JP2010067842A - 黒鉛一金属複合体とアルミニウム押出材の組合せからなる放熱体。 - Google Patents
黒鉛一金属複合体とアルミニウム押出材の組合せからなる放熱体。 Download PDFInfo
- Publication number
- JP2010067842A JP2010067842A JP2008233604A JP2008233604A JP2010067842A JP 2010067842 A JP2010067842 A JP 2010067842A JP 2008233604 A JP2008233604 A JP 2008233604A JP 2008233604 A JP2008233604 A JP 2008233604A JP 2010067842 A JP2010067842 A JP 2010067842A
- Authority
- JP
- Japan
- Prior art keywords
- graphite
- heat sink
- aluminum
- metal composite
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 36
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 36
- 239000000463 material Substances 0.000 title claims description 24
- 238000001125 extrusion Methods 0.000 title description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 37
- 239000002905 metal composite material Substances 0.000 claims description 37
- 229910002804 graphite Inorganic materials 0.000 claims description 31
- 239000010439 graphite Substances 0.000 claims description 31
- 229910000838 Al alloy Inorganic materials 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 239000000835 fiber Substances 0.000 claims description 5
- 238000005242 forging Methods 0.000 claims description 5
- 229910021383 artificial graphite Inorganic materials 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 238000009792 diffusion process Methods 0.000 abstract description 3
- 238000005266 casting Methods 0.000 description 3
- 238000009694 cold isostatic pressing Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000011156 metal matrix composite Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910021382 natural graphite Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C37/00—Cast-iron alloys
- C22C37/04—Cast-iron alloys containing spheroidal graphite
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
【解決手段】熱拡散率の良好な、黒鉛一金属複合体と放熱面積が大きいアルミニウムヒートシンクとの組合せにより、安価で、機械的強度にも優れ、尚かつ放熱効果の優れた放熱体を構成する。
【選択図】なし
Description
これにより、LEDパッケージ、高負荷半導体、高負荷コンデンサー、或いは集積回路基板から発生する熱は、黒鉛一金属複合体によって、効率良く熱拡散し、その熱は、丈夫なアルミニウム合金のヒートシンクによって、大きな表面積を持つフィン部から放熱される経済性にも優れた放熱体が提供される。
又、この時、黒鉛繊維のチョップドしたものを含んでいても良い。
より好ましくは65%〜95%である。
発熱体
2.
黒鉛金属複合体
3.
アルミニウム製ヒートシンク
Claims (4)
- 黒鉛粉末を50〜92体積%含む黒鉛成形体にアルミニウム、銅或いはそれらの合金を溶湯鍛造法により加圧含浸させて、得られた黒鉛一金属複合体を板状に切り出しアルミニウム、又はアルミニウム合金の押出材などからなるヒートシンクの平面部又は曲面部の箇所に接触させてなる放熱体。
- 請求項1で黒鉛粉末の代わりに黒鉛のチョップドした繊維と人造黒鉛と併せて50〜92体積%含む成形体であること。
- 請求項1で黒鉛一金属複合体を円柱状又は角柱状に切り出し、ヒートシンクのフィンが放射状に配列されてなるヒートシンクの中央部に配置して、円柱又は角柱の側面が、ヒートシンクに接することよりなる放熱体。
- 請求項1、請求項2、請求項3に使用される黒鉛が、押出成形体、冷間等方圧力成形体、金型にて一方向圧力による成形体のいずれかによるものであること。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008233604A JP5335339B2 (ja) | 2008-09-11 | 2008-09-11 | 黒鉛一金属複合体とアルミニウム押出材の組合せからなる放熱体。 |
EP08876944A EP2324074A4 (en) | 2008-09-11 | 2008-12-29 | HEAT BEAM FROM A COMBINATION OF A GRAPHITE METAL COMPLEX AND AN EXTRUDED ALUMINUM MATERIAL |
PCT/US2008/088461 WO2010030307A1 (en) | 2008-09-11 | 2008-12-29 | A heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material |
KR1020117008073A KR20110085978A (ko) | 2008-09-11 | 2008-12-29 | 흑연 금속 복합재와 알루미늄 압출재의 조합으로 구성된 방열체 |
