JP2010068001A - 集積電気光学モジュール - Google Patents
集積電気光学モジュール Download PDFInfo
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- JP2010068001A JP2010068001A JP2009284825A JP2009284825A JP2010068001A JP 2010068001 A JP2010068001 A JP 2010068001A JP 2009284825 A JP2009284825 A JP 2009284825A JP 2009284825 A JP2009284825 A JP 2009284825A JP 2010068001 A JP2010068001 A JP 2010068001A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02315—Support members, e.g. bases or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Semiconductor Lasers (AREA)
- Optical Integrated Circuits (AREA)
- Dicing (AREA)
- Optical Couplings Of Light Guides (AREA)
- Led Devices (AREA)
- Electroluminescent Light Sources (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
- Micromachines (AREA)
- Optical Communication System (AREA)
Abstract
【解決手段】本発明に係る集積電気光学モジュールは、第1の基板上に形成された電気光学能動部品と、第1の基板上に形成された接合パッドと、第2の基板上に形成された光学部品と、第1の基板と第2の基板の間に形成されたスペーサと、電気光学能動部品と光学部品の間に経路が形成され、電気光学能動部品が第1の基板、第2の基板およびスペーサにより包囲され、第1の基板および第2の基板は、これらの表面に対して垂直な方向においてスペーサを介して固定され、第1の基板は、少なくとも接合パッドが形成された領域において、第2の基板より長く延びていることを特徴とする。
【選択図】図2B
Description
Claims (5)
- 集積電気光学モジュールであって、
第1の基板(20)上に形成された電気光学能動部品(10)と、
第1の基板(20)上に形成された接合パッド(24)と、
第2の基板(30)上に形成された光学部品(40)と、
第1の基板(20)と第2の基板(30)の間に形成されたスペーサ(50)と、
電気光学能動部品(10)と光学部品(40)の間に経路(52)が形成され、
電気光学能動部品(10)が第1の基板(20)、第2の基板(30)およびスペーサ(50)により包囲され、
第1の基板(20)および第2の基板(30)は、これらの表面に対して垂直な方向においてスペーサ(50)を介して固定され、
第1の基板(20)は、少なくとも接合パッド(24)が形成された領域において、第2の基板(30)より長く延びていることを特徴とする集積電気光学モジュール。 - 第1の基板(20)上に形成された内部配線(22)を有し、
電気光学能動部品(10)は、内部配線(22)を介して接合パッド(24)に電気的に接続されることを特徴とする請求項1に記載の集積電気光学モジュール。 - 集積電気光学モジュールであって、
第1の基板(20)上に形成された電気光学能動部品(10)と、
第2の基板(30)上に形成された光学部品(40)と、
第2の基板(30)上に形成された接合パッド(124)と、
第1の基板(20)と第2の基板(30)の間に形成されたスペーサ(90)と、
電気光学能動部品(10)と光学部品(40)の間に経路(52)が形成され、
電気光学能動部品(10)が第1の基板(20)、第2の基板(30)およびスペーサ(50)により包囲され、
第1の基板(20)および第2の基板(30)は、これらの表面に対して垂直な方向においてスペーサ(90)を介して固定され、
第2の基板(30)は、少なくとも接合パッド(124)が形成された領域において、第1の基板(20)より長く延びていることを特徴とする集積電気光学モジュール。 - 第1の基板(20)、スペーサ(90)および第2の基板(30)の上に形成された内部配線(122)を有し、
電気光学能動部品(10)は、内部配線(122)を介して接合パッド(124)に電気的に接続されることを特徴とする請求項3に記載の集積電気光学モジュール。 - スペーサ(90)は半田ボールであり、
第1の基板(20)および第2の基板(30)の上に形成された金属被膜を有し、
電気光学能動部品(10)は、半田ボールおよび金属被膜を介して接合パッド(124)に電気的に接続されることを特徴とする請求項3に記載の集積電気光学モジュール。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US27332101P | 2001-03-06 | 2001-03-06 | |
US09/983,278 US6798931B2 (en) | 2001-03-06 | 2001-10-23 | Separating of optical integrated modules and structures formed thereby |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002570363A Division JP4474588B2 (ja) | 2001-03-06 | 2002-03-05 | 集積された光学モジュールの分断方法およびこれにより形成された構造物 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2010068001A true JP2010068001A (ja) | 2010-03-25 |
Family
ID=26956107
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002570363A Expired - Fee Related JP4474588B2 (ja) | 2001-03-06 | 2002-03-05 | 集積された光学モジュールの分断方法およびこれにより形成された構造物 |
JP2009284825A Pending JP2010068001A (ja) | 2001-03-06 | 2009-12-16 | 集積電気光学モジュール |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002570363A Expired - Fee Related JP4474588B2 (ja) | 2001-03-06 | 2002-03-05 | 集積された光学モジュールの分断方法およびこれにより形成された構造物 |
Country Status (9)
Country | Link |
---|---|
US (4) | US6798931B2 (ja) |
EP (1) | EP1415374B1 (ja) |
JP (2) | JP4474588B2 (ja) |
CN (1) | CN100440651C (ja) |
AT (1) | ATE341118T1 (ja) |
AU (1) | AU2002252197A1 (ja) |
CA (1) | CA2439010C (ja) |
DE (1) | DE60215019T2 (ja) |
WO (1) | WO2002071560A2 (ja) |
Families Citing this family (20)
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US6798931B2 (en) * | 2001-03-06 | 2004-09-28 | Digital Optics Corp. | Separating of optical integrated modules and structures formed thereby |
US7961989B2 (en) * | 2001-10-23 | 2011-06-14 | Tessera North America, Inc. | Optical chassis, camera having an optical chassis, and associated methods |
US7224856B2 (en) | 2001-10-23 | 2007-05-29 | Digital Optics Corporation | Wafer based optical chassis and associated methods |
