN103502504B (zh) 成膜装置
JP2011103495A5 (enExample)
JP2011100956A5 (enExample)
JP2010186904A5 (ja) 基板処理装置及び半導体装置の製造方法
JP2010515823A5 (enExample)
JP2012146939A5 (enExample)
JP2006303309A5 (enExample)
JP2009531549A5 (enExample)
JP2014072383A5 (enExample)
KR20230032000A (ko) Ald 코팅에 의한 목표 펌프의 내부 보호
JP2017007345A5 (enExample)
TWI402373B (zh) A CVD reactor that can replace the reaction chamber roof
EP2465972A3 (en) Method and system for thin film deposition
JP4321785B2 (ja) 成膜装置及び成膜方法
US20130239894A1 (en) Chemical vapor deposition apparatus
EP1674592A3 (en) Thin film processing system with different processing chambers
CN102978577A (zh) 中频磁控溅射镀膜装置
JP2008248311A5 (enExample)
TW201202463A (en) Full-enclosure, controlled-flow mini-environment for thin film chambers
CN101962754A (zh) 镀膜装置
CN102296284B (zh) 镀膜装置
TWI683027B (zh) 沉積奈米碳管之裝置