US13/063,568 US20110259570A1 (en) | 2008-09-11 | 2008-12-29 | Heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008233604A JP5335339B2 (ja) | 2008-09-11 | 2008-09-11 | 黒鉛一金属複合体とアルミニウム押出材の組合せからなる放熱体。 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010067842A true JP2010067842A (ja) | 2010-03-25 |
JP5335339B2 JP5335339B2 (ja) | 2013-11-06 |
Family
ID=42005380
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008233604A Expired - Fee Related JP5335339B2 (ja) | 2008-09-11 | 2008-09-11 | 黒鉛一金属複合体とアルミニウム押出材の組合せからなる放熱体。 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20110259570A1 (ja) |
EP (1) | EP2324074A4 (ja) |
JP (1) | JP5335339B2 (ja) |
KR (1) | KR20110085978A (ja) |
WO (1) | WO2010030307A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012028110A (ja) * | 2010-07-22 | 2012-02-09 | Rohm Co Ltd | Led電球およびled電球の製造方法 |
WO2014038459A1 (ja) | 2012-09-04 | 2014-03-13 | 東洋炭素株式会社 | 金属-炭素複合材、金属-炭素複合材の製造方法及び摺動部材 |
JP2014133686A (ja) * | 2013-01-11 | 2014-07-24 | Hiroshima Prefecture | 炭素基金属複合材料の製造方法 |
WO2017162217A1 (zh) * | 2016-03-25 | 2017-09-28 | 华为技术有限公司 | 一种电子设备中框配件及其制造方法 |
JPWO2021125196A1 (ja) * | 2019-12-17 | 2021-06-24 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110027603A1 (en) * | 2008-12-03 | 2011-02-03 | Applied Nanotech, Inc. | Enhancing Thermal Properties of Carbon Aluminum Composites |
US20110147647A1 (en) * | 2009-06-05 | 2011-06-23 | Applied Nanotech, Inc. | Carbon-containing matrix with additive that is not a metal |
US20100310447A1 (en) * | 2009-06-05 | 2010-12-09 | Applied Nanotech, Inc. | Carbon-containing matrix with functionalized pores |
CN102114495A (zh) * | 2010-11-25 | 2011-07-06 | 深圳市天电光电科技有限公司 | Led散热器制造方法 |
WO2012100022A2 (en) * | 2011-01-19 | 2012-07-26 | Graftech International Holdings Inc. | Thermal solution for led bulbs |
DE102011081687A1 (de) * | 2011-08-26 | 2013-02-28 | Robert Bosch Gmbh | Halbleiterbauelement mit einem Kühlkörper |
US10914539B2 (en) | 2013-05-15 | 2021-02-09 | Osram Sylvania Inc. | Two piece aluminum heat sink |
KR101301624B1 (ko) * | 2013-07-05 | 2013-08-29 | (주) 동양에이.케이코리아 | 카본이 함유된 알루미늄 또는 알루미늄 합금 압출재의 제조방법 및 이를 이용한 카본이 함유된 알루미늄 또는 알루미늄 합금 압출재 |
CN106531874B (zh) * | 2016-11-30 | 2018-10-12 | 南京劲峰洋光电科技有限公司 | 一种新型散热绝缘复合材料及其制备方法 |
CN107022690B (zh) * | 2017-05-03 | 2019-03-08 | 合肥工业大学 | 一种通过压力浸渗铝合金制备铝/碳基复合材料的方法 |
KR102298678B1 (ko) * | 2020-04-22 | 2021-09-07 | 부경대학교 산학협력단 | 전기 자동차의 파워트레인용 냉각 파이프의 제조방법 및 이에 의해 제조된 냉각 파이프 |
WO2023175820A1 (ja) | 2022-03-17 | 2023-09-21 | 三菱電機株式会社 | 半導体装置の製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002184922A (ja) * | 2000-12-12 | 2002-06-28 | Ntt Advanced Technology Corp | 複合型放熱部材 |
JP2005002470A (ja) * | 2003-05-16 | 2005-01-06 | Hitachi Metals Ltd | 高熱伝導・低熱膨張複合材及び放熱基板並びにこれらの製造方法 |
JP2006114567A (ja) * | 2004-10-12 | 2006-04-27 | Furukawa Electric Co Ltd:The | フィンを備えたヒートシンクおよびその製造方法 |
JP2007150268A (ja) * | 2005-10-31 | 2007-06-14 | Toyoda Gosei Co Ltd | 発光装置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5146981A (en) * | 1991-11-14 | 1992-09-15 | Digital Equipment Corporation | Substrate to heatsink interface apparatus and method |
US5520976A (en) * | 1993-06-30 | 1996-05-28 | Simmonds Precision Products Inc. | Composite enclosure for electronic hardware |