WO2004068665A2 (en) * | 2003-01-24 | 2004-08-12 | The Board Of Trustees Of The University Of Arkansas Research And Sponsored Programs | Wafer scale packaging technique for sealed optical elements and sealed packages produced thereby |
EP1611468B1 (en) * | 2003-03-26 | 2008-05-21 | Digital Optics Corporation | Package for optoelectronic device on wafer level |
JP2007165789A (ja) * | 2005-12-16 | 2007-06-28 | Olympus Corp | 半導体装置の製造方法 |
US20070236591A1 (en) * | 2006-04-11 | 2007-10-11 | Tam Samuel W | Method for mounting protective covers over image capture devices and devices manufactured thereby |
US7278853B1 (en) | 2006-06-20 | 2007-10-09 | International Business Machines Corporation | Power card connection structure |
EP2087518A2 (en) * | 2006-11-17 | 2009-08-12 | Tessera North America | Internal noise reducing structures in camera systems employing an optics stack and associated methods |
US8456560B2 (en) * | 2007-01-26 | 2013-06-04 | Digitaloptics Corporation | Wafer level camera module and method of manufacture |
US8605208B2 (en) | 2007-04-24 | 2013-12-10 | Digitaloptics Corporation | Small form factor modules using wafer level optics with bottom cavity and flip-chip assembly |
US20090159200A1 (en) * | 2007-12-19 | 2009-06-25 | Heptagon Oy | Spacer element and method for manufacturing a spacer element |
US7710667B2 (en) * | 2008-06-25 | 2010-05-04 | Aptina Imaging Corp. | Imaging module with symmetrical lens system and method of manufacture |
US7773317B2 (en) * | 2008-07-01 | 2010-08-10 | Aptina Imaging Corp. | Lens system with symmetrical optics |
EP2261977A1 (en) * | 2009-06-08 | 2010-12-15 | STMicroelectronics (Grenoble) SAS | Camera module and its method of manufacturing |
US9419032B2 (en) | 2009-08-14 | 2016-08-16 | Nanchang O-Film Optoelectronics Technology Ltd | Wafer level camera module with molded housing and method of manufacturing |
CN102738013B (zh) * | 2011-04-13 | 2016-04-20 | 精材科技股份有限公司 | 晶片封装体及其制作方法 |
TW201417250A (zh) * | 2012-07-17 | 2014-05-01 | 海特根微光學公司 | 光學模組,特別是光電模組,及其製造方法 |
CN110663147A (zh) * | 2018-04-28 | 2020-01-07 | 深圳市大疆创新科技有限公司 | 激光二极管封装模块及发射装置、测距装置、电子设备 |
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2001
- 2001-10-23 US US09/983,278 patent/US6798931B2/en not_active Expired - Lifetime
-
2002
- 2002-03-05 JP JP2002570363A patent/JP4474588B2/ja not_active Expired - Fee Related
- 2002-03-05 WO PCT/US2002/006688 patent/WO2002071560A2/en active IP Right Grant
- 2002-03-05 US US10/087,989 patent/US6777311B2/en not_active Expired - Lifetime
- 2002-03-05 DE DE60215019T patent/DE60215019T2/de not_active Expired - Lifetime
- 2002-03-05 CN CNB02805993XA patent/CN100440651C/zh not_active Expired - Lifetime
- 2002-03-05 EP EP02721257A patent/EP1415374B1/en not_active Expired - Lifetime
- 2002-03-05 AU AU2002252197A patent/AU2002252197A1/en not_active Abandoned
- 2002-03-05 CA CA002439010A patent/CA2439010C/en not_active Expired - Lifetime
- 2002-03-05 AT AT02721257T patent/ATE341118T1/de not_active IP Right Cessation
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2004
- 2004-09-21 US US10/945,090 patent/US7208771B2/en not_active Expired - Lifetime
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2007
- 2007-04-23 US US11/790,029 patent/US20070200132A1/en not_active Abandoned
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Also Published As
Publication number | Publication date |
---|---|
CN1666391A (zh) | 2005-09-07 |
US20050035463A1 (en) | 2005-02-17 |
US6798931B2 (en) | 2004-09-28 |
CN100440651C (zh) | 2008-12-03 |
US7208771B2 (en) | 2007-04-24 |
ATE341118T1 (de) | 2006-10-15 |
CA2439010A1 (en) | 2002-09-12 |
US20070200132A1 (en) | 2007-08-30 |
JP4474588B2 (ja) | 2010-06-09 |
US20020126941A1 (en) | 2002-09-12 |
EP1415374A2 (en) | 2004-05-06 |
US6777311B2 (en) | 2004-08-17 |
US20020126940A1 (en) | 2002-09-12 |
CA2439010C (en) | 2009-10-27 |
EP1415374B1 (en) | 2006-09-27 |
DE60215019T2 (de) | 2007-04-05 |
AU2002252197A1 (en) | 2002-09-19 |
JP2004535660A (ja) | 2004-11-25 |
WO2002071560A2 (en) | 2002-09-12 |
WO2002071560A3 (en) | 2004-02-19 |
DE60215019D1 (de) | 2006-11-09 |
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