DE60215019D1 - Trennung von integrierten optischen modulen und strukturen - Google Patents

Trennung von integrierten optischen modulen und strukturen

Info

Publication number
DE60215019D1
DE60215019D1 DE60215019T DE60215019T DE60215019D1 DE 60215019 D1 DE60215019 D1 DE 60215019D1 DE 60215019 T DE60215019 T DE 60215019T DE 60215019 T DE60215019 T DE 60215019T DE 60215019 D1 DE60215019 D1 DE 60215019D1
Authority
DE
Germany
Prior art keywords
structures
separation
integrated optical
optical modules
optical element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60215019T
Other languages
English (en)
Other versions
DE60215019T2 (de
Inventor
D Kathman
Hongtao Han
Jay Mathews
Barnett Hammond
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DigitalOptics Corp East
Original Assignee
Tessera North America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tessera North America Inc filed Critical Tessera North America Inc
Publication of DE60215019D1 publication Critical patent/DE60215019D1/de
Application granted granted Critical
Publication of DE60215019T2 publication Critical patent/DE60215019T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Dicing (AREA)
  • Electroluminescent Light Sources (AREA)
  • Optical Communication System (AREA)
  • Micromachines (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
  • Led Devices (AREA)
DE60215019T 2001-03-06 2002-03-05 Trennung von integrierten optischen modulen und strukturen Expired - Lifetime DE60215019T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US27332101P 2001-03-06 2001-03-06
US273321P 2001-03-06
US09/983,278 US6798931B2 (en) 2001-03-06 2001-10-23 Separating of optical integrated modules and structures formed thereby
US983278 2001-10-23
PCT/US2002/006688 WO2002071560A2 (en) 2001-03-06 2002-03-05 Separating of optical integrated modules and structures formed thereby

Publications (2)

Publication Number Publication Date
DE60215019D1 true DE60215019D1 (de) 2006-11-09
DE60215019T2 DE60215019T2 (de) 2007-04-05

Family

ID=26956107

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60215019T Expired - Lifetime DE60215019T2 (de) 2001-03-06 2002-03-05 Trennung von integrierten optischen modulen und strukturen

Country Status (9)

Country Link
US (4) US6798931B2 (de)
EP (1) EP1415374B1 (de)
JP (2) JP4474588B2 (de)
CN (1) CN100440651C (de)
AT (1) ATE341118T1 (de)
AU (1) AU2002252197A1 (de)
CA (1) CA2439010C (de)
DE (1) DE60215019T2 (de)
WO (1) WO2002071560A2 (de)

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WO2004068665A2 (en) * 2003-01-24 2004-08-12 The Board Of Trustees Of The University Of Arkansas Research And Sponsored Programs Wafer scale packaging technique for sealed optical elements and sealed packages produced thereby
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US20070236591A1 (en) * 2006-04-11 2007-10-11 Tam Samuel W Method for mounting protective covers over image capture devices and devices manufactured thereby
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US8456560B2 (en) * 2007-01-26 2013-06-04 Digitaloptics Corporation Wafer level camera module and method of manufacture
CA2685080A1 (en) 2007-04-24 2008-11-06 Flextronics Ap Llc Small form factor modules using wafer level optics with bottom cavity and flip-chip assembly
US20090159200A1 (en) * 2007-12-19 2009-06-25 Heptagon Oy Spacer element and method for manufacturing a spacer element
US7710667B2 (en) * 2008-06-25 2010-05-04 Aptina Imaging Corp. Imaging module with symmetrical lens system and method of manufacture
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US9419032B2 (en) 2009-08-14 2016-08-16 Nanchang O-Film Optoelectronics Technology Ltd Wafer level camera module with molded housing and method of manufacturing
CN102738013B (zh) * 2011-04-13 2016-04-20 精材科技股份有限公司 晶片封装体及其制作方法
TW201417250A (zh) * 2012-07-17 2014-05-01 海特根微光學公司 光學模組，特別是光電模組，及其製造方法
WO2019205153A1 (zh) * 2018-04-28 2019-10-31 深圳市大疆创新科技有限公司 激光二极管封装模块及发射装置、测距装置、电子设备
EP4182747A1 (de) * 2020-07-20 2023-05-24 Apple Inc. Photonische integrierte schaltungen mit chipverbindungen mit gesteuertem kollaps

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Also Published As

Publication number Publication date
CA2439010A1 (en) 2002-09-12
US6777311B2 (en) 2004-08-17
US20020126940A1 (en) 2002-09-12
US6798931B2 (en) 2004-09-28
CA2439010C (en) 2009-10-27
CN100440651C (zh) 2008-12-03
WO2002071560A2 (en) 2002-09-12
US7208771B2 (en) 2007-04-24
WO2002071560A3 (en) 2004-02-19
EP1415374B1 (de) 2006-09-27
ATE341118T1 (de) 2006-10-15
EP1415374A2 (de) 2004-05-06
JP2004535660A (ja) 2004-11-25
CN1666391A (zh) 2005-09-07
JP2010068001A (ja) 2010-03-25
US20070200132A1 (en) 2007-08-30
AU2002252197A1 (en) 2002-09-19
US20020126941A1 (en) 2002-09-12
JP4474588B2 (ja) 2010-06-09
DE60215019T2 (de) 2007-04-05
US20050035463A1 (en) 2005-02-17

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Owner name: TESSERA NORTH AMERICA.INC.(N. D. GES. D. STAAT, US

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Representative=s name: PATENTANWAELTE VON KREISLER, SELTING, WERNER, 5066