US6009938A (en) * | 1997-12-11 | 2000-01-04 | Eastman Kodak Company | Extruded, tiered high fin density heat sinks and method of manufacture |
US6680015B2 (en) * | 2000-02-01 | 2004-01-20 | Cool Options, Inc. | Method of manufacturing a heat sink assembly with overmolded carbon matrix |
EP1187199A2 (de) * | 2000-08-28 | 2002-03-13 | Alcan Technology & Management AG | Kühlkörper für Halbleiterbauelemente, Verfahren zu seiner Herstellung sowie Formwerkzeug dafür |
US20030024611A1 (en) * | 2001-05-15 | 2003-02-06 | Cornie James A. | Discontinuous carbon fiber reinforced metal matrix composite |
US6691768B2 (en) * | 2001-06-25 | 2004-02-17 | Sun Microsystems, Inc. | Heatsink design for uniform heat dissipation |
US6758263B2 (en) * | 2001-12-13 | 2004-07-06 | Advanced Energy Technology Inc. | Heat dissipating component using high conducting inserts |
ATE416858T1 (de) * | 2001-12-19 | 2008-12-15 | Showa Denko Kk | Extrusionswerkzeug und verfahren zur herstellung von formkörper mit rippen und kühlkörper |
US20030131970A1 (en) * | 2002-01-17 | 2003-07-17 | Carter Daniel P. | Heat sinks and method of formation |
AU2003284065A1 (en) * | 2002-10-11 | 2005-05-05 | Chien-Min Sung | Carbonaceous heat spreader and associated methods |
US20050189647A1 (en) * | 2002-10-11 | 2005-09-01 | Chien-Min Sung | Carbonaceous composite heat spreader and associated methods |
US20040190245A1 (en) * | 2003-03-31 | 2004-09-30 | Murli Tirumala | Radial heat sink with skived-shaped fin and methods of making same |
US6779593B1 (en) * | 2003-04-30 | 2004-08-24 | Hewlett-Packard Development Company, L.P. | High performance cooling device with heat spreader |
EP1477467B1 (en) * | 2003-05-16 | 2012-05-23 | Hitachi Metals, Ltd. | Composite material having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate |
US20050238835A1 (en) * | 2004-04-24 | 2005-10-27 | Chien-Min Sung | Graphite composite thermal sealants and associated methods |
US20080073070A1 (en) * | 2006-09-26 | 2008-03-27 | Chin-Hu Kuo | Highly efficient heat dissipating composite material and a heat dissipating device made of such material |
US20080128067A1 (en) * | 2006-10-08 | 2008-06-05 | Momentive Performance Materials Inc. | Heat transfer composite, associated device and method |
US20080085403A1 (en) * | 2006-10-08 | 2008-04-10 | General Electric Company | Heat transfer composite, associated device and method |
-
2008
- 2008-09-11 JP JP2008233604A patent/JP5335339B2/ja not_active Expired - Fee Related
- 2008-12-29 US US13/063,568 patent/US20110259570A1/en not_active Abandoned
- 2008-12-29 KR KR1020117008073A patent/KR20110085978A/ko not_active Application Discontinuation
- 2008-12-29 EP EP08876944A patent/EP2324074A4/en not_active Withdrawn
- 2008-12-29 WO PCT/US2008/088461 patent/WO2010030307A1/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002184922A (ja) * | 2000-12-12 | 2002-06-28 | Ntt Advanced Technology Corp | 複合型放熱部材 |
JP2005002470A (ja) * | 2003-05-16 | 2005-01-06 | Hitachi Metals Ltd | 高熱伝導・低熱膨張複合材及び放熱基板並びにこれらの製造方法 |
JP2006114567A (ja) * | 2004-10-12 | 2006-04-27 | Furukawa Electric Co Ltd:The | フィンを備えたヒートシンクおよびその製造方法 |
JP2007150268A (ja) * | 2005-10-31 | 2007-06-14 | Toyoda Gosei Co Ltd | 発光装置 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012028110A (ja) * | 2010-07-22 | 2012-02-09 | Rohm Co Ltd | Led電球およびled電球の製造方法 |
WO2014038459A1 (ja) | 2012-09-04 | 2014-03-13 | 東洋炭素株式会社 | 金属-炭素複合材、金属-炭素複合材の製造方法及び摺動部材 |
JP2014133686A (ja) * | 2013-01-11 | 2014-07-24 | Hiroshima Prefecture | 炭素基金属複合材料の製造方法 |
WO2017162217A1 (zh) * | 2016-03-25 | 2017-09-28 | 华为技术有限公司 | 一种电子设备中框配件及其制造方法 |
JPWO2021125196A1 (ja) * | 2019-12-17 | 2021-06-24 | ||
WO2021125196A1 (ja) * | 2019-12-17 | 2021-06-24 | 宇部興産株式会社 | 黒鉛-銅複合材料、それを用いたヒートシンク部材、および黒鉛-銅複合材料の製造方法 |
JP7165341B2 (ja) | 2019-12-17 | 2022-11-04 | Ube株式会社 | 黒鉛-銅複合材料、それを用いたヒートシンク部材、および黒鉛-銅複合材料の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2324074A1 (en) | 2011-05-25 |
JP5335339B2 (ja) | 2013-11-06 |
US20110259570A1 (en) | 2011-10-27 |
WO2010030307A1 (en) | 2010-03-18 |
EP2324074A4 (en) | 2012-06-13 |
KR20110085978A (ko) | 2011-07-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5335339B2 (ja) | 黒鉛一金属複合体とアルミニウム押出材の組合せからなる放熱体。 | |
JP4348565B2 (ja) | 高熱伝導・低熱膨張複合材及び放熱基板 | |
JP4344934B2 (ja) | 高熱伝導・低熱膨張複合材及び放熱基板並びにこれらの製造方法 | |
US20070053166A1 (en) | Heat dissipation device and composite material with high thermal conductivity | |
JP2006001232A (ja) | 高熱伝導・低熱膨脹複合体およびその製造方法 | |
US20070102147A1 (en) | Heat dissipation apparatus and method for manufacturing the same | |
EP2516924A1 (en) | Making method for cooling body, cooling body and lighting device comprising the cooling body | |
JP2011100672A (ja) | ヒートシンク | |
JP2002066724A (ja) | 複合材及びその製造方法 | |
JPS63140753A (ja) | 多孔型放熱体の製造方法 | |
JP4223730B2 (ja) | ヒートシンク板 | |
JP3662221B2 (ja) | 放熱部品 | |
JP2005077052A (ja) | 平面型ヒートパイプ | |
JP5467782B2 (ja) | 電気絶縁性を有する放熱基板の製造方法 | |
JP2005005528A (ja) | 半導体素子搭載用モジュール | |
JP2012151425A (ja) | 積層型ヒートシンク | |
JP2010029919A (ja) | アルミニウム−黒鉛質複合体、それを用いた回路基板及びその製造方法 | |
JP4067165B2 (ja) | 複合体とそれを用いたヒートシンク | |
JP2002235126A (ja) | 複合材料の製造方法 | |
JP2004055577A (ja) | アルミニウム−炭化珪素質板状複合体 | |
JP2005136369A (ja) | 基板 | |
CN1565774A (zh) | 一种适用于散热器底板的异质金属压铸方法 | |
JP2001288526A (ja) | 放熱材料とその製造方法 | |
JP2007019285A (ja) | 可撓性を有するヒートシンク板 | |
JP4718589B2 (ja) | マグネシウム合金複合式放熱金属 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110906 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20110906 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20121009 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20121016 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121217 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130205 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130401 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130430 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130604 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130716 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130731 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R314533 |
|
S804 | Written request for registration of cancellation of exclusive licence |
Free format text: JAPANESE INTERMEDIATE CODE: R314805 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |